CMFB503J3950HANT

承 认 书 APPROVAL SHEET 客 户 名 称: / Customer 片式负温度系数热敏电阻器 CHIP NTC THERMISTOR 产 品 名 称: Part Name 产 品 规 格: CMFA104F4150HANT Specification 版 本 号： 16.01 Version No. 日 期： 2016-5-3 DATE 制造 客户 Manufacturer Customer 拟制 审核 确认 检验 审核 批准 Draft by Checked by Approve by Check by Checked by Approval by 林晓华 徐雪枫 岑权进 序号 No 目 录 TABLE OF CONTENTS 1 履 历 表 Resume 2 外形尺寸与内部结构 Dimension & Inner-configuration 3 产品品名构成 Product Spec. Model 4 电气性能 Performance Specification 5 电阻-温度特性 Resistance-Temperature Characteristics 6 可靠性 Reliability Data 7 包装 Package 8 环保情况说明 Environmental Protection Statement 9 推荐使用的焊接曲线 Recommended soldering profile 10 贮存方法 Storage Methods 11 使用注意事项 Precautions For Use 12 注意事项 Notes Page 1 of 15 1. 履 历 表 Resume 版本 Version No. 16.01 修 改 明 细 Modify Details 首次发行 Initial issue 日期 Date 2015-04-01 Page 2 of 15 2. 外形尺寸与内部结构 Dimension & Inner-configuration： e W a T M M a.玻璃层：Gass layer b.银层 Ag layer c.镀层 Ni/Sn plating d.NTC 瓷体 NTC or ceramic e.端电极 Terminal electrode 序号 No. 部位 Component 材料 Material 1 NTC瓷体NTC or ceramic 锰钴镍Mn-Co- Ni 2 玻璃层：Gass layer 硅铋系Si-Bi 端电极 Terminal electrode 3 银层 Ag laye 银Ag 电镀层Ni/Sn plating 镍层-锡层Ni-Sn 单位Unit：mm（inch） 型号 Size L W T M 0402 1.0±0.15 (0.040±0.006) 0.5±0.10(0.020±0.004) 0.5Max. (0.020Max. ) 0.10Min.(0.004Min.) 0603 1.6±0.15(0.063±0.006) 0.8±0.15(0.031±0.006) 0.95Max.(0.037Max.) 0.10Min.(0.004Min.) 0805 2.0±0.20(0.08±0.008) 1.25±0.20(0.05±0.008) 1.25Max.(0.05Max.) 0.15Min.(0.006Min.) 1206 3.2±0.20(0.126±0.008) 1.6±0.20(0.063±0.008) 1.50Max.(0.060Max.) 0.20Min.(0.008Min.) Page 3 of 15 3. 产品品名构成 Product Spec. Model CMF ① X XXX ② X ③ XXXX ④ ⑤ X X ⑥ X ⑦ X ⑧ ⑨ ① 产品代号：表示片式负温度系数热敏电阻 Product Code：Chip NTC Thermistor ② 尺寸规格代码 Size Code 代码/Code 尺寸（英制） Size（Inches） ③ 标称电阻值 D A B C 0402 0603 0805 1206 为 25℃时的零功率电阻，单位为 Ω， 前二位为有效数字，第三位数字表示有效数字后“0”的个数。. Rated zero-power resistance(R25) Unit: Ω The first two are significant figure of resistance and the third one expresses number of following zeros. ④ 阻值公差代码（%） Tolerance of R25 (%) 代码/ Code 阻值公差 Tolerance of R25 E F G H J K X ±0.5 ±1.0 ±2.0 ±3.0 ±5.0 ±10.0 特殊公差 ⑤ B 值常数,单位为 K B value constant Unit:K ⑥ B 值精度代码(%) Tolerance of B value(%) 代码/ Code B 值公差 Tolerance of B value ⑦ E F G H J X ±0.5 ±1.0 ±2.0 ±3.0 ±5.0 特殊公差 B 值温度代码 （℃/℃） B value Temperature Code 代码/ Code A B C T1/T2 25/50 25/ 85 0/25 D E F G H M N 0/50 0/100 0/80 25/100 -18/25 -20/25 5/25 ⑧ 端电极材料代号：N—三层电极 Termination Code: N—Nickel Barrier ⑨ 包装方式代码：T—编带包装、B—散包装 Packaging style Code: T—Tape & Reel、B—Bulk Page 4 of 15 4. 电性能参数表 Electrical Characteristics List 型号规格 Part Number 客户料号 Customer no. R25（KΩ） B25/50(k) CMFA104F4150HANT / 100±1% 4150±3% Page 5 of 15 5. 电阻-温度特性 Resistance-Temperature Characteristics CMFD103-684 100000 CMFA102-333 10000 1000 10000 10 9 8 7 6 1000 12 100 11 10 9 8 7 6 5 4 3 2 4 3 100 10.D684-4150 9.D474-4050 8.D334-4050 7.D224-3950 6.D154-4100 5.D104-3800 4.D683-4100 3.D473-3950 2.D223-3600 1.D103-3900 2 1 10 1 0.1 10 12.A333-3950 11.A303-3950 10.A223-3300 9.A103-3600 8.A103-3500 7.A682-3950 6.A502-3950 5.A472-3950 4.A332-3380 3.A222-3450 2.A202-3400 1.A102-3200 1 1 0.1 0.01 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 -40 -30 -20 -10 100 110 120 0 CMFA473-684 10 20 30 40 50 60 70 80 90 100 110 120 CMFB801-223 100000 10000 1000 10000 11 10 9 8 1000 12 11 100 7 6 11.A684-4150 10.A560-4200 9.A474-4150 8.A334-4050 7.A224-4050 6.A204-4050 5.A154-3950 4.A104-4150 3.A683-3800 2.A503-4150 1.A473-4150 3 2 1 100 10 1 -40 -30 -20 -10 0 12.B223-3950 11.B203-3950 10.B103-3600 9.B103-3500 8.B682-3950 7.B502-3950 6.B472-3950 5.B332-3400 4.B222-3450 3.B202-3400 2.B102-3200 1.B801-3200 10 9 8 7 6 5 4 10 20 30 40 50 60 70 80 90 100 110 120 5 4 3 10 2 1 1 0.1 0.01 -40 -30 -20 -10 0 Page 6 of 15 10 20 30 40 50 60 70 80 90 100 110 120 CMFB303-474 CMFC472-474 100000 100000 10000 10000 11 1000 11 10 10 1000 9 9 8 7 11.B474-4150 10.B334-4200 9.B224-4050 8.B204-4050 7.B154-4050 6.B104-3950 5.B680-3800 4.B503-3800 3.B473-3800 2.B333-3950 6 5 4 3 2 1 100 10 1.B303-3950 1 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 8 7 6 100 11.C474-4150 10.C224-4050 9.C104-3950 8.C683-3800 7.C503-3800 6.C473-3800 5.C223-3950 4.C103-3600 3.C682-3900 2.C502-3900 5 4 3 2 1 10 1 1.C472-3900 0.1 -40 -30 -20 -10 0 Page 7 of 15 10 20 30 40 50 60 70 80 90 100 110 120 6. 可靠性试验项目 Reliability Testing Items 序 号 No. 项目 Items 要求 Requirements 1 工作温度范 围 Operating Temperature Range -40℃～+120℃ 试验方法及备注 Test Methods and Remarks 预热温度:100℃～150℃ 预热时间:1～2Min. 可焊 2 至少 95%端电极表面被焊锡覆盖。 Solder At least 95% of terminal electrode should be ability covered with solder 焊锡温度: 245±5℃ 浸锡时间: 5±0.5s Preheating Temp. :100℃～150℃ Preheating Time: 1～2min. Soldering Temp. : 260±5℃ Immersion Time: 5±0.5s 3 至少 90%的焊锡覆盖在端电极表面，无可见 预热温度:100℃～150℃ 机械损伤。 预热时间:1～2Min. R25 变化率小于±5% 焊锡温度: 260±5℃ 耐焊接热 B 值(B25/50)变化率小于±2% 浸锡时间: 10±0.5s Resistance At least 90% of terminal electrode should be Preheating Temp. : 100℃～150℃ covered with solder. Preheating Time:1～2min. No mechanical damage. Soldering Temp. : 260±5℃ R25 change shall be less than±5%; Immersion Time: 10±1s to Soldering B-constant(B25/50)change shall be less than ±2%. 瓷体及端头均不受破坏 Ceramic and termination shall not be damaged. 4 端电极强度 External Electrode Strength 类型 Type Page 8 of 15 推力(N) Force (N) 时间(s) Time (s) 0402 5 5±1 0603 5 5±1 0805 10 5±1 1206 10 5±1 序号 No. 项目 Items 要求 Requirements 振动频率范围:10Hz～55Hz～10Hz 无可见机械损伤； 全振幅: 1.52mm R25 变化率小于±5%; 5 振 动 Vibration 试验方法及备注 Test Methods and Remarks B 值(B25/50)变化率小于±2%. 时间:X\Y\Z 轴各 2hrs Frequency:10Hz～55Hz～10Hz Novisible mechanical damage； Amplitude: 1.52mm R25 change shall be less than±5%; B-constant(B25/50)change shall be less than Time: Vibrated for a period of 2hrs,in three directions perpendicularly intersecting ±2%. each other. 