SMD0603-003/30N

SMD0603 Series SMD0603 Polymer PTC »Performance Specification Maximum Model Markin V max Imax g Resistance I hold I trip Pd Time To Trip @25°C @25°C Typ. Current Time R i min R1max (V dc) (A) (A) (A) (W) (A) (Sec) () () SMD0603-001/60N X 60 20 0.01 0.03 0.5 0.2 1.00 15.000 100.000 SMD0603-002/60N Y 60 20 0.02 0.06 0.5 0.2 1.00 12.000 70.000 SMD0603-002/09N Y 9 20 0.02 0.06 0.5 0.2 1.00 12.000 70.000 SMD0603-003/30N Z 30 20 0.03 0.09 0.5 0.2 1.00 6.000 50.000 SMD0603-003/09N Z 9 20 0.03 0.09 0.5 0.2 1.00 6.000 50.000 SMD0603-004/15N - 15.0 20 0.04 0.12 0.5 0.20 1.00 4.000 40.000 SMD0603-005/15N - 15.0 20 0.05 0.15 0.5 0.25 1.00 3.800 30.000 SMD0603-005/30N - 30.0 20 0.05 0.15 0.5 0.25 1.00 3.800 30.000 SMD0603-010/15N 1 15.0 35 0.10 0.30 0.5 0.5 1.00 0.900 6.000 SMD0603-010/09N 1 9.0 35 0.10 0.30 0.5 0.5 1.00 0.900 6.000 SMD0603-020/09N 2 9.0 35 0.20 0.50 0.5 1.0 0.60 0.550 3.500 SMD0603-020/16N 2 16.0 35 0.20 0.50 0.5 1.0 0.60 0.550 3.500 SMD0603-025/09N 2 9.0 35 0.25 0.55 0.5 8.0 0.08 0.500 3.000 SMD0603-025/16N 2 16.0 35 0.25 0.55 0.5 8.0 0.08 0.500 3.000 SMD0603-035/06N 3 6.0 35 0.35 0.75 0.5 8.0 0.10 0.200 1.000 SMD0603-040/06N 5 6.0 35 0.40 0.80 0.5 8.0 0.10 0.150 0.900 SMD0603-050/06N 5 6.0 35 0.50 1.00 0.5 8.0 0.10 0.100 0.800 SMD0603-050/12N 5 12.0 35 0.50 1.00 0.5 8.0 0.10 0.100 0.800 SMD0603-060/06N 7 6.0 35 0.60 1.20 0.5 8.0 0.10 0.080 0.600 SMD0603-065/06N 7 6.0 35 0.65 1.30 0.5 8.0 0.10 0.070 0.550 SMD0603-075/06N 7 6.0 35 0.75 1.40 0.5 8.0 0.10 0.060 0.450 SMD0603-100/06N 0 6.0 35 1.00 2.00 0.5 8.0 0.10 0.050 0.300 V max = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (V max). I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame. »Environmental Specifications Test Conditions Resistance change Passive aging +85°C, 1000 hrs. ±5% typical Humidity aging +85°C, 85% R.H. , 168 hours ±5% typical Thermal shock +85°C to -40°C, 20 times ±33% typical Resistance to solvent MIL-STD-202,Method 215 No change Vibration MIL-STD-202,Method 201 No change Ambient operating conditions : - 40 °C to +85 °C Maximum surface temperature of the device in the tripped state is 125 °C Revision 2018 www.born-tw.com 1/5 SMD0603 Series »Thermal Derading Chart Model Recommended Hold Current(A) at Ambient Temperature(°C) Ambient Operation Temperature -40°C -20°C 0°C 25°C 40°C 50°C 60°C 70°C 85°C SMD0603-001N 0.016 0.014 0.012 0.010 0.008 0.007 0.006 0.005 0.0035 SMD0603-002N 0.031 0.027 0.024 0.020 0.016 0.014 0.012 0.011 0.007 SMD0603-003N 0.047 0.041 0.036 0.030 0.024 0.021 0.018 0.016 0.0108 SMD0603-004N 0.052 0.048 0.044 0.040 0.032 0.028 0.024 0.020 0.012 SMD0603-005N 0.065 0.060 0.055 0.050 0.040 0.035 0.031 0.025 0.015 SMD0603-010N 0.13 0.12 0.11 0.10 0.08 0.07 0.06 0.05 0.03 SMD0603--020N 0.27 0.25 0.23 0.20 0.17 0.14 0.12 0.10 0.07 SMD0603-025N 0.32 0.29 0.27 0.25 0.21 0.18 0.16 0.14 0.10 SMD0603-035N 0.47 0.41 0.38 0.35 0.29 0.26 0.24 0.20 0.14 SMD0603-040N 0.54 0.47 0.43 0.40 0.33 0.29 0.27 0.22 0.16 SMD0603-050N 0.67 0.59 0.54 0.50 0.41 0.37 0.34 0.29 0.20 SMD0603-060N 0.81 0.70 0.651 0.60 0.49 0.44 0.41 0.34 0.24 SMD0603-065N 0.87 0.76 0.71 0.65 0.54 0.48 0.44 0.37 0.26 SMD0603-075N 0.98 0.85 0.81 0.75 0.60 0.54 0.44 0.40 0.31 SMD0603-100N 1.19 1.13 1.08 1.00 0.80 0.72 0.59 0.54 0.43 »Thermal Derating Curve Revision 2018 »Average