BAV70 RFG

BAW56, BAV70, BAV99 Taiwan Semiconductor Small Signal Product 225mW SMD Switching Diode FEATURES - Fast switching speed - Surface mount device type - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Pb free and RoHS compliant - Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code MECHANICAL DATA SOT-23 - Case: SOT-23 small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260oC/10s - Weight: 0.008grams (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT PD 225 mW Peak repetitive reverse voltage VRRM 70 V Repetitive peak forward current IFRM 450 mA IO 200 mA Power dissipation Mean forward current Pulse Width=1 sec Non-repetitive peak forward surge current Pulse Width=1 µsec Thermal resistance form junction to ambient Junction and storage temperature range PARAMETER IR = 100 µA Reverse breakdown voltage IF = 50 mA Forward voltage IF = 150 mA VR = 70 V Reverse leakage current VR = 0 V, f = 1 MHz Junction capacitance Reverse revovery time BAW56, BAV70 BAV99 IF = IR = 10 mA, RL = 100 Ω, IRR = 1 mA Document Number: DS_S1404011 0.5 IFSM A 2 RθJA 556 TJ , TSTG - 55 to + 150 o C/W o C SYMBOL MIN MAX UNIT V(BR) 70 - V - 1.00 - 1.25 - 2.50 µA - 2 pF - 1.5 pF - 6 ns VF IR CJ trr V Version: H14 BAW56, BAV70, BAV99 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 2 Leakage Current VS. Junction Temperature Fig. 1 Typucal Forward Characteristics 10000 100 REVERSE CURRENT (nA) Instantaneous Forward Current (mA) 1000 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 VR=20V Typical 1000 100 10 1 0 20 40 60 80 100 120 140 160 180 200 Junction Temperature (oC) Instantaneous Forward Voltage(V) Fig. 3 Power Dissipation Derating Curve Power Dissipation (mW) 250 200 150 100 50 0 0 25 50 75 100 125 150 Ambient Temperature (oC) Document Number: DS_S1404011 Version: H14 BAW56, BAV70, BAV99 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION GREEN PART NO. MANUFACTURE PACKING CODE CODE COMPOUND PACKAGE PACKING MARKING CODE BAW56 RF SOT-23 3K / 7" Reel A1 BAV70 RF SOT-23 3K / 7" Reel A4 RF SOT-23 3K / 7" Reel A7 BAV99 (Note) BAW56 RF G SOT-23 3K / 7" Reel A1 BAV70 RF G SOT-23 3K / 7" Reel A4 BAV99 RF G SOT-23 3K / 7" Reel A7 Note: Manufacture special control, if empty means no special control requirement. EXAMPLE GREEN MANUFACTURE PREFERRED P/N PACKING CODE PART NO. COMPOUND DESCRIPTION CODE CODE BAV99 RF BAV99 RF BAV99-B0 RF BAV99 B0 RF BAV99-D0 RF BAV99 D0 RF BAV99 RFG BAV99 BAV99-B0 RFG BAV99 BAV99-D0 RFG BAV99 Document Number: DS_S1404011 RF G Green compound B0 RF G Green compound D0 RF G Green compound Version: H14 BAW56, BAV70, BAV99 Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS Unit (mm) Unit (inch) DIM. Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.1 REF 0.004 REF Unit (mm) Unit (inch) Z Typ. 2.9 Typ. 0.114 X 0.8 0.031 Y 0.9 0.035 C 2.0 0.079 E 1.35 0.053 SUGGEST PAD LAYOUT DIM. Pin Configuration Document Number: DS_S1404011 Version: H14