BA401N

BA401N+ Order Code: BA401N+ Version: A2 2017-08-08 Gas Discharge Tube Exterior Features Small Size Design EIA 18124.5×3.2×2.7mm Current Handling Capability 1,000A @ 8/20μ s Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level: Level 1 SMD Application Information rmation Package (Top View) Ethernet ` xDSL 1 Agency Approvals 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 2 1 Compliance withIEC61249-2-21:2003 Mean lead free Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage Impulse Discharge Current 3) 100V/s 340-550 V At 1kV/μs for 99 % of measured values 1050 V At 1kV/μs Typical values of distribution900 V 1,000 A 8/20μs 10 operations [5x (+) & 5x (-)] Arc Voltage At 1A ~8 V Insulation Resistance DC=100V ≥1 GΩ Capacitance at 1 MHz VDC=0.5V ≤1.0 pF Weight ~0.20 g Operating And Storage Temperature -40-105 ℃ Marking Without 1) At delivery AQL0.65level I I ISO 2859 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 1 /3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BA401N+ Order Code: BA401N+ Version: A2 2017-08-08 Gas Discharge Tube Product Characteristics Characteristics Part Numbering System BA 401 N+ (1) (2) (3) (1) Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, e.g.: 401=40×101=400V (3) Tolerance of DC Breakdown Voltage, M±20%, N=± 30%, the Specific tolerance is decided by the table of Lead Material Copper or iron nickel alloy Body Material Ceramics Terminal Finish 100% Matte-Tin Plated “Electrical Parameter” Environmental Reliability Characteristics Testing items Technical standards Temperature: 105℃ Time: 2H Temperature: -40℃ Time: 2H Frequency: 10-500Hz Amplitude: 0.15mm Time: 45mins Temperature: 260±5℃ Time of dip soldering: 10s, 1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability Test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions A C REF mm inch A 4.5±0.3 0.177±0.012 B 0.5±0.2 0.020±0.008 C 2.7±0.2 0.106±0.008 D 3.2±0.2 0.126±0.008 REF mm inch A 5.5 0.217 B 3.5 0.138 C 3.5 0.138 D B Recommended Soldering Pad A B C 2 /3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BA401N+ Order Code: BA401N+ Version: A2 2017-08-08 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C 60 – 180 secs Time (min to max) Average ramp up rate (Liquidus) Tamp (TL) to peal TS(max) to TL - Ramp-up Rate (Liquidus) - Temperature (TL) Peak Temperature (TP) 217°C Critical Zone TL to TP Ramp-up TL 3°C/sec. max 3°C/sec. max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly TS(max) TL Ramp-down Preheat TS(min) 60 – 150 secs. tS 260+0/-5 °C Time within 5°C of actual peak 25 8 – 20 secs. Temperature (tp) time to peak temperature Ramp-down Rate 6°C/sec. max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Time Package Reel Information 3 /3 REF mm inch A 3.7±0.2 0.146±0.008 B 5.0±0.1 0.197±0.004 d Φ 1.5±0.1 Φ 0.059±0.004 E 1.75±0.1 0.069±0.004 F 5.5±0.1 0.217±0.002 P 8.0±0.1 0.315±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 W 12.0±0.2 0.472±0.008 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.5 0.512±0.02 W1 16.8±2.0 0.661±0.079 Carton Size (mm) Outline Reel (PCS) Per Carton (PCS) Reel Diameters (mm) L W H TAPING 2,500 40,000 330 360 360 380 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications