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C3E-33.000-8-1530-X-R

C3E-33.000-8-1530-X-R

  • 厂商:

    AKER(安碁)

  • 封装:

    SMD3225_4P

  • 描述:

    无源晶振 50Ω 8pF 33MHz ±15ppm -40℃~+85℃ SMD3225_4P

  • 详情介绍
  • 数据手册
  • 价格&库存
C3E-33.000-8-1530-X-R 数据手册
Ltr RoHS Compliant Pb - Lead Free Date Revisions Appr Electrical Specifications: Frequency Range Fundamental Third Overtone Standard Mode of Oscillation Frequency Tolerance at 25°C Optional Standard Frequency Stability over Temperature Range Optional Standard Extended Operating Temperature Range Storage Temperature Range Aging Load Capacitance Shunt Capacitance Equivalent Series Resistance (ESR) Drive Level Insulation Resistance 8.000 to 150.000 8.000 to 64.000 60.000 to 150.000 ±30 ±25 ±20 ±15 ±10 ±50 ±30 ±25 ±20 ±15 ±10* -10 to +70 -40 to +85 -55 to +125 ±3 7 to 32 and Series Resonance 3.0 See ESR Table 100 500 at at 100 Vdc ± 15 Vdc MHz MHz PPM Max (Note 1) PPM Max (Note 1) ºC PPM Max/Year pF Ohm uW Max M Ohm Frequency Range and ESR Values: Frequency Range in MHz ESR Ohm Max Mode of Operation Frequency Range in MHz ESR Ohm Max Mode of Operation 8.000 to 9.999 500 Fundamental 54.000 to 99.999 150 3rd Overtone 10.000 to 11.999 150 Fundamental 100.000 to 124.999 100 3rd Overtone 12.000 to 15.999 80 Fundamental 125.000 to 150.000 80 3rd Overtone 16.000 to 19.999 60 Fundamental 20.000 to 24.999 50 Fundamental 25.000 to 53.999 40 Fundamental 54.000 to 64.000 30 Fundamental Specification Title: 11-3 Chien-Kuo Rd T.E.P.Z. 4027 Taiwan, ROC All dimensions are millimeters. CAD: TCR EG Review: JL Appr: Page: 1/4 Date: Dec. 5, 2018 Microprocessor Crystal Unit Low Profile 3.2 x 2.5 millimeter Surface Mount General Product Specification Part Number: C3E Series www.aker-usa.com Mechanical Outline: 3.2 ± 0.15 Metal Lid #3 #4 2.5 ± 0.15 Ceramic Base AKER #2 #1 0.75 Max. 2.2 1.2 #2 #4 #3 1.2 0.8 1.7 0.7 #1 0.9 #2:GND #4:GND 1.4 Package is Seam Sealed Ceramic-Metal. Dimensions are millimeters. Page: 2/4 Date: Dec. 5, 2018 P/N: www.aker-usa.com C3E Series Carrier Tape Dimensions: Dimensions are millimeters. Solder Reflow Characteristics: Page: 3/4 Date: Dec. 5, 2018 P/N: www.aker-usa.com C3E Series How to build a Part Number: Series Package C 3E Frequency 8.000 to 150.000 Load Capacitance Standard Frequency Tolerance (Note 1) Option Standard Frequency Stability (Note 1) Option 7 10 12 16 18 20 32 S 30 25 20 15 10 50 30 25 20 15 10 Mode of Oscillation See Notes 3 Standard Temperature Range Extended See Notes X Packaging M R R3 Parameter 3.2 x 2.5 mm - MHz - 7 pF 10 pF 12 pF 16 pF 18 pF 20 pF 32 pF Series - ±30 PPM ±25 PPM ±20 PPM ± 15 PPM ±10 PPM ±50 PPM ±30 PPM ±25 PPM ±20 PPM ±15 PPM ±10 PPM* - Fundamental Third Overtone - -10 to +70 ºC -40 to +85 ºC - 250pcs Reel 1000pcs Reel 3000pcs Reel Part Number Example: C3E-24.000-18-3050-X-R C3E- 2.5 x 3.2 mm SMD Seam Seal Crystal Unit 24.000 MHz Nominal Frequency 18 pF Load Capacitance 3050: ±30 PPM Frequency Tolerance and ±50 PPM Frequency Stability Fundamental Mode X: -40 to +85° C Temperature Range R: Tape and Reel Packaging - 1000pcs Reel Notes: 1- Frequency Tolerance and Stability options are limited due to physical size. * ±10 PPM Temperature Stability is only available from -20 to +85° C. 2- Standard Temperature Range does not need to be included in part number description. 3 - Fundamental mode does not need to be included in part number description 4- Quantities less than 250pcs are shipped in tape only. 5- Specification subject to change without notice. Page: 4/4 Date: Dec. 5, 2018 P/N: www.aker-usa.com C3E Series
C3E-33.000-8-1530-X-R AI解析
1. 物料型号:C3E Series 2. 器件简介:Microprocessor Crystal Unit,Low Profile 3.2 x 2.5 millimeter Surface Mount 3. 引脚分配:文档中提到了GND(#2和#4)的引脚分配,但未提供完整的引脚分配图或说明。 4. 参数特性: - 频率范围:8.000 to 150.000 MHz,具体范围取决于模式和负载电容。 - 模式:Fundamental 和 Third Overtone。 - 频率容差:标准为±30 PPM,可选±25、±20、±15、±10 PPM。 - 频率稳定性:标准为±50 PPM,可选±30、±25、±20、±15、±10 PPM。 - 工作温度范围:标准为-10 to +70°C,扩展为-40 to +85°C。 - 存储温度范围:-55 to +125°C。 - 老化:±3 PPM Max/Year。 - 负载电容:7 to 32 pF 和 Series Resonance。 - 等效串联电阻(ESR):见ESR表格。 - 驱动级别:100 uW Max。 - 绝缘电阻:500 M Ohm at 100 Vdc±15Vdc。 5. 功能详解:文档提供了详细的频率范围和ESR值表,以及如何构建部件编号的指南。 6. 应用信息:适用于微处理器晶体单元,低轮廓3.2 x 2.5毫米表面贴装。 7. 封装信息:Seam Sealed Ceramic-Metal,尺寸为3.2 ± 0.15 x 2.5 ± 0.15 x 0.7 mm。
*介绍内容由AI识别生成
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