TAI-TECH
P1
Power Inductor
DFP252012TF-SERIES
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
13/10/30
新 發 行
楊祥忠
詹偉特
林宜蕰
備
註
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TAI-TECH
P2
Power Inductor
DFP252012TF-SERIES
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Halogen
Pb
Halogen-free
Pb-free
B
A
D
E
D
C
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
DFP252012TF
2.5 -0.1/+0.2
2.0 -0.05/+0.35
1.2Max
0.85 ref. 0.80 ref.
Units: mm
3. Part Numbering
DFP
252012 TF
A
B
-
R47
M
D
E
C
A: Series
B: Dimension
C: Lead Free
Material
D: Inductance
E: Inductance Tolerance
R47=0.47uH
M=±20%
4. Specification
TAI-TECH
Part Number
Inductance Tolerance
(uH)
(%)
Test
Frequency
(Hz)
DCR
(Ω) typ.
DCR
(Ω) Max.
I sat
(A) typ.
I sat
(A) Max.
I rms
(A) typ
DFP252012TF-R24M
0.24
±20%
0.1V/1M
0.020
0.024
8.00
6.50
4.70
DFP252012TF-R33M
0.33
±20%
0.1V/1M
0.027
0.032
5.70
4.60
4.50
DFP252012TF-R47M
0.47
±20%
0.1V/1M
0.027
0.032
5.50
4.50
4.40
DFP252012TF-R68M
0.68
±20%
0.1V/1M
0.036
0.043
4.50
3.80
3.60
DFP252012TF-1R0M
1.0
±20%
0.1V/1M
0.045
0.057
3.90
3.40
3.50
DFP252012TF-1R5M
1.5
±20%
0.1V/1M
0.080
0.096
3.00
2.60
2.50
0.1V/1M
0.085
0.102
2.70
2.30
2.30
DFP252012TF-2R2M
2.2
±20%
Note:
Isat:Based on inductance change (△L/L0:≦-30%)@ ambient temp. 25℃
Irms:Based on temperature rise (△T:40℃.)Max
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TAI-TECH
P3
DFP252012TF-R24
DFP252012TF-R33
0.4
0.5
0.4
Inductance(uH)
Inductance(uH)
0.3
0.2
0.1
0.3
0.2
0.1
0
0
2
4
6
8
0
DCcurrent(A)
0
2
4
6
8
DCcurrent(A)
DFP252012TF-R47
0.8
DFP252012TF-R68
1
0.8
Inductance(uH)
Inductance(uH)
0.6
0.4
0.2
0.6
0.4
0.2
0
0
2
4
6
8
0
DCcurrent(A)
0
1
2
3
4
5
2.4
3
DCcurrent(A)
DFP252012TF-1R0
DFP252012TF-1R5
2
2.5
2
Inductance(uH)
Inductance(uH)
1.5
1
1.5
1
0.5
0.5
0
0
1
2
3
0
4
0
DCcurrent(A)
DFP252012TF-2R2
Inductance(uH)
3
2
1
0
0.5
1
1.2
1.8
DCcurrent(A)
4
0
0.6
1.5
2
2.5
DCcurrent(A)
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TAI-TECH
P4
5. Material List
No.
Description
Specification
a.
Core
Ferrite Core
b.
Coating
Epoxy with magnetic powder
c
Termination
Tin( Pb Free)
d
Wire
Enameled Copper Wire
Exposed wire tolerance limit of coating resin part on product side.
Size of exposed wire occurring to coating resin is specified below.
1. Width direction(dimension a):Acceptable when a≦w/2
Nonconforming when a>w/2
2. Length direction(dimension b):Dimension b is not specified.
3. The total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, and is acceptable.
6. Reliability and Test Condition
Item
Operating Temperature
Performance
Test Condition
-55~+125℃(For products in unopened tape package, less than 40℃)
Electrical Performance Test
Agilent-4291, Agilent-4287
Inductance L
Refer to standard electrical characteristic list
Agilent-4291
DC Resistance
Rated Current
Temperature Rise Test
Agilent-4338
Base on temp. rise & △L/L0A≦30%.
Saturation DC Current (Isat) will cause L0
to drop approximately △L(%).
Heat Rated Current (Irms) will cause the coil temperature rise
approximately △T(℃) without core loss.
ΔT 40℃ Max
1.Applied the allowed DC current.
2.Temperature measured by digital surface thermometer
Mechanical Performance Test
Appearance:No damage.
Inductance:within±10% of initial value
Solder Heat Resistance
RDC:within ±15% of initial value and shall not exceed the specification value
Temperature
(°C)
Time
(s)
Temperature
ramp/immersion
and
emersion
rate
260 ±5
(solder temp)
10 ±1
25mm/s±6 mm/s
Depth: completely cover the termination
Solderability Test
More than 95% of terminal electrode should be covered with solder.
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Preheat: 150℃,60sec.。
Solder: Sn99.5%-Cu0. 5%。
Temperature: 245±5℃。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec。
Depth: completely cover the termination
Number
of heat
cycles
1
TAI-TECH
P5
Item
Performance
Test Condition
Reliability Test
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature:125±2℃(Bead)
Life Test
Temperature: 85±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Thermal shock
Appearance:No damage.
Step3:105±2℃ 30±5min
Inductance:within±10% of initial value
Number of cycles: 500
Measured at room fempraturc after placing for 24±2 hrs
RDC:within ±15% of initial value and shall not exceed the specification value
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Humidity Resistance Test
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Oscillation Frequency: 10〜2K〜10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Vibration Test
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TAI-TECH
P6
7. Soldering and Mounting
7-1. Soldering
Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems.
If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools.
7-1.1 Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
7-1.2 Soldering Iron(Figure 2):
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
•Preheat circuit and products to 150℃
•Never contact the ceramic with the iron tip
•Use a 20 watt soldering iron with tip diameter of 1.0mm
•355℃ tip temperature (max)
•1.0mm tip diameter (max)
•Limit soldering time to 4~5 sec.
Iron Soldering
Reflow Soldering
PRE-HEATING
SOLDER ING
20~40s
PRE-H EATING
NATURAL
CO OLING
TEMPERATURE( C)
TEMPERATURE( C)
TP(260 C / 40s max.)
217
60~150s
200
150
SOLDERING
within 4~5s
60~180s
N ATUR AL
C OOLING
350
150
Gradual cooling
O ver 60s
480s max.
25
TIME(sec.)
TIME( sec.)
Reflow times: 3 times max.
Iron Soldering times: 1 times max.
Fig.1
Fig.2
7-2. Recommended PC Board Pattern
H
L
L(mm)
G(mm)
H(mm)
2.9
0.8
2.4
G
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TAI-TECH
P7
8. Packaging Information
8-1. Reel Dimension
C
B
D
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
7”x8mm
8.4±1.0
50 min.
13±0.8
178±2
7"x8mm
8-2. Tape Dimension / 8mm
t
P
Ao
Bo
Po:4∮0.1
W:8.0∮0.1
P2:2∮
0.05
Series
Size
DFP
252012
Bo(mm) Ao(mm) Ko(mm) P(mm)
2.85±0.1
2.45±0.1
1.40±0.1
4.0±0.1
t(mm)
0.23±0.05
Ko
8-3. Packaging Quantity
Chip size
252012
Chip / Reel
2000
8-4. Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 15 to 80 grams
in the arrow direction under the following conditions.
165 to180
Base tape
Room Temp.
Room Humidity
Room atm
Tearing Speed
(℃)
(%)
(hPa)
mm/min
5~35
45~85
860~1060
300
Application Notice
•Storage Conditions
To maintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
•Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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