15220206601000

Technical characteristics Mating conditions Processing notes Inclination The har-flex ® SMT/THR connectors meet the highest ­demands in terms of their processing capabilities. The connectors are delivered in a tape and reel packaging optimized for ­automatic ­assembly machines. A vacuum cover enables the automatic assembly with a vacuum nozzle. The insulation body material is high temperature resistant, and due to the black colour a secure camera recognition is ensured. To ensure a reliable reflow soldering process, the signal pins are 100 % checked for coplanarity. Mismating Process / Moisture Sensitivity During the reflow solder process, the connector has to resist extreme variations in temperature. Connectors consist in general of both plastic and metal parts, which have a different behaviour during the solder process. The Process Sensivity and also the Moisture Sensivity are tested according the ECA/IPC/JEDEC J-STD-075 specification. Process Sensivity: PSL means Process Sensitivity Level. PSL is a rating used to identify a component that is solder process sensitive. Damages of the connector after three times soldering are not permitted (e.g. melted edges). Tape acc. to IEC 60 286-3 Moisture Sensitivity: har -flex MSL means Moisture Sensitivity Level. MSL is a rating indicating a component’s susceptibility to damage due to absorbed moisture during storage. Damages of the connector after storage in damp heat and three times soldering are not permitted (e.g. blisters). The har-flex ® connectors are rated with PSL R0 and MSL 1. This is the maximum possible rating in both categories. The har-flex ® connector resists three times soldering at the following conditions without damages: • min. 150 s beyond 217 °C (liquidus temperature, the melting point of the solder paste) • min. 30 s beyond classification temperature (240 °C / 245 °C for har-flex ®) 14 10 Tape dimensions: poles   6 to   12 poles 14 to   20 poles 22 to   40 poles 42 to   56 poles 58 to   80 poles 82 to 100 E 24.4 32.4 44.4 56.4 72.4 88.4 • Temperature solder profile according to ECA/IPC/JEDEC J-STD-075 • For MSL test, a storage of 168 hours at 85 °C and 85 % rel. humidity was carried out As the result, the har-flex ® connectors are not process sensitive and not moisture sensitive according to ECA/IPC/JEDEC J-STD-075.