TMPA1004S-4R7MN-D

TAI-TECH SMD Power Inducto TMPA1004S-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency . Halogen 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. Halogen-free 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 8. 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions C D 2R2 1907 E B A A` Customer Recommend PC Board leadframe C L H 1R0 1907 Pattern D E B A A` G non-leadframe Series A A` B C D E TMPA1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2 2.0±0.3 See Spec table Unit:mm 4. Part Numbering TMPA A 1004 B A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: D/C S C - 1R0 D MN E - D F BxC Standard. R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.1R0 and 1907(19YY, 07WW,follow production date). L(mm) G(mm) H(mm) 12.5 5.4 3.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. TAI-TECH 5. Specification Heat Rating Current DC I rms ( A ) Saturation Current DC I sat ( A ) Part Number Inductance L0 A(uH) ±20% Typ Max Typ Max TMPA1004S-R15YN-D 0.15±30% 44.0 38.0 82.0 TMPA1004S-R22MN-D 0.22 36.0 33.0 TMPA1004S-R36MN-D 0.36 33.0 29.0 TMPA1004S-R42MN-D 0.42 32.5 TMPA1004S-R47MN-D 0.47 32.0 TMPA1004S-R56MN-D 0.56 TMPA1004S-R68MN-D 0.68 TMPA1004S-1R0MN-D TMPA1004S-1R5MN-D DCR (mΩ)Typ DCR (mΩ)Max E(mm) ±0.3 Type 75.0 0.5 0.6 3.0 non-leadframe 70.0 60.0 0.72 0.83 3.0 non-leadframe 51.0 45.0 1.05 1.18 3.0 non-leadframe 28.5 50.0 42.0 1.15 1.3 3.0 non-leadframe 28.0 46.0 40.0 1.3 1.5 3.0 non-leadframe 25.0 23.0 34.0 29.0 1.6 1.8 2.5 non-leadframe 23.0 20.0 31.0 28.0 1.9 2.2 2.5 non-leadframe 1.00 20.0 18.0 29.0 26.0 2.9 3.25 2.5 non-leadframe 1.50 17.5 16.0 26.0 22.0 3.7 4.2 2.5 non-leadframe TMPA1004S-1R8MN-D 1.80 16.5 15.0 23.0 20.5 5.1 5.7 3.0 leadframe TMPA1004S-2R0MN-D 2.00 16.0 14.5 21.0 18.0 5.3 6.1 3.0 leadframe TMPA1004S-2R2MN-D 2.20 15.0 13.0 20.0 16.0 5.8 6.7 3.0 leadframe TMPA1004S-3R3MN-D 3.30 11.0 10.0 17.5 14.0 10.5 11.8 3.0 leadframe TMPA1004S-4R7MN-D 4.70 8.8 8.0 15.2 13.0 15.8 19 3.0 leadframe TMPA1004S-5R6MN-D 5.60 8.0 7.2 14.1 11.5 19 22.8 3.0 leadframe TMPA1004S-6R8MN-D 6.80 7.8 6.8 12.2 11.0 22 24.5 3.0 leadframe TMPA1004S-8R2MN-D 8.20 7.6 6.5 9.5 8.5 25 28 3.0 leadframe TMPA1004S-100MN-D 10.0 7.5 6.1 8.6 7.5 27 30 3.0 leadframe TMPA1004S-150MN-D 15.0 6.25 5.0 7.0 6.0 41 45 3.0 leadframe TMPA1004S-220MN-D 22.0 5.0 4.1 6.2 5.5 58 66 3.0 leadframe TMPA1004S-330MN-D 33.0 4.4 3.5 5.5 5.0 84 91 3.0 leadframe TMPA1004S-470MN-D 47.0 3.5 3.0 4.0 3.7 125 143 3.0 leadframe TMPA1004S-680MN-D 68.0 2.6 2.4 3.2 3.0 184 210 3.0 leadframe TMPA1004S-820MN-D 82.0 2.3 2.1 3.0 2.8 240 270 3.0 leadframe TMPA1004S-101MN-D 100 2.0 1.8 2.7 2.4 270 310 3.0 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 11. Typical Performance Curves TAI-TECH