DF13E-20DP-1.25V(55)

Applicable standard Operating temperature range Rating -35C to +85C(Note 1) 20 % to 80 % (Note 2) Operating humidity range -10C to +60C(Note 3) 40 % to 70 %(Note 3) Storage humidity range 150 V AC (DC) Current DF13-*DS-1.25C Applicable Contact Voltage Applicable Connector Storage temperature range 1 A DF13(G)-2630SCFA DF13-3032SCFA Specifications Nov.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. In case that the application demands a high level of reliability, such as automotive, please contact a company representative for further information. Item Construction Powered by TCPDF (www.tcpdf.org) Test method General examination Visually and by measuring instrument. Marking Confirmed visually. Requirements QT AT According to drawing. X X X X Electric characteristics Contact resistance 100 m A (DC or 1000 Hz). 30 m MAX. X － Insulation resistance 100 V DC. 500 M MIN. X － Voltage proof 500 V AC for 1 min. No flashover or breakdown. X － X － X － X － X － X － X － X － Mechanical characteristics Mechanical operation 50 times insertions and extractions. Vibration Frequency 10 to 55 Hz, single amplitude 0.75 mm, at 2 h, for 3 directions. 490 m/s2 duration of pulse 11 ms at 3 times for 3 directions. Shock ① ② ① ② Contact resistance: 30 m MAX. No damage, crack or looseness of parts. No electrical discontinuity of 1s. No damage, crack or looseness of parts. Environmental characteristics Temperature -55→ 15 to 35→+85→ 15 to 35 c Time 30→ 2 to 3 → 30→ 2 to 3 min. Under 5 cycles. Exposed at 40 ± 2 c, 90 to 95 , 96 h. ① Contact resistance: 30m MAX. ② Insulation resistance: 500 M MIN. ③ No damage, crack or looseness of parts. Resistance to soldering heat 1) Reflow soldering No deformation of case of excessive looseness of the terminals. Solderability Soldered at solder temperature, 245c for insertion duration, 3sec. Rapid change of temperature Damp heat (Steady state) ≪Reflow area≫ 250℃ MAX 10 sec MAX 230℃ MIN 60 sec MAX ≪Preheating area≫ 170℃ to 190℃ 60 sec to 120 sec Put through in reflow furnace twice, leave in ambient temperature and humidity for 1 hour. 2) Manual soldering Soldering iron temperature :300℃, Soldering time : 3sec. No strength on contact. Solder shall cover a minimum of 95  of the surface being immersed. Remarks Note 1:Include the temperature rising by current. Note 2:No condensing Note 3:Apply to the condition of long term storage for unused products before pcb on board, after pcb on board, operating temperature and humidity range is applied for interim storage during transportation. 0 △ Count Description of revisions Unless otherwise specifid , refer to IEC 60512. Note QT:Qualification Test FORM HD0011-2-1 AT:Assurance Test X:Applicable Test Designed Checked Date Approved KI.AKIYAMA 16.03.31 Checked TS.FUKUSHIMA 16.03.29 Designed MI.SAKIMURA 16.03.29 Drawn MI.SAKIMURA 16.03.29 Drawing no. Specification sheet Part no. Hirose electric co., ltd. Code no. ELC-367983-55-00 DF13E-*DP-1.25V(55) CL536 0 △ 1/1