BAS19 RFG

BAS19 / BAS20 Taiwan Semiconductor Small Signal Product Surface Mount Fast Switching Diode FEATURES - Fast switching speed - Surface mount device type - High conductance - For general purpose switching applications - Packing code with suffix "G" means green compound (halogen-free) SOT-23 MECHANICAL DATA - Case: SOT-23 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Weight: 8 ± 0.5 mg - BAS19 Marking Code: JP - BAS20 Marking Code: JR MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER Working Peak Reverse Voltage DC Blocking Voltage SYMBOL BAS19 BAS20 VRM 100 150 Average Rectifier Output Current IO 200 Power Dissipation PD 250 Thermal Resistance Junction to Ambient Air RθJA 500 Operating and Storage Temperature Range TJ, TSTG -65 to +150 UNIT V mA mW o C/W o C Electrical Characteristics PARAMETER Reverse Breakdown Voltage Peak Reverse Current Forward Voltage Junction Capacitance Reverse Recovery Time Document Number: DS_S1412038 SYMBOL BAS19 IR = 100 μA BAS20 IR = 100 μA BAS19 VR = 100 V VR(BR) MIN 100 150 MAX UNIT - V 0.1 μA IR - VF - VR = 0 V , f = 1.0 MHz CJ - 5 pF IF = IR = 30 mA , IRR = 0.1 × IR trr - 50.0 ns BAS20 VR = 150 V IF = 100 mA IF = 200 mA 1.0 1.25 V Version: B14 BAS19 / BAS20 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Leakage Current VS. Junction temperature Fig. 1 Forward Characteristics 100 IR, Leakage Current (μA) IF , Instantaneous Forward Current (mA) 1000 100 10 1 10 1 0.1 0.1 0.01 0.01 0 1 VF , Instantaneous Forward Voltage (V) Document Number: DS_S1412038 2 0 100 Tj, Junction Temperature 200 (o C) Version: B14 BAS19 / BAS20 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING PACKING CODE SUFFIX (Note 2) CODE SUFFIX PART NO. BASxx (Note 1) -xx RF G R5 PACKAGE PACKING 3K / 7" Reel SOT-23 10K / 13" Reel Note 1: "xx" is Device Code from "19" thru "20". Note 2: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PREFERRED P/N PART NO. PART NO. SUFFIX BAS19 RF BAS19 RF BAS19 RFG BAS19 RF BAS19-B0 RFG BAS19 -B0 PACKING CODE PACKING CODE SUFFIX DESCRIPTION Multiple manufacture source RF G Multiple manufacture source Green compound G Defined manufacture source Green compound PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF Unit (mm) Unit (inch) Typ. Typ. SUGGEST PAD LAYOUT DIM. Document Number: DS_S1412038 Z 2.8 0.110 X 0.7 0.028 Y 0.9 0.035 C 1.9 0.075 E 1.0 0.039 Version: B14 BAS19 / BAS20 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412038 Version: B14