TAI-TECH
TBM01-130600796
High Current Ferrite Chip Bead(Lead Free)
HCB1005KF-121T20
ECN HISTORY LIST
REV
1.0
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
楊祥忠
羅培君
張嘉玲
13/06/06 變更可靠度條件
備
註
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P1.
TAI-TECH
TBM01-130600796
High Current Ferrite Chip Bead(Lead Free)
P2.
HCB1005KF-121T20
1.Features
1. Monolithic inorganic material construction.
2. Closed magnetic circuit avoids crosstalk.
3. Suitable for reflow soldering.
4. Shapes and dimensions follow E.I.A. spec.
5. Available in various sizes.
Halogen
Pb
Halogen-free
Pb-free
6. Excellent solder ability and heat resistance.
7. High reliability.
8.100% Lead(Pb) & Halogen-Free and RoHS compliant.
9. Low DC resistance structure of electrode to prevent wasteful electric power consumption.
2.Dimensions
Chip Size
A
1.00±0.10
B
0.50±0.10
C
0.50±0.10
D
0.25±0.10
Units: mm
3.Part Numbering
HCB
1005
KF
A
B
C
A: Series
B: Dimension
C: Material
D: Impedance
E: Packaging
F: Rated Current
-
121
T
20
D
E
F
LxW
Lead Free Material
121=120Ω
T=Taping and Reel, B=Bulk(Bags)
20=2000mA
4.Specification
Tai-Tech
Part Number
Impedance (Ω)
Test Frequency
(Hz)
DC Resistance
(Ω) max.
Rated Current
(mA) max.
HCB1005KF-121T20
120±25%
60mV/100M
0.095
2000
HCB1005KF-121T20
300
IMPEDANCE(Ohm)
Impedance-Frequency Characteristics
200
Z
100
X
R
0
1
10
100
FREQUENCY(MHz)
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1000
TAI-TECH
TBM01-130600796
P3.
5. Reliability and Test Condition
Item
Series No.
Operating Temperature
Performance
FCB
FCM
HCI
--
-40~+125℃
(Including self-temperature rise)
-40~+105℃
(Including self-temperature rise)
--
-40~+125℃
-40~+105℃
Transportation
Storage Temperature
HCB
GHB
FCA
FCI
Test Condition
FHI
FCH
For long storage conditions, please see the
Application Notice
Agilent4291
Impedance (Z)
Agilent E4991
Inductance (Ls)
Agilent4287
Q Factor
Refer to standard electrical characteristics list
Agilent16192
DC Resistance
Agilent 4338
Rated Current
DC Power Supply
Over Rated Current requirements, there will be
some risk
1. Applied the allowed DC current.
2. Temperature measured by digital surface
thermometer.
Rated Current < 1A ∆T 20℃Max
Temperature Rise Test
Resistance to Soldering
Heat
Rated Current ≧ 1A ∆T 40℃Max
Preheat: 150℃,60sec.
Solder: Sn99.5%-Cu0.5%
Solder tamperature: 260±5℃
Flux for lead free: Rosin. 9.5%
Temperature ramp/immersion and immersion
rate: 25±6 mm/s
Dip time: 10±1sec.
Depth: completely cover the termination.
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:Shall not exceed the specification value.
Preheating Dipping Natural cooling
260° C
150° C
60
second
Preheating Dipping Natural cooling
More than 95% of the terminal
Solderability
245° C
electrode should be covered
with solder.
150° C
60
second
4±1
second
10±1.0
second
Preheat: 150℃,60sec.
Solder: Sn99.5%-Cu0.5%
Solder tamperature: 245±5℃
Flux for lead free: Rosin. 9.5%
Depth: completely cover the termination.
Dip time: 4±1sec.
Component mounted on a PCB apply a force
(>0805:1kg =0805:40x100x1.2mm
=0805:1.2mm
1GΩ
Derating
**Derating Curve
Derated Current(A)
6
For the ferrite chip bead which withstanding current over 1.5A, as the
operating temperature over 85℃, the derating current information is
necessary to consider with. For the detail derating of current, please
refer to the Derated Current vs. Operating Temperature curve.
5
4
3
2
1
6A
5A
4A
3A
2A
1.5A
1A
0
85
125
Environment Temperature+△Temperature(°C)
6.Soldering and Mounting
6-1. Recommended PC Board Pattern
Land Patterns For
Reflow Soldering
Chip Size
0.6±0.03
0.30±0.03
0.30±0.03 0.15±0.05
0.80
0.30
0.30
1005
1.0±0.10
0.50±0.10
0.50±0.10 0.25±0.10
1.50
0.40
0.55
1608
1.6±0.15
0.80±0.15
0.80±0.15 0.30±0.20
2.60
0.60
0.80
2.0±0.20
1.25±0.20
0.85±0.20 0.50±0.30
GHB
FCI
2.0±0.20
1.25±0.20
1.25±0.20 0.50±0.30
3.00
1.00
1.00
FHI
3216
3.2±0.20
1.60±0.20
1.10±0.20 0.50±0.30
4.40
2.20
1.40
3225
3.2±0.20
2.50±0.20
1.30±0.20 0.50±0.30
4.40
2.20
FCH
3.40
4516
4.5±0.20
1.60±0.20
1.60±0.20 0.50±0.30
5.70
2.70
HCI
1.40
4532
4.5±0.20
3.20±0.20
1.50±0.20 0.50±0.30
5.90
2.57
4.22
2012
Land
Solder Resist
2.8
0.8
0603
HCB
FCA3216
A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm)
2.2-2.6
FCB
FCM
Type
0.8
Pitch
0.4
L
PC board should be designed so that products can prevent damage from
mechanical stress when warping the board.
