SY6702DFC

Application Note: SY6702 Low Voltage H-Bridge IC Features    The SY6702 operates with a power-supply voltage range from 2.5V to 16V, and 1.8A maximum output current.      yC erg .C VCC Sil Cameras DSLR Lenses Consumer Products Toys Robotics Medical Devices Note orp Typical Applications on fi Temperature Code Package Code Optional Spec Code de nti a SY6702 □(□□)□ Package type DFN2x2-8 Applications  Ordering Information Ordering Number SY6702DFC  lP The SY6702 provides over current protection, short circuit protection, under voltage lockout and thermal shutdown.  rep are To be compatible with industry-standard devices, the SY6702 use the PWM (IN/IN) input interface.  导 小 芯  H-bridge motor driver  Drives a brush DC motor or one winding of a stepper motor or other loads  Low MOSFET on-resistance: HS + LS < 380mΩ 1.8A maximum drive current Power supply voltage range from 2.5V to 16V PWM (IN/IN) interface Low power sleep mode with 120nA maximum Combined supply current Low power with less than 120µA supply current Internal over current protection, short circuit protection, under voltage lockout and thermal shutdown Compact package: DFN2x2-8 or 半  The SY6702 is an H-bridge motor driver solution for cameras, consumer products, toys, and other lowvoltage or battery-powered motion-control applications. The device can drive one winding of a stepper motor or one brush DC motor. The highly integrated H-bridge driver block consists of two half-bridges with internal logic control, gate drive, over current protection and charge pump circuit. dF General Description VM VCC Driving one DC motor or ½ stepper motor VM GND DC Motor SLEEP IN1 OUT1 IN2 OUT2 Stepper Motor Figure 1. Schematic Diagram AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 1 All Rights Reserved. AN_SY6702 Pinout (top view) OUT1 2 OUT2 3 GND 4 9 Thermal Pad Part Number Package type SY6702DFC DFN2x2-8 8 VCC 7 SLEEP 6 IN1 5 IN2 导 小 芯 1 Top Mark Eexyz or 半 VM ① Note① ： x=year code, y=week code, z= lot number code. 7 VCC Thermal Pad 8 dF rep are SLEEP Description Motor power supply pin. Decouple this pin to GND pin with 10uF ceramic cap. Output 1 pin. Connect this pin to motor winding. Output 2 pin. Connect this pin to motor winding. Ground pin. Input 2 pin. Logic high set OUT2 high; this pin has a internal pull-down resistor. Input 1 pin. Logic high set OUT1 high; this pin has a internal pull-down resistor. Sleep mode pin. Logic low puts device in low-power sleep mode, this pin has an internal pull-down resistor. Device power supply pin. Decouple this pin to GND pin with 0.1uF ceramic cap. Thermal Pad. lP ____________ DFN2x2-8 1 2 3 4 5 6 de nti a Name VM OUT1 OUT2 GND IN2 IN1 9 Absolute Maximum Ratings (Note 1) on fi VCC, OUT1, OUT2 ------------------------------------------------------------------------------------------------------------ 16V VM -------------------------------------------------------------------------------------------------------------------------------- 16V ____________ erg yC orp .C SLEEP ----------------------------------------------------------------------------------------------------------------------------- 6V IN1, IN2 --------------------------------------------------------------------------------------------------------------------------- 6V Junction Temperature (TJ) -------------------------------------------------------------------------------------- -40°C to +150°C Storage Temperature --------------------------------------------------------------------------------------- -65°C to +150°C Power Dissipation, PD @ TA = 25°C, ---------------------------------------------------------------------------------------- 2.5W Package Thermal Resistance (Note2) θ JA,----------------------------------------------------------------------------------------------------------------50°C/W θ JC , ---------------------------------------------------------------------------------------------------------------62°C/W Recommended Operating Conditions ____________ Sil VCC --------------------------------------------------------------------------------------------------------------------- 2.5V to 16V VM ---------------------------------------------------------------------------------------------------------------------- 2.5V to 16V SLEEP ------------------------------------------------------------------------------------------------------------------- 0V to 5.5V IN1, IN2 ------------------------------------------------------------------------------------------------------------------ 0V to 5.5V Logic Input PWM Frequency ------------------------------------------------------------------------------------- 0Hz to 250kHz H-Bridge Output Current (Note3) ------------------------------------------------------------------------------------- 0A to 1.8A Junction Temperature Range ------------------------------------------------------------------------------------- -40°C to 125°C Ambient Temperature Range -------------------------------------------------------------------------------------- -40°C to 85°C AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 2 All Rights Reserved. AN_SY6702 Block Diagram VM VCC Charge pump 导 小 芯 Power management SLEEP Control logic Gate drive or 半 IN1 OCP Thermal shutdown OUT2 GND Sil erg yC orp .C on fi de nti a lP rep are OSC dF IN2 OUT1 AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 3 All Rights Reserved. AN_SY6702 Electrical Characteristics (TA = 25°C,VM=VCC=5V, unless otherwise specified) Parameter Power Supplies Symbol Test Conditions VM Operating Supply Current IVM No PWM 50KHz PWM, OUTx Float VM Sleep Mode Current IVMS VUVLO_RISE VUVLO_FALL Logic Level Input Input Low Voltage Input High Voltage Input Hysteresis Input Low Current Input High Current Pulldown Resistance H-Bridge MOSFETs HS + LS MOSFETs On Resistance Off-State Leakage Current Protection Output Over Current Limit Over Current Retry Time Thermal Shutdown Temperature Thermal Shutdown hysteresis VIL VIH VIHYS IIL IIH RPD Rdson IOFF Max Unit 40 0.8 30 µA mA nA 5 120 0.7 nA µA mA V V 2.2 2.1 0.8 2 0.2 -5 5 50 100 380 IO=800mA, TJ=25℃ VOUT=0V de nti a IOCP tOCPR TSD THYS VIN=0V VIN=3.3V Typ 导 小 芯 VCC Under voltage Lockout Voltage or 半 ICC SLEEP =0V No PWM 50KHz PWM, OUTx Float VCC Rising VCC Falling dF VCC Operating Supply Current SLEEP =0V ____________ rep are ICCS ____________ lP VCC Sleep Mode Current Min 1.9 140 V V V µA µA kΩ 430 ±200 mΩ nA 3.5 A ms °C °C 1 150 20 .C on fi Note 1: Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. orp Note 2: θ JA and θ JC are measured in the natural convection at T A = 25°C on a high effective four-layer thermal conductivity test board of JEDEC 51-5and 51-7 thermal measurement standard. Sil erg yC Note 3: Power dissipation and thermal limits must be observed. AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 4 All Rights Reserved. AN_SY6702 Typical performance characteristics Operation Waveform Operation Waveform (VCC=VM=5V, IO=0.5A, IN1=High) (VCC=VM=5V, IO=1.8A, IN1=High) OUT1 2V/div 2V/div OUT2 0.2V/div OUT2 0.5V/div IN2 5V/div IN2 5V/div IOUT1 0.5A/div or 半 导 小 芯 OUT1 IOUT1 Time (2μs/div) dF Time (2μs/div) Operation Waveform 0.5V/div IN2 5V/div 1A/div on fi IOUT1 lP OUT2 de nti a 5V/div rep are (VCC=VM=16V, IO=0.5A, IN1=High) OUT1 .C Time (2μs/div) Operation Waveform orp (VCC=VM=5V, IO=0.5A, IN2=IN1) 2V/div Operation Waveform (VCC=VM=16V, IO=1.8A, IN1=High) OUT1 5V/div OUT2 0.5V/div IN2 5V/div IOUT1 2A/div Time (2μs/div) Operation Waveform (VCC=VM=16V, IO=0.5A, IN2=IN1) OUT2 5V/div erg yC OUT2 2A/div 2V/div OUT1 5V/div IN1 5V/div IN1 5V/div Sil OUT1 IOUT1 1A/div Time (2μs/div) AN_SY6702 Rev.1.0A © 2018 Silergy Corp. IOUT1 1A/div Time (2μs/div) Silergy Corp. Confidential-prepared for Customer Use Only 5 All Rights Reserved. AN_SY6702 Operation Timing Requirements (TA = 25°C, VCC=3V, VM=5V, RL=20Ω, unless otherwise specified) Min Output Enable Time Output Disable Time Delay Time, INx High to OUTy Low Delay Time, INy Low to OUTx High Output Rise Time Output Fall Time Max 120 120 120 120 150 150 导 小 芯 t1 t2 t3 t4 t5 t6 50 50 Unit ns ns ns ns ns ns or 半 1 2 3 4 5 6 dF IN1 rep are IN2 t1 Z OUT2 Z t4 t2 Z de nti a lP OUT1 t3 Z on fi (a) .C 80% 20% orp OUTx 20% t5 yC erg 80% t6 (b) Figure 3. Input/Output Timing Sil H-Bridge Driving Control The Bridge is controlled by a PWM input interface, also called IN/IN interface. The following table shows the control logic of the device: IN1 0 0 1 1 IN2 0 1 0 1 AN_SY6702 Rev.1.0A © 2018 Silergy Corp. OUT1 Z L H L OUT2 Z H L L Function (DC Motor) Coast Reverse Forward Brake Silergy Corp. Confidential-prepared for