Time-Current Curve www.born-tw.com 2/5 SMD0603Series »Soldering Parameters TP 20~40 S TP 260 Critical Zone Ramp-up TL 217 TL to TP tL 60~150 s Tsmax 200 Tsmin Ramp-down 150 ts Preheat 60~180 s 25 t 25°C to peak Time Profile Feature Pb-Free Assembly Average Ramp-Up Rate(Ts max to T p) 3℃/second mac. Preheat -Temperature Min(Ts min) 150℃ -Temperature Max(Ts max) 200℃ -Time(Ts min to Ts max) 60~180 seconds Time maintained above: -Temperature(TL) 217℃ -Time(tL) 60~150 seconds Peak Temperature(Tp) 260℃ Ramp-Down Rate 6℃/second max. Time 25℃ to Peak Temperature 8 minutes max Storage Condition 0℃~35℃,30%-60%RH Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free Recommended maximum paste thickness is 0.25mm Devices can be cleaned using standard industry methods and solvents. Note 1:All temperature refer to topside of the package, measured on the package body surface. Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements Revision 2018 www.born-tw.com 3/5 SMD0603 Series »Physical Dimensions(mm.) A 3 B D E A 型號 C B C D E Min. Max. Min. Max. Min. Max. Min. Min. SMD0603-001N 1.45 1.85 0.65 1.05 0.40 1.00 0.15 0.10 SMD0603-002N 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.10 SMD0603-003N 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.10 SMD0603-004N 1.45 1.85 0.65 1.05 0.40 1.00 0.15 0.10 SMD0603-005N 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.10 SMD0603-010N 1.45 1.85 0.65 1.05 0.35 0.75 0.15 0.10 SMD0603-020N 1.45 1.85 0.65 1.05 0.30 0.70 0.15 0.10 SMD0603-020/16N 1.45 1.85 0.65 1.05 0.40 1.00 0.15 0.10 SMD0603-025N 1.45 1.85 0.65 1.05 0.30 0.70 0.15 0.10 SMD0603-025/16N 1.45 1.85 0.65 1.05 0.40 1.00 0.15 0.10 SMD0603-035N 1.45 1.85 0.65 1.05 0.35 0.90 0.15 0.10 SMD0603-040N 1.45 1.85 0.65 1.05 0.40 0.90 0.15 0.10 SMD0603-050N 1.45 1.85 0.65 1.05 0.55 1.15 0.15 0.10 SMD0603-050/15N 1.45 1.85 0.65 1.05 0.55 1.15 0.15 0.10 SMD0603-060N 1.45 1.85 0.65 1.05 0.55 1.15 0.15 0.10 SMD0603-065N 1.45 1.85 0.65 1.05 0.55 1.15 0.15 0.10 SMD0603-075N 1.45 1.85 0.65 1.05 0.55 1.15 0.15 0.10 SMD0603-100N 1.45 1.85 0.65 1.05 0.55 1.15 0.15 0.10 Termination Pad Characteristics Terminal pad materials：Tin-plated Nickel-Copper Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3. »Recommended Pad Layout (mm.) 1.0 士 0.1 1.5 士 0.1 1.0 士 0.1 »Packaging Quantity Part Number SMD0603 Series Quantity 4,000 pcs/reel Tape & reel packaging per EIA481-1 1.2 士 0.1 Revision 2018 www.born-tw.com 4/5 SMD0603 Series »Tape And Reel Specifications (mm) Governing Specifications EIA 481-1 W 8.0 ± 0.2 P0 4.0 ± 0.10 P1 4.0 ± 0.10 P2 2.0 ± 0.05 A0 1.05 ± 0.10 B0 1.85 ± 0.10 D0 1.55 + 0.05 F 3.5 ± 0.05 E1 1.75 ± 0.10 E2min. 6.25 T 0.20 T1max. 0.1 K0 0.75/0.95 ± 0.1 Leader min. 390 Trailer min. 160 EIA Tape Component Dimensions P0 Embossment D T P2 0 E1 Cover tape B A F W B0 K0 E2 T P1 EIA Reel Dimensions W2(measured at hub) A Cover tape Reel Dimensions 2 22 A max. 178 Carrier tape N min. 60 Embossed cavity W1 9.0 ± 0.5 W2 12.0 ± 0.05 W 8.0 ± 0.2 N(hub dia.) 0 W1(measured at hub) Storage And Handling ‧ Storage conditions：35°C max,30%-60%R.H. ‧ Devices may not meet specified performance ‧ if storage conditions are exceeded. »Part Number System SMD 0603 - 020 / 16 N BORN special voltage Rating(Optional) Holding Current Rating Size 0603 inch SMD Revision 2018 www.born-tw.com 5/5