无可见机械损伤; R25 变化率小于±5%; B 值(B25/50)变化率小于±2%. No visible mechanical damage; 抗弯强度 6 Resistance to R25 change shall be less than±5%; B-constant(B25/50)change shall be less than ±2%. flexure 规格 Size code 弯曲度 h (mm) Camber (mm) 0402、0603 0805、1206 0.7 1.0 条 件 : 测 试 基 板 (PCB) 施 压 速 度:0.5mm/s Condition: print circuit board. Pressing speed: 0.5 mm/s 7 无可见机械损伤; 从高度为 1 米的空中自由落到混凝土地板， R25 变化率小于±5%; 重复 10 次 跌落 B 值(B25/50)变化率小于±2%. Drop 10 times on a concrete floor from a high Drop No visible mechanical damage; of 1m. R25 change shall be less than±5%; B-constant(B25/50)change shall be less than ±2%. 耐高温 8 Resistance to High Temperature 外观无可见损伤； 温度：125±2℃(无负荷) R25 变化率小于±5%; 试验时间：500±2hrs B 值(B25/50)变化率小于±2%. Temp.：125±2℃(No Load) No visible damage； Time：500±2hrs R25 change shall be less than±5%; B-constant(B25/50)change shall be less than ±2%. Page 9 of 15 序号 No. 项目 Items 要求 Requirements 外观无可见机械损伤; 在-40±2℃的条件下放置 500±2hrs R25 变化率小于±5% Temp.：-40±2℃ B 值(B25/50)变化率小于±2% Time ：500±2hrs 耐低温 Resistance 9 to High Temperature 试验方法及备注 Test Methods and Remarks No visible mechanical damage; R25 change shall be less than±5%; B-constant(B25/50)change shall be less than ±2%. 恒定湿热 10 Static Humidity 外观无可见机械损伤； 在下列条件下放置 500±2hrs R25 变化率小于±5%; 温度：55±2℃ B 值(B25/50)变化率小于±2%. 湿度：90～95%RH No visible mechanical damage; Temp.：55±2℃ R25 change shall be less than±5%; Humidity：90～95%RH B-constant(B25/50)change shall Time：500±2hrs be less than ±2%. 无负荷,在下列条件循环 32 次 外观无可见损伤； cycles without load R25 变化率小于±5%; 温度循环 11 Temperature cycling B 值(B25/50)变化率小于±2% No visible damage； 阶段 温度 Step Temp. 1 -40℃ 时间 Time (Min.) 30±3 R25 change shall be less than ±5%; 2 B-constant(B25/50)change shall be less 3 +125℃ 30±3 4 室温/Room Temp 10±2 than ±2%. 室温/Room Temp 10±2 注：以上要求测试电性能的项目，应试验后在标准条件下放置 24 小时后测试。 Note:When there are questions concerning, measurement shall be made after 24±2hrs of recovery under the standard condition. Page 10 of 15 7. 产品包装 Packaging 7.1 编带图 Taping drawings 7.2 卷盘尺寸 Reel dimensions (Unit:mm) CF-8 A B C N G 178 ±2.0 22.0 ±2.0 12.5 ±1.5 57 ±2.0 8 7.3 导带及空格部分 Leader and blank portion 7.4 编带尺寸 Taping dimensions (Unit: mm) 纸带 Paper tape Part NO. 0402 0603 0805 1206 Page 11 of 15 A 0.65±0.1 1.1±0.2 1.5±0.2 1.9±0.2 B 1.15±0.1 1.9±0.2 2.3±0.2 3.5±0.2 F 2.0±0.05 4.0±0.2 4.0±0.2 4.0±0.2 T 0.8max 1.1max 1.1max 1.1max 7.5 剥离力检验 Peeling off force （1）盖带的剥离力：沿面胶移动方向拉时要求剥离力为 0.1N～0.7N。 Peeling force should be 0.1~0.7N pulling in the direction of arrow. （2）剥离速度：300mm/min Speed of peeling off: 300mm/min. （3）在胶带、纸带剥落时，面胶不能有破损，不能粘纸带。 The cover bond should not be damaged and bond the tape when it peeled off. 7.6 包装数量（单位：粒）Packaging number (Unit: Pcs ) 类型 SIZE 1206 0805 0603 0402 每卷数量 REEL 4000 4000 4000 10000 每盒数量 BOX 40000 40000 40000 100000 每箱数量 CASE 240000 240000 240000 600000 7.7 标签粘贴位置 Label stick station 卷盘标签 8. 纸盒标签 纸盒标签 外箱标签 环保情况说明 Environmental Protection Statement RoHS 指令：本公司产品符合 RoHS 指令。 Response to RoHS directive：Our products are RoHS compliance. 9. 