HSMG-C170

Surface Mount Chip LEDs Technical Data HSMx-C190/C170/ C150/C110 Features Description • • • • • These chip LEDs are designed in an industry standard package for ease of handling and use. Five different LED colors are available in four compact, single color packages. Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30°C to +85°C • Right Angle Package Available • Five Colors Available • Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels Applications • • • • • Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator The HSMx-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C170 has the widely used 2.0 x 1.25 mm footprint. The HSMx-C190 has the industry standard 1.6 x 0.8 mm footprint, its low 0.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The HSMx-C110 is a rightangle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Device Selection Guide Footprint (mm) 3.20 x 1.60 2.00 x 1.25 1.60 x 0.80 3.20 x 1.00[1] HER HSMS-C150 HSMS-C170 HSMS-C190 HSMS-C110 Note: Right-angle package Orange HSMD-C150 HSMD-C170 HSMD-C190 HSMD-C110 Yellow HSMY-C150 HSMY-C170 HSMY-C190 HSMY-C110 Green HSMG-C150 HSMG-C170 HSMG-C190 HSMG-C110 AS AlGaAs Red HSMH-C150 HSMH-C170 HSMH-C190 HSMH-C110 Part per Reel 3000 4000 4000 3000 2 Package Dimensions CATHODE (ANODE MARK FOR MARK HSMH-C170) CATHODE (ANODE MARK FOR HSMH-C150) MARK LED DIE LED DIE 1.25 (0.049) 1.6 (0.063) 0.8 (0.031) 0.62 (0.024) 2.0 (0.079 ) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY[3] 2.0 (0.079) 0.6 (0.024) POLARITY[3] 1.4 (0.055) DIFFUSED EPOXY 0.3 (0.012) 1.1 (0.043) PC BOARD PC BOARD 0.8 (0.031) CATHODE LINE 0.5 (0.020) 0.50 ± 0.2 (0.020 ± 0.008) 0.50 ± 0.2 (0.020 ± 0.008) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C150 HSMx-C170 CATHODE (ANODE MARK FOR HSMH-C190) MARK LED DIE CATHODE (ANODE MARK MARK FOR HSMH-C110) LED DIE 1.0 (0.039) 0.8 (0.031) 2.6 (0.102 ) 0.4 (0.016) 1.6 (0.063 ) 3.2 (0.126 ) 1.0 (0.039) POLARITY[3] POLARITY CLEAR EPOXY 1.5 (0.059) 0.3 (0.012) PC BOARD DIFFUSED EPOXY PC BOARD 0.5 (0.020) CATHODE LINE 1.6 (0.063 ) 0.8 (0.031) 0.3 (0.012) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) CATHODE LINE 0.9 (0.035) 1.0 (0.039) 0.7 (0.028) MIN. SOLDERING TERMINAL HSMx-C190 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings. SOLDERING TERMINAL HSMx-C110 3 Absolute Maximum Ratings at TA=25°C for HER, Orange, Yellow and Green Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR=100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMx-C150 25 100 65 5 95 -30 to +85 -40 to +85 HSMx-C170 HSMx-C190 HSMx-C110 20 20 25 100 100 100 52 52 65 5 5 5 95 95 95 -30 to +85 -30 to +85 -30 to +85 -40 to +85 -40 to +85 -40 to +85 See IR soldering profile (Figure 7) Units mA mA mW V °C °C °C Absolute Maximum Ratings at TA=25°C for AS AlGaAs Red Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR =100µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMx-C150 30 100 78 5 95 -30 to +85 -40 to +85 HSMx-C170 HSMx-C190 HSMx-C110 25 25 30 100 100 100 65 65 78 5 5 5 95 95 95 -30 to +85 -30 to +85 -30 to +85 -40 to +85 -40 to +85 -40 to +85 See IR soldering profile (Figure 7) Units mA mA mW V °C °C °C Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25°C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Electrical Characteristics at TA=25 °C Part Number HSMS-C150/110 HSMS-C170/190 HSMD-C150/110 HSMD-C170/190 HSMY-C150/110 HSMY-C170/190 HSMG-C150/110 HSMG-C170/190 HSMH-C150/110 HSMH-C170/190 Color HER Forward Voltage VF(Volts) @ IF = 20 mA Typ. Max. 2.1 2.6 Reverse Breakdown VR(Volts) @ IR = 100 µA Min. 5 Capacitance C(pF), @ VF = 0 V, f = 1 MHz Typ. 5 Orange 2.2 2.6 5 7 Yellow 2.1 2.6 5 6 Green 2.2 2.6 5 9 AlGaAs 1.8 2.6 5 18 Thermal Resistance RθJ-P ( °C/W) Typ. 400 250 400 250 400 250 400 250 460 300 4 Optical Characteristics at TA =25°C Part Number Color HSMS-C150/170/190 HSMD-C150/170/190 HSMY-C150/170/190 HSMG-C150/170/190 HSMH-C150/170/190 HSMS-C110 HSMD-C110 HSMY-C110 HSMG-C110 HSMH-C110 HER Orange Yellow Green