HSEC8-160-01-L-RA-BL

HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS • 56 Gbps PAM4 performance • PCI Express® 3.0, 4.0 and 5.0 • Edge Rate® contacts optimized for signal integrity performance and cycle life • Up to 200 positions available • Vertical, right-angle, edge mount, pass-through orientations • Power/signal combo, press-fit tails, rugged weld tabs, locks and latches • Mating cable assemblies available Rugged tucked beam technology (HTEC8) KEY SPECIFICATIONS Differential pair for increased speed (HSEC8-DP) Custom designs allow for misalignment in the X-Y axes (HSEC1) SERIES PITCH TOTAL POSITIONS INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING LEAD-FREE SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 ℃ to +125 ℃ 0.8 A (12 pins) 300 VAC Yes HTEC8 0.80 mm 40-200 Black LCP Copper Alloy -55 ℃ to +125 ℃ 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 ℃ to +125 ℃ 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.2 A (2 pins) 215 VAC Yes F-221 samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (0.80 mm) .0315" PITCH • RIGHT-ANGLE & EDGE MOUNT SOCKET HSEC8 - - POSITIONS PER ROW 1 09, 10, 13, 20, 25, 30, 40, 49, 50, 60 - CARD THICKNESS –01 - PLATING OPTION - RA –L = (1.60 mm) .062" thick card = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail –S Card Mates: (1.60 mm) .062" thick card, HSC8 (9.30) .366 Leave blank for Tray Packaging –L2 = Tape & Reel A 40 (43.80) 1.724 (51.80) 2.039 (22.90) .902 (44.60) 1.756 60 (59.80) 2.354 (26.90) 1.059 (52.60) 2.071 40-BL (51.30) 2.020 (18.90) .474.744 50-BL (5.20) (59.30) 2.335 (22.90) .902 (44.60) 1.756 60-BL (67.30) 2.650 (26.90) 1.059 (52.60) 2.071 No. of Positions x (0.80) .0315 + (8.61) .339 Cable Mates: ECDP A B B C (18.90) .744 (36.60) 1.441 (12.05) .205 –TR = ECDP Latching (09, 13, 25, 49 only) POSITIONS PER ROW No. of Positions x (0.80) 50 .0315 + (5.38) .212 "X"R –BL = Board Locks (09, 13, 25, 40, 49, 50, 60 only) = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail HSEC8-RA - OTHER OPTIONS –FR = Full Reel Tape & Reel Packaging (must order max. quantity per reel; contact Samtec for quantity breaks) (36.60) 1.441 C (9.30) (9.30) .366.366 -BL OPTION of Positions No. No. of Positions x x 40, 50, & 60 POSITIONS (0.80) .0315 + (5.38) (0.80) .0315 + (5.38) .212.212 of Positions x (0.80) .0315 + (8.61) No. No. of Positions x (0.80) .0315 + (8.61) .339.339 (9.30) .366 (12.05) (12.05) .474.474 (5.20) (5.20) .205.205 No. of Positions x (0.80) .0315 + (5.38) .212 10, 20 & 30 POSITIONS No. of Positions x (0.80) .0315 + (8.61) .339 A A C C B B View complete specifications at: samtec.com?HSEC8-RA .474 HSEC8 - 1 - POSITIONS PER ROW (12.05) (5.20) .205 01 B 10, 20, 30, 40, 50, 60 A - - PLATING OPTION C - D –L EM2 –EM2 = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail =(1.60 mm) .062" thick PCB –S = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail HSEC8-EM Cable Mates: ECDP POSITIONS PER ROW B + (18.40) .724 No. of A Positions x (0.80) .0315 No. of Positions x (0.80) .0315 + (7.80) .307 A (7.00) .276 (7.00) .276 40 B 40, 50 &x (0.80) 60 POSITIONS No. of Positions .0315 + (15.20) .598 B A No. of Positions x (0.80) .0315 + (18.40) .724 No. of Positions x (0.80) .0315 + (7.80) .307 Card Mates: (1.60 mm) .062" thick card, HSC8 No. of Positions x (0.80) .0315 + (18.40) .724 No. of Positions x (0.80) .0315 + (7.80) .307 A B (18.90) .744 (36.60) 1.441 No. of Positions x (0.80) .0315 + (15.20) .598 (7.00) .276 50 (22.90) .902 (44.60) 1.756 60 (26.90) 1.059 (52.60) 2.071 No. of Positions x (0.80) .0315 + (15.20) .598 No. of Positions x (0.80) .0315 + (4.60) .181 No. of Positions x (0.80) .0315 + (4.60) .181 20 &x 30 POSITIONS No. 10, of Positions (0.80) .0315 + (4.60) .181 Note: Some sizes, styles and options are non-standard, non-returnable. View complete specifications at: samtec.com?HSEC8-EM samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-221