PART CODE:
XI12M28800S101
SPECIFICATION SHEET
SPECIFICATION SHEET NO.
N0215-XI12M28800S101
DATE
Feb. 15, 2021
REVISION
A0
DESCRIPITION
SMD Crystal, 2520 Type, L2.5*W2.0*H0.55mm, 4 Pads, CM22 series
12.28800MHz, +/-20ppm, CL 8pF,
Stability +/20ppm @Operating Temp. Range -20°C ~+70°C,
ESR 150 ohm Max, Reflow Profile Condition 260 °C Max.
Tape/Reel, RoHS/RoHS III compliant
CUSTOMER
CUSTOMER PART NUMBER
CROSS REF. PART NUMBER
ORIGINAL PART NUMBER
TGS CM22 12M288A20-8-20-20-150 TLF
PART CODE
XI12M28800S101
VENDOR APPROVE
Issued/Checked/Approved
DATE: Feb. 15, 2021
CUSTOMER APPROVE
DATE:
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XI12M28800S101
MHZ SMD CRYSTAL 2520 TYPE 4 PADS
MAIN FEATURE
• Extra SMD Package, Seam Sealed Ceramic-Metal, 4pads
• 2520 Type, L2.5*W2.0*H0.55mm, 4 Pads,
• Low cost, High precision, High frequency stability
• Reflow Profile Condition 260 °C Max.
• Cross more competitors part
• RoHS/RoHS III compliant
APPLICATION
• Bluetooth, wireless communication set
• Communication Electronics
RFQ
PART CODE GUIDE
Request For Quotation
XI
12M28800
S
101
1
2
3
4
1) XI: Part family Code for SMD Crystal, 2520 Type, L2.5*W2.0*H0.55mm, 4 Pads, (CM22)
2) 12M28800: Frequency range code for 12.288000MHz
3) S: SMD type, Package Tape/Reel, 3000pcs/Reel
4) 101: Specification code for original part No.: TGS CM22 12M288A20-8-20-20-150 TLF
MORE FREQUENCY RANGE AVAILABLE (MHz)
12.0000
12.2880
16.000
20.000
28.63636
32.000
40.0000
48.000
NextGen Components, Inc.
20.250
24.000
sales@NextGenComponent.com
24.576
25.000
26.000
27.000
www.NextGenComponent.com
PART CODE:
XI12M28800S101
MHZ SMD CRYSTAL 2520 TYPE 4 PADS
DIMENSION (Unit: mm, Tol. +/-0.15mm)
Image for reference
CM22
Marking 1
Line 1: Frequency Range
Connection
#1 Crystal
#2 Ground
#3 Crystal
#4 Ground
Recommend Pad Layout
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
XI12M28800S101
PART CODE:
MHZ SMD CRYSTAL 2520 TYPE 4 PADS
ELECTRICAL PARAMETERS
Parameter
Part No.
Symbol
Units
Value
Min.
Original Manufacturer
Holder Type
Frequency Range
Typical
Condition
Max.
TGS
TGS Crystals
CM22
SMD Crystal, 2520 Type, L2.5*W2.0*H0.55mm, 4 Pads
12M288
MHz
12.288
Mode of Oscillation
A
Frequency Tolerance
20
ppm
Load Capacitance
-8
pF
Stability over
Operation Temperance
-20
ppm
-20
+20
Operation Temperance
-20
°C
-20
+70
°C
-40
+85
Storage Temperance
Equivalent Series
Resistance (ESR)
-150
AT Fundamental
-20
+20
8
Ω
150
Drive Level
μW
100
Shunt Capacitance (C0)
pF
Motional Capacitance
(C1)
fF
N/A
DLD2
Ω
N/A
FLD2
ppm
N/A
RDL2
Ω
N/A
SPDB
dB
N/A
Aging
ppm/year
Insulation Resistance
Others
MΩ
@25°C
0
7.0
±3
500
@1st year
@100VDC
± 15VDC
Package
T
Tape/Reel
RoHS Status
LF
RoHS III compliant
Add Value
N/A
Internal
Control
Code *
N/A
Note: 1) Original Part Number: TGS CM22 12M288A20-8-20-20-150 TLF
2) * Internal Control Code- 2 letter or digits; Blank: N/A
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XI12M28800S101
MHZ SMD CRYSTAL 2520 TYPE 4 PADS
RELIABILITY
Test Items
Test Method And Conditions
Reference
Documents
High Temperature
High Humidity Storage
Temperature: 85℃±3℃
Relative Humidity:85%RH
Time: 96 Hours
JIS C5023
High Temperature
Storage
Temperature: 125℃±3℃
Time: 96 Hours.
MIL-STD-883E
Method 1005.8
Low Temperature
Storage
Temperature: -40℃±3℃
Time: 96 Hours.
MIL-STD-883E
Method 1013
Thermal Shock
Temperature 1: -55℃±5℃
Temperature 2: 85℃±5 ℃
Temperature change between T1 and T2 5 min
10cycles maintain T1 and T2 for 30 minutes each cycle
MIL-STD-202F
Method 107
Condition A
Resistance to Solder
Heat
Solder Temperature: 260℃±5℃
Time: 10±1 Seconds
MIL-STD-202F
Method 210E
Solderability
The solder pot temperature is 245±5℃ , dwell time 5±0.5sec
J-STD-002B
Drop Test
3 Times Free Fall from 50cm height table to 3cm thickness
hard wood board
J-STD-002B
Mechanical Shock
Half sine wave,1000 G
3 Times for all 3 directions(X,Y Z)
MIL STD 202F
Method 213B
Vibration
Frequency Range: 10Hz~55Hz
Amplitude: 0.75mm
2 Hours in each direction, total 6 Hours
MIL-STD-883E
Method 2007.3
Leakage Test
Take measurements with a helium
Leakage detector
Leakage Rate≤1×10ˉ³Pa cm³/s
MIL-STD-883E
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XI12M28800S101
MHZ SMD CRYSTAL 2520 TYPE 4 PADS
SUGGESTED REFLOW PROFILE (For Reference Only)
Total time: 200 Sec. Max. Solder melting point: 220℃
Profile Feature
Pb-Free Assembly
Average Ramp-up Rate (Ts Max to Tp)
3℃/second Max
Preheat
Temperature Min (Ts Min.)
125℃
Temperature Max (Ts Max.)
200℃
Time (ts Min. to ts Max.)
60~180 seconds
Temperature (TL)
217℃
Time (tL)
60~150 seconds
Time maintained
above
Peak/Classification Temperature (Tp)
260 ℃
Time within 5℃ of actual Peak Temperature (tp)
20~40 seconds
Ramp-down rate
6 ℃ /Second Max.
Time 25 ℃ to Peak Temperature
8 minutes Max.
Suggest reflow times
3 Times Max.
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
PART CODE:
XI12M28800S101
MHZ SMD CRYSTAL 2520 TYPE 4 PADS
TAPE/REEL (Unit: mm)
All Devices are packed in accordance with EIA standard RS-481-2 and specifications, 3000pcs/Reel
DISCLAIMER
NextGen Components, Inc. reserves the right to make changes to the product(s) and or information contained
herein without notice. No liability is assumed as a result of their use or application. No rights under any patent
accompany the sale of any such product(s) or information
NextGen Components, Inc.
sales@NextGenComponent.com
www.NextGenComponent.com
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