TMPA0603S-2R2MN-D

TAI-TECH SMD Power Inductor TMPA0603S-Series(N)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 15/07/02 新發行 楊祥忠 詹偉特 何秦芝 備 注 TAI-TECH SMD Power Inductor TMPA0603S-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency (5MHz). Halogen Pb Halogen-free Pb-free 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions Recommend PC Board Pattern C A D L H E B 1R0 1526 T Series TMPA0603 A B G C E T L(mm) G(mm) H(mm) 3.0±0.2 0~0.15 8.0 3.7 3.4 D 7.1±0.3 6.6±0.2 2.8±0.2 1.6±0.3 Note: Only for reference. Unit:mm 4. Part Numbering TMPA 0603 S A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code - 1R0 MN D E - D F BxC Standard. R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.1R0 and 1526(15 YY, 26 WW,follow production date). TAI-TECH 5. Specification Part Number Inductance L0 A(uH) ±20% Heat Rating Current DC Typ ( A ) Irms. Saturation Current DC Typ (A)I sat DCR (mΩ)Typ DCR (mΩ)Max TMPA0603S-R15YN-D 0.15±30% 30 40 1.7 2.1 TMPA0603S-R22MN-D 0.22 23 34 2 2.5 TMPA0603S-R33MN-D 0.33 21 25 2.8 3.4 TMPA0603S-R36MN-D 0.36 20 24 3.3 3.9 TMPA0603S-R47MN-D 0.47 18 20 3.4 4 TMPA0603S-R56MN-D 0.56 16.5 18 3.9 4.5 TMPA0603S-R68MN-D 0.68 16 17 4.7 5.3 TMPA0603S-R82MN-D 0.82 14 16 5.4 6 TMPA0603S-1R0MN-D 1.00 12 15 6.7 7.4 TMPA0603S-1R2MN-D 1.20 10 14 7.7 9.5 TMPA0603S-1R5MN-D 1.50 10 14 10.2 12.1 TMPA0603S-2R2MN-D 2.20 8 10 13.5 15 TMPA0603S-3R3MN-D 3.30 6.5 9.5 19 22 TMPA0603S-4R7MN-D 4.70 5.5 6.5 28 33 TMPA0603S-5R6MN-D 5.60 5.5 6 39 42 TMPA0603S-6R8MN-D 6.80 4.5 6 43 50 TMPA0603S-8R2MN-D 8.20 4.5 6 54 60 TMPA0603S-100MN-D 10.0 4 5.5 62 68 TMPA0603S-150MN-D 15.0 3 4.5 110 140 TMPA0603S-220MN-D 22.0 2.5 3 150 190 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH 6. Material List NO Items 1 Core Materials Alloy Powder . 2 Wire 3 Solder Plating 100% Pb free solder Polyester Wire or equivalent. 4 Ink Halogen-free ketone 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L≦30% typical. Saturation DC Current (Isat) will cause L0 to drop △L(%)(keep quickly). Heat Rated Current (Irms) Approximately △T≦40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature：125±2℃(Bead) Life Test Temperature： 85±2℃(Inductor) Applied current：rated current Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪ R.H, Load Humidity Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. Thermal shock RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：105±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Type Peak value (g’s) Normal duration (D) (ms) SMD 1500 Lead 100 Shock Bending Wave form Velocity change (Vi)ft/sec 0.5 Half-sine 15.4 6 Half-sine 12.3 Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,