SXT1148CB38-26.000MT

Ceramic SMT 4 Pad Crystal SXT114 Series 1.6mm x 1.2mm Features Applications • ±10ppm/±10ppm (Tolerance/Stability) Available • Bluetooth • Ultra-Miniature Package • High Density Applications • Wireless LAN • AT-Cut Fundamental • Tape and Reel Part Numbering Guide SXT 11 4 12 A A 48 - 20.000M SUNTSU CRYSTAL FREQUENCY MHz 1.6mm x 1.2mm 4 PAD OPERATING TEMPERATURE RANGE** 07 : 0°C - +70°C LOAD CAPACITANCE FREQUENCY STABILITY 16 : -10°C - +60°C FREQUENCY TOLERANCE S : Series A : ±50ppm A : ±50ppm 17 : -10°C - +70°C COMPLIANT 8 - 12 : 8pF - 12pF B : ±30ppm B : ±30ppm 27 : -20°C - +70°C C : ±25ppm C : ±25ppm 38 : -30°C - +85°C D : ±20ppm D : ±20ppm 48 : -40°C - +85°C E : ±15ppm E : ±15ppm Cage Code: 4GUT4 F : ±10ppm* F : ±10ppm To customize your parameters contact a Suntsu representative. * For frequency stability option F contact a Suntsu representative. ** For operating temperatures of -55-125°C a Suntsu representative. Electrical Parameters Units Minimum Frequency Range MHz 24 54 AT-Cut Fundamental. Frequency Tolerance at +25ºC ppm -10 +10 See part numbering guide for options. Frequency Stability vs. Op Temp ppm -10 +10 See part numbering guide for options. Frequency Stability vs. Aging ppm -2 +2 First year @ +25ºC. Operating Temperature °C -40 +85 Storage Temperature °C -40 +95 Load Capacitance pF 8 12 Shunt Capacitance pF Drive Level µW Insulation Resistance ESR - 24.000MHz MΩ ~ Typical Maximum Remarks See part numbering guide for options. See part numbering guide for options. 3 10 100 500 @ 100VDC ± 15V. 29.999MHz Ω 150 AT-Cut Fundamental ESR - 30.000MHz ~ 54.000MHz Ω 100 AT-Cut Fundamental Outline Drawing & Recommended Landed Pattern All dimensions are in millimeters (mm) unless otherwise noted. Drawings are not to scale. www.suntsu.com Specifications are subject to change without notice. Suntsu Electronics, Inc. 142 TECHNOLOGY DR., SUITE 150 IRVINE, CA 92618 Call: +1-949-783-7300 | Fax: +1-949-783-7301 Ceramic SMT 4 Pad Crystal SXT114 Series 1.6mm x 1.2mm Environmental Specifications Mechanical Specifications Temperature Cycling MIL-STD-883, Method 1010, Condition B Mechanical Shock MIL-STD-202, Method 213, Condition B Fine Leak Test MIL-STD-883, Method 1014, Condition A Vibration MIL-STD-883, Method 2007, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Moisture Resistance MIL-STD-883, Method 1004 Resistance to Solvents MIL-STD-202, Method 215 Moisture Sensitivity J-STD-020, MSL 1 Solderability MIL-STD-883, Method 2003 Reflow Profile & Part Marking Tp (Time At 260°C. 20-40 Sec) 260 Rup (Ramp Up, 3°C/Sec Max) 217 Temperature (°C) 200 TI (Time Above 217°C. 60-150Sec) 150 Rdn (Ramp Down, 6°C/Sec Max) Ts (Preheat Time. 60-180Sec) T 25°C to Peak (480Sec Max) Time (sec) Tape And Reel Dimensions All dimensions are in millimeters (mm) unless otherwise noted. Drawings are not to scale. 3,000pcs / Reel www.suntsu.com Specifications are subject to change without notice. Suntsu Electronics, Inc. 142 TECHNOLOGY DR., SUITE 150 IRVINE, CA 92618 Call: +1-949-783-7300 | Fax: +1-949-783-7301