PART CODE:
XM16M00000S026
SPECIFICATION SHEET
SPECIFICATION SHEET NO.
N0207-XM16M00000S026
DATE
Feb. 07, 2021
REVISION
A0
DESCRIPITION
SMD Crystal, 49SMD Type, L11.4*W4.7*H4.0mm, 2 pads,
16.000MHz, +/-50ppm, CL 20pF, Stability +/-50ppm @Operating Temp.
Range -40°C ~+85°C, ESR 60 ohm Max, Tape/Reel,
Reflow Profile Condition 260 °C Max.
RoHS/RoHS III compliant
CUSTOMER
CUSTOMER PART NUMBER
CROSS REF. PART NUMBER
ORIGINAL PART NUMBER
TGS CSM2 16M0A50-20-50-40-60TLF
PART CODE
XM16M00000S026
VENDOR APPROVE
Issued/Checked/Approved
DATE: Feb. 07, 2021
CUSTOMER APPROVE
DATE:
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XM16M00000S026
SMD CRYSTAL 49SMD TYPE 2 PADS
MAIN FEATURE
• SMD Crystal, 49SMD Type, L11.4*W4.7*H4.0mm, 2 pads
• Low cost, High precision, High frequency stability
• Reflow Profile Condition 260 °C Max.
• Wide Frequency Range
• Cross more competitors part
• RoHS/RoHS III compliant
APPLICATION
• Bluetooth, wireless communication set
• Communication Electronics
RFQ
PART CODE GUIDE
Request For Quotation
XM
16M00000
S
026
1
2
3
4
1) XM: Part family Code for SMD Crystal, 49SMD Type, L11.4*W4.7*H4.0mm, 2 pads (CSM2)
2) 16M00000: Frequency range code for 16.000MHz
3) S: SMD type, Package Tape/Reel, 1000pcs/Reel
4) 026: Specification code for original part No.: TGS CSM2 16M0A50-20-50-40-60TLF
MORE FREQUENCY RANGE AVAILABLE (MHz)
3.579545
3.6864
4.0000
4.09600
4.194304
6.0000
7.3728
8.00000
9.8304
10.000
11.0592
12.000
12.288
14.31818
13.5600
`16.0000
18.432
19.200
20.000
22.1184
24.000
25.0000
26.000
27.0000
32.0000
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XM16M00000S026
SMD CRYSTAL 49SMD TYPE 2 PADS
DIMENSION (Unit: mm, Tol. +/-0.15mm)
Image for reference
Marking
Line 1: Company Code + CL value
Line 2: Freq. Range+ QC Code (A~Z)
CSM2
H: 4.0
Recommend Pad Layout
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XM16M00000S026
SMD CRYSTAL 49SMD TYPE 2 PADS
ELECTRICAL PARAMETERS
Parameter
Part No.
Symbol
Units
Value
Min.
Original Manufacturer
Typical
Condition
Max.
TGS
TGS Crystals
Holder Type
CSM2
SMD Crystal, 49SMD Type, L11.4*W4.7*H4.0mm, 2 pads
Frequency Range
16M0
MHz
16.0
Mode of Oscillation
A
Frequency Tolerance
50
ppm
Load Capacitance
-20
pF
Stability over
Operation Temperance
-50
ppm
-50
+50
Operation Temperance
-40
°C
-40
+85
°C
-40
+85
Storage Temperance
Equivalent Series
Resistance (ESR)
-60
AT Fundamental
-50
+50
20
Ω
60
Drive Level
μW
100
Shunt Capacitance (C0)
pF
Motional Capacitance
(C1)
fF
N/A
DLD2
Ω
N/A
FLD2
ppm
N/A
RDL2
Ω
N/A
SPDB
dB
N/A
Aging
ppm/year
Insulation Resistance
Others
MΩ
@25°C
0
7.0
±3
500
@1st year
@100VDC
± 15VDC
Package
T
Tape/Reel
RoHS Status
LF
RoHS III compliant
Add Value
N/A
Internal
Control
Code *
N/A
Note: 1) Original Part Number: TGS CSM2 16M0A50-20-50-40-60TLF
2) * Internal Control Code- 2 letter or digits; Blank: N/A
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XM16M00000S026
SMD CRYSTAL 49SMD TYPE 2 PADS
RELIABILITY
Test Items
Test Method And Conditions
Reference
Documents
High Temperature
High Humidity Storage
Temperature: 85℃±3℃
Relative Humidity:85%RH
Time: 96 Hours
JIS C5023
High Temperature
Storage
Temperature: 125℃±3℃
Time: 96 Hours.
MIL-STD-883E
Method 1005.8
Low Temperature
Storage
Temperature: -40℃±3℃
Time: 96 Hours.
MIL-STD-883E
Method 1013
Thermal Shock
Temperature 1: -55℃±5℃
Temperature 2: 85℃±5 ℃
Temperature change between T1 and T2 5 min
10cycles maintain T1 and T2 for 30 minutes each cycle
MIL-STD-202F
Method 107
Condition A
Resistance to Solder
Heat
Solder Temperature: 260℃±5℃
Time: 10±1 Seconds
MIL-STD-202F
Method 210E
Solderability
The solder pot temperature is 245±5℃ , dwell time 5±0.5sec
J-STD-002B
Drop Test
3 Times Free Fall from 50cm height table to 3cm thickness
hard wood board
J-STD-002B
Mechanical Shock
Half sine wave,1000 G
3 Times for all 3 directions(X,Y Z)
MIL STD 202F
Method 213B
Vibration
Frequency Range: 10Hz~55Hz
Amplitude: 0.75mm
2 Hours in each direction, total 6 Hours
MIL-STD-883E
Method 2007.3
Leakage Test
Take measurements with a helium
Leakage detector
Leakage Rate≤1×10ˉ³Pa cm³/s
MIL-STD-883E
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XM16M00000S026
SMD CRYSTAL 49SMD TYPE 2 PADS
SUGGESTED REFLOW PROFILE (For Reference Only)
Total time: 200 Sec. Max. Solder melting point: 220℃
Profile Feature
Pb-Free Assembly
Average Ramp-up Rate (Ts Max to Tp)
3℃/second Max
Preheat
Temperature Min (Ts Min.)
125℃
Temperature Max (Ts Max.)
200℃
Time (ts Min. to ts Max.)
60~180 seconds
Temperature (TL)
217℃
Time (tL)
60~150 seconds
Time maintained
above
Peak/Classification Temperature (Tp)
260 ℃
Time within 5℃ of actual Peak Temperature (tp)
20~40 seconds
Ramp-down rate
6 ℃ /Second Max.
Time 25 ℃ to Peak Temperature
8 minutes Max.
Suggest reflow times
3 Times Max.
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XM16M00000S026
SMD CRYSTAL 49SMD TYPE 2 PADS
TAPE/REEL (Unit: mm)
All Devices are packed in accordance with EIA standard RS-481-2 and specifications., 1000pcs/Reel
Symbol
Dimension
A
5.0±0.1
B
15.0±0.2
C
24.0±0.3
D
11.05±0.1
E
1.75±0.1
F
8.0±0.1/12.0±0.1
G
5.0±0.1
H
0.5±0.1
I
2.4±0.2
J
24.4+2.0/-0.0
K
100.0±1.0
L
330
DISCLAIMER
NextGen Components, Inc. reserves the right to make changes to the product(s) and or information contained
herein without notice. No liability is assumed as a result of their use or application. No rights under any patent
accompany the sale of any such product(s) or information
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
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