推荐焊接条件 Recommend Soldering Conditions 9.1 焊接要求 Soldering conditions （1）预热时，产品表温与焊料温度的温差最大不允许超出 150℃，焊接完冷却时，产品表温与溶剂温度之间的 温差最大不超过 100℃。预热不足有可能引发产品表面裂纹，从而导致产品品质下降。 Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited to Page 12 of 15 150℃ max. Also cooling into solvent after soldering should be in such way that the temperature difference is limited to 100℃ max. Un-enough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality. （2）产品要在以下画出的曲线允许的范围内进行焊接。其它焊接条件可能引起产品电极的腐蚀。当焊接重复时， 允许的时间为第一次做的累计时间。 Products should be soldered within the following allowable range indicated by the slanted line. The excessive soldering conditions may cause the corrosion of the electrode. When soldering is repeated, allowable time is the accumulated time. 9.2 回流焊曲线 Reflow soldering profile 9.3 波峰焊曲线 Flow soldering profile 9.4 手工焊接 Iron soldering 烙铁温度：350℃ Perform soldering at 350℃ on 30W max 功率：最大为 30W Time: < 5S 烙铁停留时间：< 5S 注意:烙铁头不得与瓷体直接接触 Caution: Do not allow the iron-tip to directly touch the ceramic body. 7.5 清洗条件 Cleaning Conditions 清洗温度：60℃（最高） Cleaning temperature : 60℃ max 清洗时间：1 分钟（最少） Cleaning time: 1 minute min. 超声波功率：最大为 200W Ultrasonic output power: 200W max Page 13 of 15 10. 存储要求 Storage Requirements 10.1 存储期限 Storage period 距电感公司出厂检验时间 6 个月内，产品可以使用检验时间可以通过包装外侧标记的检验号确认。若时间超 过 6 个月，应检查焊接性能后方可使用。 Products which inspected in INDUCTOR COMPANY over 6 months ago should be examined and used, which can be Confirmed with inspection No. marked on the container. Solder ability should be checked if this period is exceeded. 10.2 存储条件 Storage conditions （1） 存放货物的库房应满足以下条件：温度：-10 ～ +40℃，相对湿度：30 ～ 70%。 Products should be storage in the warehouse on the following conditions: Temperature : -10~+40℃ Humidity: 30~70% relative humidity （2） 禁止将产品保管在腐蚀性物质中，如硫磺、氯气或酸，否则将引起端头氧化，导致降低焊接性。 Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid , or it may case oxidization of Electrodes resulting in poor solder ability. （3） 为了避免受潮气、灰尘等物质的影响，产品应保管于货架上。 Products should be storaged on the palette for the prevention of the influence from humidity, dust and so on. （4） 产品保管在库房中，应避免热冲击、振动以及直接光照等等。 Products should be storaged in the warehouse without heat shock, vibration, direct sunlight and so on. （5） 产品应密封包装。 Products should be storaged under the airtight packaged condition. 11. 使用注意事项 Precautions For Use 操作注意事项 Operating Considerations 本产品的陶瓷元件为易碎材料制成，使用时务必小心不要施加过大压力或引起冲击。此类强力可能会造成产品破 裂或破碎。 The ceramic of this product is fragile, and care mustbe taken not to load an excessive press - force orto give a shock at handling.Such forces may cause cracking or chipping. PC 板的设计 PCB design （1）当片式 NTCR 被安装在 PC 板上后，所使用的焊料的量（焊盘的大小）会直接影响到片式 NTCR 的性能，因此 在设计基板时，必须慎重考虑焊盘的大小和配置，这些对组成基板的焊料的量有着决定的作用，过量的焊料会 影响到芯片耐机械应力的能力。 