TMPA0402SP-3R3MN-D

厂商：
TAI-TECH(台庆)
封装：
IND_4.45X4.1MM_SM
描述：
功率电感 3.3µH ±20% 65mΩ IND_4.45X4.1MM_SM

数据手册：

下载TMPA0402SP-3R3MN-D.pdf

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详情介绍
数据手册
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TMPA0402SP-3R3MN-D 数据手册

TAI-TECH SMD Power Inductor TMPA0402SP-Series ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 18/11/01 新發行羅宜春梁周虎許靜備注 TAI-TECH SMD Power Inductor TMPA0402SP-Series 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. Halogen Pb Halogen-free Pb-free 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions C A Recommend PC Board Pattern D E B 100 H L G Series A B C TMPA0402SP 4.45±0.25 4.10±0.20 D 1.8±0.2 Unit:mm 4. Part Numbering TMPA 0402 SP A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance - 100 MN D E E 0.8±0.25 2.0±0.20 L(mm) G(mm) H(mm) 5.2 2.2 2.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. BxC Standard. R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.100 Unidirectional printing. TAI-TECH 5. Specification Heat Rating Current DC ( A ) Irms. Saturation Current DC (A)I sat Part Number Inductance L0 A(uH) ±20% Typ Max Typ Max TMPA0402SP-R10MN 0.10 16 14 26 TMPA0402SP-R22MN 0.22 14 12.5 TMPA0402SP-R47MN 0.47 10 9.0 TMPA0402SP-R68MN 0.68 9.0 8.0 7.6 TMPA0402SP-R82MN 0.82 8.0 7.0 6.0 TMPA0402SP-1R0MN 1.00 7.5 6.5 TMPA0402SP-1R5MN 1.50 6.7 TMPA0402SP-2R2MN 2.20 5.5 TMPA0402SP-3R3MN 3.30 TMPA0402SP-4R7MN 4.70 TMPA0402SP-5R6MN TMPA0402SP-6R8MN DCR (mΩ)Typ DCR (mΩ)Max 22 2.9 3.2 15 13 4.8 5.5 9.0 8.0 9.5 11 6.6 11.6 13.5 5.5 16.3 18.8 5.5 5.0 19 22 5.8 5.2 4.8 27 31 5.0 4.5 4.0 41 48 4.5 3.5 3.1 2.7 65 75 3.8 3.2 2.8 2.5 84 95 5.60 3.2 2.8 2.6 2.3 97 115 6.80 2.9 2.5 2.4 2.1 131 157 TMPA0402SP-8R2MN 8.20 2.6 2.3 2.2 2.0 140 168 TMPA0402SP-100MN 10.0 2.4 2.2 2.1 1.9 165 215 TMPA0402SP-150MN 15.0 1.5 1.3 1.6 1.4 325 374 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Material List NO Items 1 Core Alloy Powder . Materials 2 Wire Polyester Wire or equivalent. 3 Clip 100% Pb free solder(Ni+Sn---Plating) 4 Ink Halogen-free ketone 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature 1. -10~+40℃,50~60%RH (Product with taping) 2. -40~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30%. Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Temperature： 125±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs. Life Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Humidity：85±2﹪R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs. Load Humidity Moisture Resistance Thermal shock Vibration Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65 ± 2 ℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25 ℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：125±2℃ 30±5minNumber of cycles： 500 Measured at room fempraturc after placing for 24±2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDECJ-STD-020DClassification Reflow Profiles) Oscillation Frequency: 10～2K～10Hz for 20 minutes Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 TAI-TECH Item Performance Bending Shock Solder ability Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with solder。 Test Condition Shall be mounted on a FR4 substrate of the following dimensions: >=0805 inch(2012mm):40x100x1.2mm =0805 inch(2012mm):1.2mm 0805:1kg ,

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TMPA0402SP-3R3MN-D

1. 物料型号: TMPA0402SP系列，有多种型号，包括R10MN、R22MN、R47MN等，每种型号具有不同的电感值和公差。

2. 器件简介: 该系列电感器具有屏蔽结构，能够应对高频应用，低直流电阻(DCR)实现低损耗，采用金属粉末芯实现高性能(Isat)，无卤素、无铅，超低噪音，符合RoHS标准，工作温度范围为-40~+125℃。

3. 引脚分配: 引脚分配的详细信息在文档中未明确列出，但提到了PCB布局推荐，包括焊盘尺寸和推荐焊膏厚度。

4. 参数特性: 提供了详细的规格参数，包括电感值、额定直流电流、饱和直流电流、直流电阻等。

5. 功能详解: 电感器适用于多种应用，包括分布式电源系统中的DC/DC转换器、FPGA的DC/DC转换器、电池供电设备、交换机的薄型板载电源模块、服务器的VRM、高电流低剖面POL转换器等。

6. 应用信息: 列出了电感器的推荐应用领域，如上所述。

7. 封装信息: 提供了封装尺寸和推荐的PCB布局图案。

8. 材料清单: 列出了制造电感器使用的材料，包括合金粉末芯、聚酯线或等效物、无铅焊料(Ni+Sn---镀层)、无卤素酮油墨。

9. 可靠性和测试条件: 包括工作温度、储存温度、电气性能测试、寿命测试、负载湿度测试、耐湿性测试、热冲击测试、振动测试等。

10. 焊接和安装: 提供了焊接推荐，包括使用温和活性助焊剂、再流焊接温度曲线、烙铁焊接的注意事项等。