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TSP10H45S S1G

TSP10H45S S1G

  • 厂商:

    TAIWANSEMICONDUCTOR(台半)

  • 封装:

    TO277

  • 描述:

    DIODE SCHOTTKY 45V 10A TO277A

  • 数据手册
  • 价格&库存
TSP10H45S S1G 数据手册
TSP10H45S – TSP10H60S Taiwan Semiconductor 10A, 45V - 60V Trench Schottky Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● ● KEY PARAMETERS Patented Trench Schottky technology Excellent high temperature stability Low forward voltage Low power loss / high efficiency High forward surge capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 10 A VRRM 45 - 60 V IFSM 180 A TJ MAX 150 °C Package TO-277A (SMPC) Configuration Single die APPLICATIONS ● Switching mode power supply (SMPS) ● Adapters ● DC to DC converter MECHANICAL DATA ● ● ● ● ● ● Case: TO-277A (SMPC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.095g (approximately) TO-277A (SMPC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device TSP10H45S TSP10H60S 10H45 10H60 UNIT Repetitive peak reverse voltage VRRM 45 60 V Reverse voltage, total rms value VR(RMS) 31 42 V Forward current Surge peak forward current, 8.3ms single half sine wave superimposed on rated load Junction temperature IF 10 A IFSM 180 A TJ -55 to +150 °C Storage temperature TSTG -55 to +150 °C 1 Version: E2103 TSP10H45S – TSP10H60S Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT RӨJL 10 °C/W Junction-to-lead thermal resistance ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TSP10H45S TSP10H60S IF = 5A, TJ = 25°C TSP10H45S Forward voltage TSP10H60S (1) IF = 10A, TJ = 25°C VF TSP10H45S TSP10H60S IF = 5A, TJ = 125°C TSP10H45S TSP10H60S Reverse current @ rated VR (2) IF = 10A, TJ = 125°C TJ = 25°C IR TJ = 125°C TYP MAX UNIT 0.44 - V 0.45 - V 0.48 0.57 V 0.52 0.64 V 0.34 - V 0.36 - V 0.41 0.50 V 0.46 0.63 V - 150 µA - 25 mA Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING TSP10HxS TO-277A (SMPC) 6,000 / Tape & Reel Notes: 1. “x” defines voltage from 45V(TSP10H45S) to 60V(TSP10H60S) 2 Version: E2103 TSP10H45S – TSP10H60S Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 10000 10 CAPACITANCE (pF) 8 6 4 1000 2 0 50 75 100 125 100 150 0.1 1 LEAD TEMPERATURE (°C) 100 TJ=150°C 10 TJ=125°C 1 TJ=100°C 0.1 0.01 TJ=25°C 0.001 10 20 30 40 50 60 70 80 90 100 100 10 TSP10H45S 10 TJ=150°C UF1DLW 1 TJ=125°C TJ=125°C 0.1 TJ=25°C 0.01 Pulse width 300μs 1% duty cycle Pulse width 0.1 0.001 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.3 0.4 0.5 0.6 0.7 0.8 0.9 INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (mA) TJ=150°C 10 TJ=125°C TJ=100°C 0.1 0.01 TJ=25°C 10 20 30 40 50 60 70 80 90 1.1 1.2 1.1 1.2 Fig.6 Typical Forward Characteristics 100 0.001 0.8 1 FORWARD VOLTAGE (V) Fig.5 Typical Reverse Characteristics 1 TJ=25°C TJ=100°C 1 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) TSP10H60S 100 Fig.4 Typical Forward Characteristics INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (mA) Fig.3 Typical Reverse Characteristics TSP10H45S 10 REVERSE VOLTAGE (V) (A) 25 f=1.0MHz Vsig=50mVp-p 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 100 10 10 TSP10H60S UF1DLW TJ=150°C 1 TJ=125°C TJ=125°C 0.1 TJ=100°C 1 TJ=25°C 0.01 0.1 0.001 0.0 TJ=25°C (A) AVERAGE FORWARD CURRENT (A) 12 Pulse width 300μs 1% duty cycle Pulse width 0.3 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.4 0.5 0.6 0.7 0.8 0.9 0.8 1 FORWARD VOLTAGE (V) 3 Version: E2103 TSP10H45S – TSP10H60S Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.7 Maximum Non-Repetitive Forward Surge Current PEAK FORWARD SURGE CURRENT (A) 210 180 8.3ms single half sine wave 150 120 90 60 30 0 1 10 100 NUMBER OF CYCLES AT 60 Hz 4 Version: E2103 TSP10H45S – TSP10H60S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) SUGGESTED PAD LAYOUT MARKING DIAGRAM P/N YW F 5 = Marking Code = Date Code = Factory Code Version: E2103 TSP10H45S – TSP10H60S Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 6 Version: E2103
TSP10H45S S1G 价格&库存

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