When chip thermistors are mounted on a PCB, the amount of solder used(size of fillet) can directly affect thermistor performance Therefore, when design land- patterns it is necessary to consider the appropriate size and configuration of the solder pads, which determines the amount of solder necessary to form the fillets. Excess solder can affect the ability of chips to withstand mechanical stress. （2）基板配置：将片式 NTCR 安装在板上之后，芯片将承受在下一加工过程中产生的机械应力，出于这个原因， 在设计焊盘和片式 NTCR 的位置时，应注意考虑将应力减少到最低点。 Pattern configurations: After chip thermistor have been mounted on the board, chips can be subject to mechanical stresses in subsequent manufacturing process , for this reason, planning pattern configurations and the position of SMD thermistors should be carefully performed to minimize stress. Page 14 of 15 自动安装应考虑到的问题 Considerations for automatic placement. （1）在将片式 NTCR 安装在 PC 板上时，不能让其承受过量的冲击力。 Excessive impact load should not be imposed on the thermistor when mounting on the PCB . （2）应定期对安装机器进行维护和检查。 The maintenance and inspection of the mounting devices should be conducted periodically . （3）当 PC 板沿着接缝孔切割开时，片式 NTCR 所受机械应力的大小因使用的方法不同而不同。以下方法按应力从 小到大进行排列：推板、割裂、V 形凹槽、接缝孔。因此。任何理想的片式 NTCR 的布局必须考虑到 PC 板的分割 方法。 When beating PCB along their perforations, the amount of mechanical stress on the thermistor can vary according to the method used .The following methods are listed in order from least stressful to most stressful: push-back, slit, v-grooving, and perforation. Thus, any ideal SMD thermistor layout must also consider the PCB splitting procedure. 焊膏的印刷 printing solder paste （1）焊膏的印刷厚度建议在 150μm~200μm。 Recommendable thickness of solder paste printing should from 150μm to 200μm. （2）焊接后，爬锡高度为 0.2mm 至本产品的厚度。 After soldering, the solder fillet shall be a height from 0.2mm to the thickness of chip thermistor. （3）过多的焊料将给本产品过大的机械应力，这些应力将导致断裂或机械损伤，也可能破坏产品的电性能。 Too much solder gives too strong mechanical stress to chip thermistor, such stress may cause cracking or any mechanical damage. And also, it can destroy the electrical performance of this product. 粘合剂作用和处理 Adhesive Application and curing （1）在流体焊过程中，如果黏性不好或粘合剂不够坚硬，可能会导致产品和底板松散连接。 If insufficient adhesive is applied or if the adhesive is not sufficiently hardened this product may have a loose contact with the land， during flow soldering. （2）黏胶的黏性太低将导致焊接后产品在板上滑动。 Too low viscosity of adhesive causes chip thermistor to slip on broad, after mounting. 12. 注意事项 Notes （1）若本次承认的为“整体无铅”产品，则表明该产品符合RoHS指令的要求。 If the parcel label on product is "Unitary lead free" that indicate the products in accord with ROHS appointed requests. （2）本承认书保证我司产品作为一个单体时的质量情况，当我司产品被安装到贵司产品上时请保证贵司的产品已 根据贵司的规范进行了有效评价和确认。 This product specification guarantees the quality of our product as a single unit, Please make sure that your product has been evaluated and confirmed against your specifications when our product is mounted to your product. （3）如果贵司对我司产品的试用已超过了本测试规范所界定的产品功能，对于此所引发的失效我司将不予保证。 We can’t warrant against failure caused by any use of our product that deviates from the intended use as described in this product specification. 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