TAI-TECH
SMD Power Inducto
TMPA1004S-Series(N)-D
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency .
Halogen
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
Halogen-free
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
8.
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
C
D
2R2
1907
E
B
A
A`
Customer Recommend PC Board
leadframe
C
L
H
1R0
1907
Pattern
D
E
B
A
A`
G
non-leadframe
Series
A
A`
B
C
D
E
TMPA1004 11.0±0.3 10.0±0.3 10.0±0.3 3.8±0.2 2.0±0.3
See Spec
table
Unit:mm
4. Part Numbering
TMPA
A
1004
B
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: D/C
S
C
-
1R0
D
MN
E
-
D
F
BxC
Standard.
R10=0.1uh,1R0=1.0uh,100=10uh,101=100uh,102=1000uh.
K=±10%,L=±15%,M=±20%,N=±25%,Y=±30%
Marking: Black.1R0 and 1907(19YY, 07WW,follow production date).
L(mm)
G(mm)
H(mm)
12.5
5.4
3.5
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
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5. Specification
Heat Rating
Current DC
I rms ( A )
Saturation
Current DC
I sat ( A )
Part Number
Inductance
L0 A(uH)
±20%
Typ
Max
Typ
Max
TMPA1004S-R15YN-D
0.15±30%
44.0
38.0
82.0
TMPA1004S-R22MN-D
0.22
36.0
33.0
TMPA1004S-R36MN-D
0.36
33.0
29.0
TMPA1004S-R42MN-D
0.42
32.5
TMPA1004S-R47MN-D
0.47
32.0
TMPA1004S-R56MN-D
0.56
TMPA1004S-R68MN-D
0.68
TMPA1004S-1R0MN-D
TMPA1004S-1R5MN-D
DCR
(mΩ)Typ
DCR
(mΩ)Max
E(mm)
±0.3
Type
75.0
0.5
0.6
3.0
non-leadframe
70.0
60.0
0.72
0.83
3.0
non-leadframe
51.0
45.0
1.05
1.18
3.0
non-leadframe
28.5
50.0
42.0
1.15
1.3
3.0
non-leadframe
28.0
46.0
40.0
1.3
1.5
3.0
non-leadframe
25.0
23.0
34.0
29.0
1.6
1.8
2.5
non-leadframe
23.0
20.0
31.0
28.0
1.9
2.2
2.5
non-leadframe
1.00
20.0
18.0
29.0
26.0
2.9
3.25
2.5
non-leadframe
1.50
17.5
16.0
26.0
22.0
3.7
4.2
2.5
non-leadframe
TMPA1004S-1R8MN-D
1.80
16.5
15.0
23.0
20.5
5.1
5.7
3.0
leadframe
TMPA1004S-2R0MN-D
2.00
16.0
14.5
21.0
18.0
5.3
6.1
3.0
leadframe
TMPA1004S-2R2MN-D
2.20
15.0
13.0
20.0
16.0
5.8
6.7
3.0
leadframe
TMPA1004S-3R3MN-D
3.30
11.0
10.0
17.5
14.0
10.5
11.8
3.0
leadframe
TMPA1004S-4R7MN-D
4.70
8.8
8.0
15.2
13.0
15.8
19
3.0
leadframe
TMPA1004S-5R6MN-D
5.60
8.0
7.2
14.1
11.5
19
22.8
3.0
leadframe
TMPA1004S-6R8MN-D
6.80
7.8
6.8
12.2
11.0
22
24.5
3.0
leadframe
TMPA1004S-8R2MN-D
8.20
7.6
6.5
9.5
8.5
25
28
3.0
leadframe
TMPA1004S-100MN-D
10.0
7.5
6.1
8.6
7.5
27
30
3.0
leadframe
TMPA1004S-150MN-D
15.0
6.25
5.0
7.0
6.0
41
45
3.0
leadframe
TMPA1004S-220MN-D
22.0
5.0
4.1
6.2
5.5
58
66
3.0
leadframe
TMPA1004S-330MN-D
33.0
4.4
3.5
5.5
5.0
84
91
3.0
leadframe
TMPA1004S-470MN-D
47.0
3.5
3.0
4.0
3.7
125
143
3.0
leadframe
TMPA1004S-680MN-D
68.0
2.6
2.4
3.2
3.0
184
210
3.0
leadframe
TMPA1004S-820MN-D
82.0
2.3
2.1
3.0
2.8
240
270
3.0
leadframe
TMPA1004S-101MN-D
100
2.0
1.8
2.7
2.4
270
310
3.0
leadframe
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
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11. Typical Performance Curves
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