BF471M
Order Code: BF471M
Gas Discharge Tube
Version: A0
Exterior
Features
2016-03-29
Small Size Design 4.2×5.0×5.0mm Current Handling
Current Handling Capability 5,000A
,000A @ 8/20μs
Low Capacitance and Insertion Loss
Fast Response and Long Service Life
Moisture sensitivity level:Level 1
Application information
rmation
`
Package (Top View)
SM
SMD
xDSL
1
Agency Approvals
Schematic Symbol
Icon
Description
Compliance with 2011/65/EU
Electrical Parameter
Mean
ean lead free
DC Breakdown Voltage 1)2)
Impulse Spark-over Voltage
Impulse Discharge Current 3)
Arc Voltage
Insulation Resistance
Capacitance at 1MHz
Weight
Operating And Storage
100V/s
At 1kV/μs
At 1kV/μs
8/20μs
10 operations [5x (+) & 5x (-)]
(
376~564
for 99 % of measured values
At 1A
DC=100V
VDC=0.5V
1) At delivery AQL 0.65 level II GB/T 2828.1-2003
2828.1
2) In ionized mode
3) Terms and waveforms in accordance with ITU-T
ITU Rec. K. 12; IEC 61643-21
www.bencent.com.cn
850
Typical values of distribution 700
Temperature
Marking
2
1
Compliance with IEC61249-2-21:2003
IEC61249
1/ 3
2
V
V
V
5,000
,000
A
≥1
GΩ
-40-90
90
℃
~15
15
≤0.8
0.8
~0.5
5
V
pF
g
Without
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
BF471M
Order Code: BF471M
Gas Discharge Tube
Part Numbering System
BF
(1)
471
(2)
Version: A0
Product Characteristics
M
(3)
(1)Bencent Gas Discharge Tube
(2) Series: DC Breakdown Voltage,
e.g.:471=471×101=470V
(3) Tolerance of DC Breakdown Voltage, M=+-20%,
M=+
2016-03-29
Lead Material
Copper
Body Material
Ceramics
Terminal Finish
100% Matte-Tin Plated
N=+-30%,the Specific tolerance is decided by the
table of“Electrical Parameter”
Environmental Reliability Characteristics
Testing items
Technical
echnical standards
Temperature: 90℃
Time:2H
Temperature: -40℃
Time:2H
Frequency:10-500Hz
Amplitude:0.15mm
Time:45min
Temperature: 260±5℃
Time of dip soldering:10s,1time
High Temperature Storage Test
Low Temperature Storage Test
Vibration
Resistance of soldering heat
Note: Up-screen
screen program can be specified by customer’s request via contacting Bencent service
Solderability test
Solderability
Solder Pot Temperature:
245
245℃±5℃
Solder Dwell Time:
4-66 seconds
Product Dimensions
D
REF
C
B
inch
A
0.5±0.1
1
0.020±0.004
D
5.0±0.2
2
0.197±0.008
B
A
mm
C
4.2±0.3
3
5.0±0.2
2
0.165±0.012
0.197±0.008
Recommended Soldering Pad
A
B
C
2/ 3
REF
A
B
C
www.bencent.com.cn
mm
4.95
3.0
5.5
inch
0.195
0.118
0.217
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
BF471M
Order Code: BF471M
Gas Discharge Tube
Version: A0
2016-03-29
Reflow Profile
Reflow Condition
Heat
Temperature Min
150°C
Temperature Max
200°C
Time (min to max)
60 – 180 secs
Average ramp up rate(Liquids)Tamp
(TL) to peal
TS(max) to TL - Ramp-up Rate
3°C/second max
(Liquids)
- Temperature (TL)
Peak Temperature (TP)
217°C
60 – 150 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
25
Time
Information
B
W
16.0
.0±0.3
D2
www.bencent.com.cn
0.177±0.008
0.472±0.004
D1
W1
Reel Diameter (mm)
330
4.5
5±0.2
12.0
.0±0.1
D
16,000
0.209±0.004
P
F
1,000
5.3
5.3±0.1
Φ0.059±0.004
E
Per Carton
(PCS)
inch
Φ1.5
1.5±0.1
P1
Reel
(PCS)
m
mm
d
P0
3/ 3
Ramp-down
time
ime to peak temper ature
A
TAPING
Critical Zone
TL to TP
tS
REF
Outline
TL
Preheat
TS(min)
~10 seconds
Temperature (tp)
Package Reel
TS(max)
260+0/ °C
260+0/-5
Time within 5°C of actual peak
Ramp
Ramp-up
TL
3°C/second max
- Temperature (TL)
Reflow
tP
TP
Temperature
Pre
Pb--Free assembly
4.0
4.0±0.1
0.157±0.004
2.0
2.0±0.1
0.079±0.004
1.75
75±0.1
0.069±0.004
7.5
5±0.1
0.295±0.004
0.630±0.012
Φ330.0
330.0
Φ13.0
Φ50Min
50Min
Φ1.97Min
Φ13
13±0.15
0.512±0.006
16.8
16.8±2.0
L
360
0.661±0.079
Carton Size(mm)
W
360
H
380
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
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