SICR10650
SICRF10650
Technical Data
Data Sheet N1942, Rev.A
SICR10650 SICRF10650
650V SIC POWER SCHOTTKY RECTIFIER
Features
Description
SICR10650/ SICRF10650 are all single SiC Schottky
rectifiers packaged in TO-220AC, ITO-220AC case. The
device is a high voltage Schottky rectifier that has very
low total conduction losses and very stable switching
characteristics over temperature extremes. The
SICR12600/ SICRF12600 are ideal for energy sensitive,
high frequency applications in challenging
environments.
Applications
175°C TJ operation
Ultra-low switching loss
Switching speeds independent of operating
temperature
Low total conduction losses
High forward surge current capability
High package isolation voltage
Guard ring for enhanced ruggedness and long term
reliability
Pb − Free Device
All SMC parts are traceable to the wafer lot
Additional electrical and life testing can be performed
upon request
Alternative energy inverters
Power Factor Correction (PFC)
Free-Wheeling diodes
Switching supply output rectification
Reverse polarity protection
SICR10650
SICRF10650
TO-220AC
ITO-220AC
Maximum Ratings:
Characteristics
Symbol
Condition
Max.
Units
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
-
650
V
Average Rectified Forward Current
IF (AV)
50% duty cycle @Tc=150°C,
rectangular wave form
10
A
Peak One Cycle Non-Repetitive Surge
Current
IFSM
8.3ms, Half Sine pulse, TC = 25 C
110
A
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SICR10650
SICRF10650
Technical Data
Data Sheet N1942, Rev.A
Electrical Characteristics:
Characteristics
Forward Voltage Drop*
Reverse Current at DC condition*
Reverse Current *
Symbol
VF1
VF2
IR1
IR2
Junction Capacitance
Voltage Rate of Change
* Pulse width < 300 µs, duty cycle < 2%
CT
dv/dt
Condition
Typ.
Max.
Units
@ 10A, Pulse, TJ = 25 C
1.51
1.7
V
@ 10A, Pulse, TJ = 175 C
@VR = rated VR
TJ = 25 C
@VR = rated VR
TJ = 175 C
@VR = 0V, TC = 25 C, fSIG = 1MHz
@VR = 200V, TC = 25 C, fSIG = 1MHz
@VR = 400V, TC = 25 C, fSIG = 1MHz
-
1.75
2.5
V
25
100
A
32
200
A
695
73
70
-
740
78
75
10,000
pF
V/s
Thermal-Mechanical Specifications:
Characteristics
Junction Temperature
Storage Temperature
Typical Thermal Resistance Junction to
Case
Approximate Weight
Case Style
Tube Specification
Symbol
Condition
Specification
Units
TJ
Tstg
RJC
-
-55 to +175
-55 to +175
C
C
1.36
C/W
1.8
g
wt
DC operation
-
TO-220AC
Marking Diagram
Where XXXXX is YYWWL
SICR
F
10
650
SSG
YY
WW
L
= Device Type
= Package type
= Forward Current (10A)
= Reverse Voltage (650V)
= SSG
= Year
= Week
= Lot Number
Cautions:Molding resin
Epoxy resin UL:94V-0
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SICR10650
SICRF10650
Technical Data
Data Sheet N1942, Rev.A
Ratings and Characteristics Curves
Fig.1-Typical Forward Voltage Characteristics
Fig.3-Forward Current Derating Curve
Fig.2-Typical Reverse Characteristics
Fig.4-Typical Junction Capacitance
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SICR10650
SICRF10650
Technical Data
Data Sheet N1942, Rev.A
Mechanical Dimensions TO-220AC
Symbol
A
A1
A2
b
b1
c
D
D1
E
E1
e1
H1
L
L1
ΦP
Q
Θ1
Θ2
Θ3
Dimensions in millimeters
Min.
4.40
1.17
2.40
0.61
1.17
0.31
14.64
8.50
10.00
9.98
4.95
6.04
13.00
3.50
3.74
2.54
Typical
4.70
1.27
2.69
0.81
1.27
0.38
14.94
8.07
10.16
10.18
5.08
6.24
13.86
3.80
3.84
2.74
5°
4°
4°
Max.
4.85
1.37
2.89
0.96
1.37
0.70
15.75
8.90
10.40
10.38
5.18
6.60
14.08
3.96
4.04
2.95
Ordering Information
]
Device
SICR10650
Package
TO-220AC
Plating
Pure Sn
Weight
1.8g
Shipping
50pcs / tube
SICRF10650
ITO-220AC
Pure Sn
1.8g
50pcs / tube
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging
specification.
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Technical Data
Data Sheet N1942, Rev.A
SICR10650
SICRF10650
DISCLAIMER:
1- The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product
characteristics. Before ordering, purchasers are advised to contact the SMC - Sangdest Microelectronics (Nanjing) Co., Ltd sales
department for the latest version of the datasheet(s).
2- In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment,
medical equipment , and safety equipment) , safety should be ensured by using semiconductor devices that feature assured safety or by
means of users’ fail-safe precautions or other arrangement .
3- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any damages that may result from an accident or any
other cause during operation of the user’s units according to the datasheet(s). SMC - Sangdest Microelectronics (Nanjing) Co., Ltd
assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information,
products or circuits described in the datasheets.
4- In no event shall SMC - Sangdest Microelectronics (Nanjing) Co., Ltd be liable for any failure in a semiconductor device or any
secondary damage resulting from use at a value exceeding the absolute maximum rating.
5- No license is granted by the datasheet(s) under any patents or other rights of any third party or SMC - Sangdest Microelectronics
(Nanjing) Co., Ltd.
6- The datasheet(s) may not be reproduced or duplicated, in any form, in whole or part, without the expressed written permission of SMC Sangdest Microelectronics (Nanjing) Co., Ltd.
7- The products (technologies) described in the datasheet(s) are not to be provided to any party whose purpose in their application will
hinder maintenance of international peace and safety nor are they to be applied to that purpose by their direct purchasers or any third party.
When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations..
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