Customer Use Only 6 All Rights Reserved. AN_SY6702 Sleep Mode ____________ If the SLEEP pin is brought to a logic-low state, the device enters a low-power sleep mode. In this state, all unnecessary internal circuitry is powered down. Over Current Protection (OCP) 导 小 芯 A current limit circuit on each MOSFET limits the current through the MOSFET by removing the gate drive. If this current limit persists for longer than the OCP time, all MOSFETs in the H-bridge are disabled. After approximately 1 ms, the bridge is re-enabled automatically. Over current conditions on both high and low side devices, that is, a short to ground, supply, or across the motor winding all result in an over current shutdown. or 半 Thermal Shutdown (TSD) If the die temperature exceeds safe limits, all MOSFETs in the H-bridge are disabled. Once the die temperature has fallen to a safe level, operation automatically resumes. dF Under Voltage Lockout (UVLO) Sil erg yC orp .C on fi de nti a lP rep are If at any time the voltage on the VCC pin falls below the undervoltage lockout threshold voltage, all circuitry in the device is disabled and internal logic is reset. Operation resumes when VCC rises above the UVLO threshold. AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 7 All Rights Reserved. AN_SY6702 rep are dF or 半 导 小 芯 DFN2x2-8 Package Outline (Type C) Side View Sil erg yC orp .C on fi de nti a lP Top View AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Bottom View Silergy Corp. Confidential-prepared for Customer Use Only 8 All Rights Reserved. de nti a lP rep are dF or 半 导 小 芯 AN_SY6702 .C All dimension in millimeter and exclude mold flash & metal burr. Sil erg yC orp Notes: on fi Recommended PCB layout (Reference only) AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 9 All Rights Reserved. AN_SY6702 Taping & Reel Specification 1. Taping orientation DFN2x2-8 3.9/4.1 dF or 半 7.7/8.3 导 小 芯 1.45/1.55 rep are Feeding direction 2. Carrier Tape & Reel specification for packages on fi de nti a lP Reel Width DFN2x2 Pocket pitch(mm) Reel size (Inch) Reel width(mm) Trailer length(mm) Leader length (mm) Qty per reel 4 7" 8.4 400 160 3000 erg Tape width (mm) Sil Package types yC orp .C Reel Size 8 3. Others: NA AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Silergy Corp. Confidential-prepared for Customer Use Only 10 All Rights Reserved. AN_SY6702 IMPORTANT NOTICE 1. Right to make changes. Silergy and its subsidiaries (hereafter Silergy) reserve the right to change any information published in this document, including but not limited to circuitry, specification and/or product design, manufacturing or descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to Silergy’s standard terms and conditions of sale. rep are dF or 半 导 小 芯 2. Applications. Application examples that are described herein for any of these products are for illustrative purposes only. Silergy makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Buyers are responsible for the design and operation of their applications and products using Silergy products. Silergy or its subsidiaries assume no liability for any application assistance or designs of customer products. 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Silergy products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of a Silergy product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Silergy assumes no liability for inclusion and/or use of Silergy products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. yC orp 5. Terms and conditions of commercial sale. Silergy products are sold subject to the standard terms and conditions of commercial sale, as published at http://www.silergy.com/stdterms, unless otherwise agreed in a valid written individual agreement specifically agreed to in writing by an authorized officer of Silergy. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. 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Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from Silergy under the patents or other intellectual property of Silergy. For more information, please visit: www.silergy.com © 2018 Silergy Corp. AN_SY6702 Rev.1.0A © 2018 Silergy Corp. Powered by TCPDF (www.tcpdf.org) All Rights Reserved. Silergy Corp. Confidential-prepared for Customer Use Only 11 All Rights Reserved.