P1
TAI-TECH
High Frequency Winding Type Chip Inductor
SWI0603F-43NG
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/05/09
新 發 行
楊祥忠
徐鋒強
張展耀
備
註
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P2
TAI-TECH
High Frequency Winding Type Chip Inductor
SWI0603F-43NG
1. Features
Halogen
Pb
Halogen-free
Pb-free
1.Ceramic core wire wound construction.
2.No batch to batch variations in inductance
3.High Reliability due to ceramic wire wound construction.
4.High frequency application.
5.Small footprint as well as low profile.
6.100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimensions
Size
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
SWI0603
1.80 max.
1.20 max.
1.20 max.
0.38 ref.
0.35±0.1
Unit:mm
3. Part Numbering
SWI
0603
F
A
B
C
A: Series
B: Dimension
C: Lead free type
D: Inductance
E: Inductance Tolerance
-
43N
G
D
E
LxW
43N=43.0nH
G=±2%
4. Specification
Part Number
SWI0603F-43NG
Inductance
(nH)
43
Tolerance
G
Test Frequency
Q @ 250MHz
Rated Current
DCR
SRF
(Hz)
min.
(mA) max.
(Ω) max.
(MHz) min.
0.1V/250M
38
600
0.28
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5. Materials
No.
Description
Specification
a.
Upper Plate
UV Glue
b.
Core
Ceramics Core
c
Termination
Tin Pb Free
d
Wire
Enameled Copper Wire
6. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
-40~+125℃ (on board)
Test Condition
Electrical Performance Test
Inductance L
Agilent-4291, Agilent-4287
Agilent-4192, Agilent-4285
Q
Agilent-4291
SRF
Refer to standard electrical characteristic list
DC Resistance
Agilent-4192
Agilent-34420A
Applied the current to coils, the inductance change shall be less
Rated Current
than 20% to initial value.
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃
Life Test
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Load Humidity
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Moisture Resistance
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value e
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Thermal
shock
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Vibration
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
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Item
Performance
Bending
Shock
Solder ability
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
More than 95% of the terminal electrode should
be covered with solder。
Test Condition
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805:1kg ,
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