H
Series
G
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TAI-TECH
TBM01-130600796
P5.
6-2. Soldering
Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering
cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
Note.
If wave soldering is used ,there will be some risk.
Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk
6-2.1 Lead Free Solder re-flow:
Recommended temperature profiles for lead free re-flow soldering in Figure 1.
6-2.2 Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must
be employed the following precautions are recommended. for Iron Soldering in Figure 2.
•Preheat circuit and products to 150℃
•350℃ tip temperature (max)
•Never contact the ceramic with the iron tip
•1.0mm tip diameter (max)
Iron Soldering
Reflow Soldering
PRE-HEATING
SOLDERING
within 4~5s
217
TEMPERATURE(° C)
TP(260° C / 40s max.)
60~150s
200
150
NATURAL
COOLING
SOLDERING
PRE-HEATING
NATURAL
COOLING
20~40s
TEMPERATURE(° C)
•Use a 20 watt soldering iron with tip diameter of 1.0mm
•Limit soldering time to 4~5sec.
60~180s
350
150
Gradual cooling
Over 60s
480s max.
25
TIME(sec.)
TIME( sec.)
Reflow times: 3 times max
Fig.1
Iron Soldering times:1 times max
Fig.2
6-2.3 Solder Volume:
Accordingly increasing the solder volume, the mechanical stress to
product is also increased. Exceeding solder volume may cause the
failure of mechanical or electrical performance. Solder shall be used
not to be exceed as shown in right side:
Minimum fillet height = soldering thickness + 25% product height
Upper limit
Recommendable
t
7.Packaging Information
7-1. Reel Dimension
A
±0
.
.5
13
C
B
7"x8mm
0
R1
.5
B(mm)
C(mm)
D(mm)
7”x8mm
9.0±0.5
60±2
13.5±0.5
178±2
7”x12mm
13.5±0.5
60±2
13.5±0.5
178±2
R0.5
120°
7"x12mm
7-2.1 Tape Dimension / 8mm
■Material of taping is paper
.0
-0
.1
+0
.5
1
D:
F:3.5±0.05
B0
t
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
0.50max
2.0±0.05
0.50max
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
100505
1.12±0.03 0.62±0.03 0.60±0.03
2.0±0.10
0.60±0.03
160808
1.85±0.05 1.05±0.05 0.95±0.05
4.0±0.10
0.95±0.05
201209
2.30±0.05 1.50±0.05 0.95±0.05
4.0±0.10
0.95±0.05
060303
P
P0:4±0.1
05
0.
10.
+
56
1.
D:
t
B0
P
0.68±0.05 0.38±0.05
Ko
A0
A0
W:8.0±0.1
P2:2±0.1
F:3.5±0.1
W:8.0±0.3
E:1.75±0.1
P0:4±0.1
E:1.75±0.1
D
R1
.9
A(mm)
5
Type
2±0.5
Ko
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TAI-TECH
TBM01-130600796
P6.
■Material of taping is plastic
Po:4±0.1
1
0.
5+
1.
:
D
t
A
P
±
:1
D1
F:3.5±0.05
A
Bo
W:8.0±0.1
E:1.75±0.1
P2:2±0.05
Ko
1
0.
Ao
SECTION A-A
Size
Bo(mm) Ao(mm) Ko(mm)
P(mm)
t(mm)
D1(mm)
160808
1.95±0.10 1.05±0.10 1.05±0.10
4.0±0.10
0.23±0.05
none
201209
2.25±0.10 1.42±0.10 1.04±0.10
4.0±0.10
0.22±0.05
1.0±0.10
201212
2.35±0.10 1.50±0.10 1.45±0.10
4.0±0.10
0.22±0.05
1.0±0.10
321611
3.50±0.10 1.88±0.10 1.27±0.10
4.0±0.10
0.22±0.05
1.0±0.10
322513
3.42±0.10 2.77±0.10 1.55±0.10
4.0±0.10
0.22±0.05
1.0±0.10
321609
3.40±0.10 1.77±0.10 1.04±0.10
4.0±0.10
0.22±0.05
1.0±0.10
Size
Bo(mm) Ao(mm) Ko(mm) P(mm)
7-2.2 Tape Dimension / 12mm
1.75±0.1
Po:4±0.1
P2:2.0±0.05
t
D1:1.5±0.1
Bo
W:12.0±0.1
5.5±0.05
D:1.5+0.1
t(mm)
D1(mm)
451616
4.95±0.1
1.93±0.1
1.93±0.1
4.0±0.1
0.24±0.05
1.5±0.1
453215
4.95±0.1
3.66±0.1
1.85±0.1
8.0±0.1
0.24±0.05
1.5±0.1
Ko
P
Ao
7-3. Packaging Quantity
Chip Size
453215
451616
322513
321611
321609
201212
201209
160808
100505
060303
Chip / Reel
1000
2000
2500
3000
3000
2000
4000
4000
10000
15000
Inner box
4000
8000
12500
15000
15000
10000
20000
20000
50000
75000
Middle box
20000
40000
62500
75000
75000
50000
100000
100000
250000
375000
Carton
40000
80000
125000
150000
150000
100000
200000
200000
500000
750000
7-4. Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 15 to 60 grams
in the arrow direction under the following conditions.
165° to180°
Base tape
Room Temp.
Room Humidity
Room atm
Tearing Speed
(℃)
(%)
(hPa)
mm/min
5~35
45~85
860~1060
300
Application Notice
•Storage Conditions
To maintain the solder ability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months from the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
•Transportation
1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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