SI2305
MOSFET
P-Channel MOSFET
ROHS
SOT-23
-
Features
Advanced trench process technology
High Density Cell Design For
Ultra Low On-Resistance
Maximum Ratings & Thermal Characteristics
℃
(Ratings at 25
ambient temperature unless otherwise specified.)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
-20
Gate-Source Voltage
VGS
±12
ID
-4.1
IDM
-15
Continuous Drain Current
Pulsed Drain Current
1)
Maximum Power Dissipation
TA = 25o
2)
o
TA = 75 C
Junction-to-Ambient Thermal Resistance (PCB mounted)
W
o
-55 to 150
C
100
RthJA
3)
A
0.8
2)
Junction-to-Ambient Thermal Resistance (PCB mounted)
V
1.25
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
o
C/W
166
Notes
1) Pulse width limited by maximum junction temperature.
2) Surface Mounted on FR4 Board, t v 5 sec.
3) Surface Mounted on FR4 Board.
Electrical Characteristics
( Ratings at 25℃ ambient temperature unless otherwise specified).
Parameter
Symbol
Test Condition
Min.
VGS = 0V, ID = -250uA
-20
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
BVDSS
1)
Drain-Source On-State Resistance
Gate Threshold Voltage
R DS(on)
VGS(th)
Zero Gate Voltage Drain Current 0
IDSS
VGS = -4.5V, ID = -4.1A
46
52
VGS = -2.5V, ID = -3.0A
60
75
mΩ
VDS =VGS, ID = -250uA
0.4
Forward Transconductance
1)
1
VDS = -20V, V GS = 0V
IGSS
VGS = ± 12V, V DS = 0V
gfs
VDS = -5V, ID = -3.5A
V
-1
uA
o
VDS = -20V, V GS = 0V TJ=55
Gate Body Leakage
V
C
-10
±100
6.5
nA
S
Dynamic
Total Gate Charge
Gate-Source Charge
Qg
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
5.8
VDS = -6V, ID ^ -3.5A
10
nC
0.85
VGS = -4.5V
1.7
13
25
36
60
42
70
34
60
VDD = -6V, RL=6Ω
Turn-On Rise Time
tr
Turn-Off Delay Time
td(off)
Turn-Off Fall Time
tf
Input Capacitance
Ciss
ID ^ -1.A, VGEN = -4.5V
RG = 6 Ω
ns
415
VDS = -6V, VGS = 0V
Output Capacitance
Coss
pF
223
f = 1.0 MHz
Reverse Transfer Capacitance
87
Crss
Source-Drain Diode
Max. Diode Forward Current
Diode Forward Voltage
IS
VSD
IS = -1.6A, VGS = 0V
-0.8
-1.6
A
-1.2
V
1) Pulse test: pulse width
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