AlGaAs HER Orange Yellow Green AlGaAs Luminous Intensity[1] Iv(mcd)@20mA Min. Typ. 2.50 10.0 2.50 8.0 2.50 8.0 4.00 15.0 6.30 17.0 2.50 11.0 2.50 9.0 2.50 9.0 4.00 16.0 6.30 19.0 Peak Wavelength l peak(nm) Typ. 630 605 589 570 660 630 605 589 570 660 Dominant Wavelength l d(nm) Typ. 626 604 586 572 639 626 604 586 572 639 Viewing Angle 2u1/2(°) [2] Typ. 170 170 170 170 170 130 130 130 130 130 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits[1] Green Color Bins[1] Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 Bin ID A B C D E Tolerance: ± 0.5 nm Yellow/Amber Color Bins[1] Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Tolerance: ± 0.5 nm Orange Color Bins[1] Bin ID A B C D E F Tolerance: ± 1 nm Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0 5 Light Intensity (Iv) Bin Limits[1] Intensity Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 Bin ID A B C D E F G H J K L M (mcd) Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 (mcd) Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Tolerance: ± 15% 1.0 RELATIVE INTENSITY GREEN AlGaAs YELLOW 0.5 ORANGE 0 500 HER 550 600 650 700 750 WAVELENGTH – nm 1.6 AlGaAs HER AlGaAs GREEN 10 1 YELLOW 0.1 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 1.2 0.8 0.4 GaP ORANGE 1.5 1.7 1.9 2.1 VF – FORWARD VOLTAGE – V Figure 2. Forward Current vs. Forward Voltage. 2.3 0 0 10 20 30 IF – FORWARD CURRENT – mA Figure 3. Luminous Intensity vs. Forward Current. 40 IF MAX. – MAXIMUM FORWARD CURRENT – mA Figure 1. Relative Intensity vs. Wavelength. 35 C150/C110 HER, ORANGE, YELLOW, GREEN C170/C190 AlGaAs C150/C110 AlGaAs 30 25 20 RθJ-A = 600°C/W C170/C190 HER, ORANGE, YELLOW, GREEN 15 10 RθJ-A = 800°C/W 5 0 0 20 40 60 80 100 TA – AMBIENT TEMPERATURE – °C Figure 4. Maximum Forward Current vs. Ambient Temperature. 6 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle for HSMx-C110. 1.00 0.70 10 SEC. MAX. 0.60 TEMPERATURE RELATIVE INTENSITY – % 0.90 0.80 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 230°C MAX. 4°C/SEC. MAX. 140-160°C 4°C/SEC. MAX. 3°C/SEC. MAX. OVER 2 MIN. 0 10 20 30 40 50 60 70 80 90 TIME ANGLE Figure 6. Relative Intensity vs. Angle for HSMx-C150, C170 and C190. Note: All dimensions in millimeters (inches). Figure 7. Recommended Reflow Soldering Profile. 7 0.8 (0.031) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) 1.2 (0.047) 0.9 (0.035) Figure 8. Recommended Soldering Pattern for HSMx-C150. 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) Figure 9. Recommended Soldering Pattern for HSMx-C170. Figure 10. Recommended Soldering Pattern for HSMx-C190. USER FEED DIRECTION 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.0 (0.039) CATHODE SIDE 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) PRINTED LABEL Figure 11. Recommended Soldering Pattern for HSMx-C110. Figure 12. Reeling Orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (Ø 0.795 MIN.) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS Figure 13. Reel Dimensions. Note: All dimensions in millimeters (inches). 5.0 ± 0.5 (0.197 ± 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A DIM. B DIM. C ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) HSMx-C110 POSITION IN CARRIER TAPE HSMx-C150 SERIES 3.75 (0.148) 2.10 (0.083) 1.30 (0.051) DIM. A (SEE TABLE 1) HSMx-C170 SERIES HSMx-C190 SERIES HSMx-C110 SERIES 2.40 (0.094) 1.80 (0.071) 3.40 (0.134) 1.60 (0.063) 0.95 (0.037) 1.70 (0.067) 1.20 (0.047) 0.87 (0.034) 1.20 (0.047) PART NUMBER R 1.0 ± 0.05 (0.039 ± 0.002) DIM. B (SEE TABLE 1) Figure 14. Tape Dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 15. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.1 mm (± 0.004 in.)unless otherwise specified. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Storage Condition: 5 to 30˚ C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/– 5˚C for 20 hours. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright © 2002 Agilent Technologies, Inc. Obsoletes 5988-1858EN April 30, 2002 5988-6271EN