PART CODE:
RD25M00000S300
SPECIFICATION SHEET
SPECIFICATION SHEET NO.
N0216-RD25M00000S300
DATE
Feb. 16, 2021
REVISION
A0
DESCRIPITION
SMD Oscillator, 5032 Type, L5.0*W3.2*H1.3mm, 4 Pads, COM53 series
25.0000MHz, 3.3V, +/-50ppm, Symmetry 45/55, Operating Temp. Range
-40°C ~+85°C, Reflow Profile Condition 260 °C Max.
HCMOS//15pF, Supply Current 40mA Max, Tristate via Pad 1,
Tape/Reel, RoHS/RoHS III compliant
CUSTOMER
CUSTOMER PART NUMBER
CROSS REF. PART NUMBER
ORIGINAL PART NUMBER
TGS COM5331BGI03 TLF-25M000
PART CODE
RD25M00000S300
VENDOR APPROVE
Issued/Checked/Approved
DATE: Feb. 16, 2021
CUSTOMER APPROVE
DATE:
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
RD25M00000S300
MHZ SMDSMD
OSCILLATOR
CRYSTAL 5032
2520 TYPE 4 PADS
MAIN FEATURE
• SMD Package, Seam Sealed, 5032 Type, L5.0*W3.2*H1.3mm, 4 Pads
• Low noise and Low current
• Industry standard
• Reflow Profile Condition 260 °C Max.
• Cross more competitors part
• RoHS/RoHS III compliant
APPLICATION
• PDA, PND, DSC, Smart phone, WiLAN, Bluetooth and more
• Communication Electronics
RFQ
PART CODE GUIDE
Request For Quotation
RD
25M00000
S
300
1
2
3
4
1) RD: Part family Code for SMD Oscillator 5032 Type, L5.0*W3.2*H1.3mm, 4 Pads, COM53 series
2) 25M00000: Frequency range code for 25.00000MHz
3) S: SMD type, Package Tape/Reel, 1000pcs/Reel
4) 300: Specification code for original part No.: TGS COM5331BGI03 TLF-25M000
MORE FREQUENCY RANGE AVAILABLE (MHz)
2.0480
12.288
16.000
20.000
24.000
25.000
27.000
50.000
66.667
100.00
125.000
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
RD25M00000S300
MHZ SMD OSCILLATOR 5032 TYPE 4 PADS
DIMENSION (Unit: mm, Tol. +/-0.15mm)
Image for reference
Marking 1
Line 1: Company Code + Supply Voltage
Line 2: Freq. Range + QC Code (A~Z)
COM53
Marking 2
Line 1: Frequency Range
Pin Function
#1 Enable (Tri-State)
#2 Ground
#3 Output
#4 VDD
Recommend Pad Layout
NextGen Components, Inc.
Circuit Principle
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
RD25M00000S300
MHZ SMD OSCILLATOR 5032 TYPE 4 PADS
ELECTRICAL PARAMETERS
Parameter
Part No.
Symbol
Units
Value
Min.
Original Manufacturer
Holder Type
Typical
Condition
Max.
TGS
TGS Crystals
COM53
SMD Oscillator, 5032 Type, L5.0*W3.2*H1.30mm,
4 Pads
Supply Voltage
3
Enable/Disable Function
1
Overall Freq. Tolerance
B
ppm
-50
+50
Operating Temp. Range
G
°C
-40
+85
°C
-55
+125
%
45
55
V OH
V
90%
V OL
V
Load
pF
Storage Temp. Range
Symmetry
Output
I
Output Waveform
V
3.3
+/-10%
Tri-State
@ Control via
pin 1
@25°C
High (Logic “1”)
10%
Low (Logic “0”)
15
03
HCMOS
@OutputLoad
15pF
Startup Time
ms
10
Supply Current
mA
40
Rise/ Fall time
ns
10
Phase Jitter
ps
1.0
@12KHz~20MHz
ppm/year
±3
@1st year
Aging
Others
Package
T
Tape/Reel
RoHS
Status
LF
RoHS III compliant
Add Value
N/A
Internal
Control
Code *
N/A
Frequency Range
-25M00
25.0000MHz
Note: 1) Original Part Number: TGS COM5331BGI03 TLF-25M00
2) * Internal Control Code- 2 letter or digits; Blank: N/A
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
RD25M00000S300
MHZ SMD OSCILLATOR 5032 TYPE 4 PADS
RELIABILITY
Test Items
Test Method And Conditions
Reference
Documents
High Temperature
High Humidity Storage
Temperature: 85℃±3℃
Relative Humidity:85%RH
Time: 96 Hours
JIS C5023
High Temperature
Storage
Temperature: 125℃±3℃
Time: 96 Hours.
MIL-STD-883E
Method 1005.8
Low Temperature
Storage
Temperature: -40℃±3℃
Time: 96 Hours.
MIL-STD-883E
Method 1013
Thermal Shock
Temperature 1: -55℃±5℃
Temperature 2: 85℃±5 ℃
Temperature change between T1 and T2 5 min
10cycles maintain T1 and T2 for 30 minutes each cycle
MIL-STD-202F
Method 107
Condition A
Resistance to Solder
Heat
Solder Temperature: 260℃±5℃
Time: 10±1 Seconds
MIL-STD-202F
Method 210E
Solderability
The solder pot temperature is 245±5℃ , dwell time 5±0.5sec
J-STD-002B
Drop Test
3 Times Free Fall from 50cm height table to 3cm thickness
hard wood board
J-STD-002B
Mechanical Shock
Half sine wave,1000 G
3 Times for all 3 directions(X,Y Z)
MIL STD 202F
Method 213B
Vibration
Frequency Range: 10Hz~55Hz
Amplitude: 0.75mm
2 Hours in each direction, total 6 Hours
MIL-STD-883E
Method 2007.3
Leakage Test
Take measurements with a helium
Leakage detector
Leakage Rate≤1×10ˉ³Pa cm³/s
MIL-STD-883E
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
RD25M00000S300
MHZ SMD OSCILLATOR 5032 TYPE 4 PADS
SUGGESTED REFLOW PROFILE (For Reference Only)
Total time: 200 Sec. Max. Solder melting point: 220℃
Profile Feature
Pb-Free Assembly
Average Ramp-up Rate (Ts Max to Tp)
3℃/second Max
Preheat
Temperature Min (Ts Min.)
125℃
Temperature Max (Ts Max.)
200℃
Time (ts Min. to ts Max.)
60~180 seconds
Temperature (TL)
217℃
Time (tL)
60~150 seconds
Time maintained
above
Peak/Classification Temperature (Tp)
260 ℃
Time within 5℃ of actual Peak Temperature (tp)
20~40 seconds
Ramp-down rate
6 ℃ /Second Max.
Time 25 ℃ to Peak Temperature
8 minutes Max.
Suggest reflow times
3 Times Max.
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
RD25M00000S300
MHZ SMD OSCILLATOR 5032 TYPE 4 PADS
TAPE/REEL (Unit: mm)
All Devices are packed in accordance with EIA standard RS-481-2 and specifications, 1000pcs/Reel
DISCLAIMER
NextGen Components, Inc. reserves the right to make changes to the product(s) and or information contained
herein without notice. No liability is assumed as a result of their use or application. No rights under any patent
accompany the sale of any such product(s) or information
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com