TMPC0605H-100MG-D

TAI-TECH P1 SMD Power Inductor TMPC0605H-Series(G)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 15/06/05 新發行 楊祥忠 詹偉特 何秦芝 備 注 TAI-TECH P2 SMD Power Inductor TMPC0605H-Series(G)-D 1. Features 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. Halogen Pb Halogen-free Pb-free 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter . 3. Dimensions Recommend PC Board Pattern Dr. MOS application C A D E B 　 1R0 1151 H L G Series A(mm) TMPC0605H B(mm) 7.3±0.3 6.6±0.3 C(mm) D(mm) 1.8±0.3 4.8±0.2 E(mm) L(mm) G(mm) H(mm) 3.0±0.3 8.4 2.5 3.5 4. Part Numbering TMPC 0605 H A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: 印 D/C - 1R0 MG D E - D F BxC Carbonyl Powder. 1R0=1.00uH M=±20% 印字:黑色 1R0 及 D/C 1151 (11 年,51 週期)(依實際生產日期而定). TAI-TECH P3 5. Specification Part Number Inductance L0 (uH)±20% @ 0 A I rms (A) Typ. I sat (A) Typ. DCR (mΩ) Typ.@25℃ DCR (mΩ) Max.@25℃ TMPC0605H-R22MG-D 0.22 25 35 1.6 1.9 TMPC0605H-R33MG-D 0.33 25 32 2.5 3.0 TMPC0605H-R40MG-D 0.40 23 31 3.1 3.7 TMPC0605H-R47MG-D 0.47 22 30 3.5 3.9 TMPC0605H-R56MG-D 0.56 20 27 3.6 4.2 TMPC0605H-R60MG-D 0.60 19 25 3.8 4.3 TMPC0605H-R68MG-D 0.68 18 24 4.0 4.5 TMPC0605H-R82MG-D 0.82 16.5 22 4.6 4.9 TMPC0605H-1R0MG-D 1.00 15 20 6.1 6.5 TMPC0605H-1R2MG-D 1.20 14 18 6.7 7.5 TMPC0605H-1R5MG-D 1.50 12 16.5 8.6 9.0 TMPC0605H-1R8MG-D 1.80 12 15 9.5 11.0 TMPC0605H-2R2MG-D 2.20 10 14 11.2 12.0 TMPC0605H-3R3MG-D 3.30 8 12 19 20.9 TMPC0605H-4R7MG-D 4.70 6.5 10 28 30.8 TMPC0605H-5R6MG-D 5.60 6.0 9.0 43.5 49 TMPC0605H-6R8MG-D 6.80 5.5 8.5 46 51.5 TMPC0605H-8R2MG-D 8.20 5.0 8.0 56 63 TMPC0605H-100MG-D 10.0 4.0 7.5 60 69 TMPC0605H-150MG-D 15.0 3.5 6.0 81 92 TMPC0605H-220MG-D 22.0 2.5 5.5 140 170 TMPC0605H-470MG-D 47.0 1.9 2.7 290 330 TMPC0605H-560MG-D 56.0 1.6 2.1 342 396 TMPC0605H-680MG-D 68.0 1.2 2.0 386 445 Note: 1. Test frequency : L : 100KHz /1.0V; 2. All test data referenced to 25℃ ambient. 3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.). 5. Saturation Current (Isat) will cause L0 to drop 20% typical. (keep quickly). 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P4 6. Material List NO Items 1 Core Carbonyl Powder. Materials 2 Wire Polyester Wire or equivalent. 3 Solder Plating 100% Pb free solder 7. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) △L≦20% typical. Saturation DC Current (Isat) will cause L0 to drop △L(%)(keep quickly). Heat Rated Current (Irms) Approximately △T≦40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current(keep 1 min.). 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles) Temperature：125±2℃(Bead) Life Test Temperature： 85±2℃(Inductor) Appearance：No damage. Applied current：rated current Inductance：within±10% of initial value Duration：1000±12hrs Measured at room temperature after placing for 24±2 hrs Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Load Humidity Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity：85±2﹪ R.H, Temperature：85℃±2℃ Duration：1000hrs Min. with 100% rated current Measured at room temperature after placing for 24±2 hrs Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30±5min Step2：25±2℃ ≦0.5min Step3：105±2℃ 30±5min Number of cycles： 500 Measured at room temperature after placing for 24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minutes Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 1500 0.5 Half-sine 15.4 Lead 100 6 Half-sine 12.3 Shock Bending Shall be mounted on a FR4 substrate of the following dimensions: >=0805:40x100x1.2mm =0805:1.2mm 0805:1kg ,