HSEC8-130-01-L-PV-2-1

HIGH-SPEED EDGE CARD SYSTEMS 0.60 mm, 0.80 mm and 1.00 mm PITCH FEATURES & BENEFITS • 56 Gbps PAM4 performance • PCI Express® 3.0, 4.0 and 5.0 • Edge Rate® contacts optimized for signal integrity performance and cycle life • Up to 200 positions available • Vertical, right-angle, edge mount, pass-through orientations • Power/signal combo, press-fit tails, rugged weld tabs, locks and latches • Mating cable assemblies available Rugged tucked beam technology (HTEC8) KEY SPECIFICATIONS Differential pair for increased speed (HSEC8-DP) Custom designs allow for misalignment in the X-Y axes (HSEC1) SERIES PITCH TOTAL POSITIONS INSULATOR MATERIAL CONTACT MATERIAL OPERATING TEMP RANGE CURRENT RATING VOLTAGE RATING LEAD-FREE SOLDERABLE HSEC6 0.60 mm 56-168 Black LCP Copper Alloy -55 ℃ to +125 ℃ 0.8 A (12 pins) 300 VAC Yes HTEC8 0.80 mm 40-200 Black LCP Copper Alloy -55 ℃ to +125 ℃ 3.0 A (2 pins) 215 VAC Yes HSEC8 0.80 mm 18-200 Black LCP BeCu -55 ℃ to +125 ℃ 2.8 A (2 pins) 240 VAC Yes HSEC1 1.00 mm 20-140 Black LCP Phosphor Bronze -55 ℃ to +125 ℃ 2.2 A (2 pins) 215 VAC Yes F-221 samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. (0.80 mm) .0315" PITCH • PASS-THROUGH & POWER COMBO - HSEC8 1 POSITIONS PER ROW - 10, 13, 20 - CARD THICKNESS –01 - PLATING OPTION DV - A - - PE –L = (1.60 mm) .062" thick card OTHER OPTIONS –K = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail = (5.50 mm) .217" DIA Polyimide Film Pick & Place Pad –S –TR = 30 µ" (0.76 µm) Gold on contact area, Matte Tin No. of Positions on x tail HSEC8-PE =Tape & Reel Packaging –FR = Full Reel Tape & Reel Packaging (Must order max. quantities per reel. Contact Samtec for parts per reel) (0.80) .0315 + (7.00) .276 No. of Positions x (0.80) .0315 + (7.00) .276 Card Mates: (1.60 mm) .062" thick card, HSC8 (7.00) .276 (7.00) .276 (4.60) .180 (4.60) .180 (9.12) .359 (9.12) .359 No. of Positions x (0.80) .0315 + (4.60) .181 No. of Positions x (0.80) .0315 + (4.60) .181 View complete specifications at: samtec.com?HSEC8-DV HSEC8 - 1 SIGNAL POSITIONS 20, 30, 40 (Signal positions per row) - CARD THICKNESS –01 = (1.60 mm) .062" thick card - - PLATING OPTION - PV –L - POWER POSITIONS POWER TAIL –2, –4 = 10 µ" (0.25 µm) Gold on contact area, Matte Tin on tail –1 (Total, 2 per power bank) = Use with (2.36 mm) .093" Thick PCB A (8.00) (8.00) .315 (8.00) .315 .315 Card Mates: (1.60 mm) .062" thick card B B B (8.00) (8.00) .315 (8.00) .315 .315 (15.03) (15.03).592 (15.03) .592 (15.21) (15.21).599 (15.21) .599 .599 .592 C C SIGNAL POSITIONS Note: Some sizes, styles and options are non-standard, non-returnable. = Weld Tab –2 –S A A OTHER OPTION –WT = Use with (1.60 mm) .062" Thick PCB = 30 µ" (0.76 µm) Gold on contact area, Matte Tin on tail HSEC8-PV - A (–2) B (–2) D D C POWER POSITIONS C (–2) A (–4) B (–4) D (–4) C POWER TAIL D 20 (32.10) 1.264 (15.20) .598 (18.20) .717 –1 (2.35) .093 30 (40.10) 1.579 (23.20) .913 (26.20) 1.031 (52.10) 2.051 (23.20) .913 (26.20) 1.031 –2 (3.13) .123 40 (48.10) 1.894 (31.20) 1.228 (34.20) 1.346 (60.10) 2.366 (31.20) 1.228 (34.20) 1.346 (18.20) .717 (44.10) 1.736 (15.20) .598 View complete specifications at: samtec.com?HSEC8-PV samtec.com/EdgeCard Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-221