HL-EMC-3030D46W-2C-S1-HR3

Under Development Mass production RoHS Specification 规 格 书 Customer Name： 客户名称： Customer P/N： 客户品号： Factory P/N： HL-EMC-3030D46W-2C-S1-HR3 公司品号： Sending Date： Client approval 客户审核 Approval 核准 Hongli approval 鸿利智汇审核 Audit 确认 Approval 核准 Audit 确认 Confirmation 制作 林德顺 □ Qualified 接受 □ Disqualified 不接受 翦桂云 DATE: 日期： Adr：No.1,Xianke Yi Road,Huadong Town,Huadu District,Guangzhou,China 地址：中国广州市花都区花东镇先科一路1号 Tel/电话：020-86733333 Fax/传真：020-86733883 86733938 86733265 Web/网址：www.honglitronic.com 注:1.此规格书以中英文方式书写,若有冲突以中文版本为准文本. 2.此规格书的最终解释权归鸿利智汇集团股份有限公司 3.此规格书的有效期限为两年,自盖章或签字之日起计算,期满时双方可以续签协议,但应采用书面形式 SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 1 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 Features( 特征） PLCC-2 Package.(PLCC-2 封装） Extremely wide viewing angle.（宽的发光角度） Suitable for all SMT assembly and solder process.（适用于所有的SMT组装和焊接工艺） Available on tape and reel.（适用于载带及卷轴） Moisture sensitivity level: Level 4.（防潮等级 Level 4） Package:4500pcs/reel..(包装每卷4500PCS） RoHS compliant. (RoHS 认证） ATTENTION Description（描述） OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES The White LED which was fabricated using a blue chip and the phosphor 白光LED由蓝光芯片与荧光粉激发而成 注意：操作时应注意静电敏感 释放设备装置 Applications（应用） Package Dimensions（封装尺寸） ■ Portable lighting（便携照明） ■ Decorative lighting（装饰照明） ■ OA equipment（办公照明） ■ Backlighting of full color LCD（液晶背光） ■ Bulbs and fluorescent lamps（家居照明） Recommended Soldering Pattern （建议焊盘尺寸图） Notes:（备注） 1. All dimension units are millimeters.（所有标注尺寸单位为毫米） 2.All dimension tolerance is ±0.15mm unless otherwise noted.（除特别标注外，所有尺寸允许公差±0.15mm ） SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 2 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 Selection Guide（选择指南） Part No. 型号 Chip Materials 芯片材料 Lens Type 胶体类型 InGaN Yellow Diffused HL-EMC-3030D46W-2C-S1-HR3 Mass Production list（批量生产目录） Part No. 型号 CCT（K） Min CCT（K） Typ CCT（K） Max Φ（lm） Min Φ（lm） Typ Test Conditions 测试条件 2600 2720 2800 110 120 IF=150mA 2850 2950 3150 120 130 IF=150mA 3300 3460 3700 120 130 IF=150mA 3800 4010 4200 130 140 IF=150mA 4700 4970 5300 130 140 IF=150mA 5700 6000 6300 130 140 IF=150mA 6150 6430 6850 130 140 IF=150mA HL-EMC-3030D46W-2C-S1HR3 Electrical / Optical Characteristics at Ta=25°C Parameter（参数） Symbol （符号） Min. （最小） Forward Voltage 正向电压 VF 5.6 Viewing Angle 角度 2θ1/2 -- Color Rendering Index 显色性指数 Ra Thermal Resistance 热阻 Rθjc Typ. （平均） 电性与光学特性 Max. （最大） Units （单位） Test Conditions 测试条件 6.8 V IF=150mA 120 -- Deg IF=150mA 80 -- -- -- IF=150mA -- 12.5 -- ℃/W IF=150mA -- Note:(备注） 21/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 21/2 是半值角,指光强是光学中心线光强的1/2处到光学中心线的角度 2. The above luminous flux measurement allowance tolerance is ±10%. 上述光通量的测试允许公差为±10% 3. The above Color Rendering Index measurement allowance tolerance is ±2 以上显色性指数的测试允许公差为±2 4. The above forward voltage measurement allowance tolerance is ±2%. 以上所示电压测量误差±2% 5. The above color coordinates measurement allowance tolerance is ±0.01. 以上所示坐标测量误差±0.01 SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 3 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 Absolute Maximum Ratings at Ta=25°C 绝对最大额定值 Parameter（参数） Symbol（符号） Rating（值） Units（单位） Power Dissipation（功耗） Pd 1156 mW Forward Current（正向电流） IF 170 mA Peak Forward Current [1]（峰值正向电流） IFP 250 mA Vr 10 V Reverse Current 反向电流 IR 10 μA Operating Temperature（操作温度） Topr -35 ~ +100 ℃ Storage Temperature（保存温度） Tstg -35 ~ +85 ℃ Junction Tempetatue(结温） Tj 125 ℃ Electrostatic Discharge (HBM)（静电） ESD 2000 V Power dissipation Reverse voltage (功耗反向电 压) Note:（备注） 1. 1/10 Duty cycle, 0.1ms pulse width.（脉宽0.1ms,周期1/10） SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 4 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 Bin Range of Chromaticity Coordinate Bin区分类及色坐标范围 SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 5 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 6 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 SMT Reflow Soldering Instructions SMT回流焊说明 1.Reflow soldering should not be done more than two times. 回流焊不可以做两次以上。 2.When soldering , do not put stress on the LEDs during heating 当焊接时，不要在材料受热时用力压胶体表面。 Soldering iron 烙铁焊接 1.When hand soldering, keep the temperature of iron below less 300℃ less than 3 seconds 当手工焊接时，烙铁的温度必须小于300℃，时间不可超过3秒。 2.The hand solder should be done only one times 手工焊接只可焊接一次。 Repairing 修补 Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or will not be damaged by repairing. LED回流焊后不应该修复，当修复是不可避免时，必须使用双头烙铁（如下图），但必须事先确认此种方式会或不会 损坏LED本身的特性。 Cautions 注意事项 The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED封装为硅胶，故LED胶体表面较软，用力按压胶体表面会影响LED可靠性，因此应有预防措施避免在封装的零件上的 强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。 SPEC NO：B-17-A-1605 REV NO: A/1 DATE: July/13/2018 PAGE: 7 OF 11 ● Under Development Mass production HL-EMC-3030D46W-2C-S1-HR3 Handling Precautions 处理防备措施 Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more prone to damage by external mechanical force . As a result, Special handling precautions must be observed during assembling using silicone encapsulated LED products, Failure to comply might leads to damage and premature failure of the LED. 相对环氧树脂较脆较硬而言，硅胶封装较柔软且有弹性，虽然它的特性大大减少了热应力，但易受机械外力损坏，因此 在手工处理方面须要对硅胶封装材料做预防措施，若未按要求操作，可能会导致LED损坏和光衰。 1.Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry. 通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路。 2.The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 为防止气压泄漏，SMD吸咀外径不可以超过LED尺寸，吸咀内径尺寸应尽可能大，吸咀顶端材 质建议采用柔软材料以防在吸取期间刮伤或损坏LED胶体表面，元件的尺寸必须在取放机里准 确的编程好，以确保精确的吸取和避免生产过程中的损害。 3.Do not stack together assembled PCBs containing LEDs. Impact may scratch the silicone lens or damage the internal circuitry 4.Not suitable to operate in acidic environment, PH