BL-HZ336G-L8-TRB

BRIGHT LED ELECTRONICS CORP. Specification for Approval ● SAMPLES  ATTACHED AREA  DEVICE NUMBER: BL-HZ336G-L8-TRB PAGE DATE 2016.03.16 2017.05.18 1 2 3 4 5 6 7 8 9 CONTENTS 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.1 Original Released 1.1 1.1 1.1 Add IV&X,Y FOR CUSTOMER’S APPROVAL STAMP OR SIGNATURE APPROVED PURCHASE 佰鴻工業股份有限公司 MANUFACTURE ISSUED QUALITY ENGINEERING APPROVED PREPARED BRIGHT LED ELECTRONICS CORP. 新北市板橋區和平路 19 號 3 樓 張 占 任 3F., No.19, He Ping Road, Ban Qiao Dist., New Taipei City, Taiwan 2017.05.18 2017.05.18 2017.05.18 孝 嚴 旭 穎 Tel: +886-2-29591090 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ● Features: 1. Emitted Color : White ●Package Dimensions: 2. Mono-color type. 3. 1.6x0.8x0.4mm(0603) standard package CATHODE MARK 4. Suitable for all SMT assembly methods. 5. Compatible with infrared and vapor phase reflow solder process. 6. Compatible with automatic placement equipment. 7. This product doesn’t contain restriction Substance, comply ROHS standard ● Applications: 1. Automotive : Dashboards, stop lamps, turn signals. 2. Backlighting : LCDs, Key pads advertising. 3. Status indicators : Comsumer & industrial NOTES: 1.All dimensions are in millimeters . 2.Tolerance is ±0.10mm unless otherwise specified. 3.Specifications are subject to change without notice. electronics. 4. General use. ● Absolute Maximum Ratings(Ta=25℃) Parameter Symbol Rating Unit Power Dissipation Pd 16 mW Forward Current IF 5 mA Peak Forward Current ＊1 IFP 100 mA Reverse Volage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~85℃ - Soldering Temperature Tsol See Page8 - ＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width. Ver.1.0 Page 1 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage Vf IF=2mA - 2.6 3.0 V Luminous Intensity Iv IF=2mA 18.5 35 - mcd Reverse Current IR VR=5V - - 1 µA Chromaticity x IF=2mA - 0.28 - - Coordinates y IF=2mA - 0.28 - - Viewing Angle 2θ1/2 IF=2mA - 120 - deg ● Typical Electro-Optical Characteristics Curves Fig.1 Relative intensity vs. wavelength Fig.2 Forward current derating curve vs. ambient temperature 5 4 Forward current (mA) Relative radiant intensity 1.0 0.5 0 350 400 450 500 550 600 650 700 750 800 3 2 1 Wavelength (nm) 0 20 40 80 60 100 Ambient temperature Ta( C) Fig.4 Relative luminous intensity vs. ambient temperature Fig.3 Forward current vs. forward voltage 5 3.0 2.5 3 2 1 (Normalized @20mA) Relative Luminous intensity Forward current (mA) 4 2.0 1.5 1.0 0.5 0 1 2 3 0 -40 5 4 -20 Forward voltage(V) 0 20 40 60 Ambient temperature Ta( C) Fig.5 Relative luminous intensity vs. forward current Fig.6 Radiation diagram 0 2.0 10 20 1.5 Relative radiant intensity Relative luminous intensity (@20mA) 30 1.0 0.5 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 1 2 3 4 5 0.5 0.3 0.1 0.2 0.4 0.6 Forward current (mA) Ver.1.1 Page 2 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ● Tapping and packaging specifications(Units: mm) Quantity:5000PCS END 8.0±0.3 START 13.0±0.5 CATHODE ANODE USER DIRECTION OF FEED ● Package Method:(unit:mm) Vacuum 12 bag/box 5000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver.1.0 Page 3 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ● Bin Limits I n t e n s i t y B i n L i m i ts ( A t 2 m A ) BIN CODE Min. (mcd) Max. (mcd) L 18.5 28 M 28 42 N 42 63 P 63 94 Q 94 140 To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % V F B i n L i m i ts ( A t 2 m A ) BIN CODE Min.(v) Max.(v) D1 2.2 2.3 D2 2.3 2.4 E1 2.4 2.5 E2 2.5 2.6 F1 2.6 2.7 F2 2.7 2.8 G1 2.8 2.9 G2 2.9 3.0 To l e r a n c e f o r e a c h B i n l i m i t i s ± 0 . 0 5 ● B IN： x x VF BIN CODE Intensity BIN CODE Ver.1.0 Page 4 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB C o l o r B i n L i m i ts ( A t 2 m A ) C.I.E CHROMATICITY DIAGRAM y 4-7 4-6 4-5 4-4 4-3 4-2 4-1 5-8 5-7 5-6 5-5 5-4 5-3 5-2 5-1 6-7 6-6 6-5 6-4 6-3 6-2 6-1 x Ver.1.1 Page 5 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB C o l o r B i n L i m i ts ( A t 2 m A ) BIN 4-1 4-2 4-3 4-4 4-5 4-6 4-7 5-1 5-2 5-3 5-4 5-5 5-6 5-7 5-8 6-1 6-2 6-3 6-4 6-5 6-6 6-7 Chromaticity Coordinates X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y X Y 0.265 0.21 0.265 0.22 0.265 0.23 0.265 0.24 0.265 0.25 0.265 0.26 0.265 0.27 0.305 0.25 0.305 0.26 0.305 0.27 0.305 0.28 0.305 0.29 0.305 0.3 0.305 0.31 0.225 0.2 0.225 0.21 0.225 0.22 0.225 0.23 0.225 0.24 0.225 0.25 0.225 0.26 0.265 0.24 0.265 0.25 0.265 0.26 0.265 0.27 0.265 0.28 0.265 0.29 0.265 0.3 0.225 0.21 0.225 0.22 0.225 0.23 0.225 0.24 0.225 0.25 0.225 0.26 0.225 0.27 0.265 0.25 0.265 0.26 0.265 0.27 0.265 0.28 0.265 0.29 0.265 0.3 0.265 0.31 0.265 0.22 0.265 0.23 0.265 0.24 0.265 0.25 0.265 0.26 0.265 0.27 0.265 0.28 0.305 0.26 0.305 0.27 0.305 0.28 0.305 0.29 0.305 0.3 0.305 0.31 0.305 0.32 X 0.305 0.265 0.265 0.305 Y 0.32 0.31 0.32 0.33 X Y X Y X Y X Y X Y X Y X y 0.33 0.29 0.33 0.3 0.33 0.31 0.33 0.32 0.33 0.33 0.33 0.34 0.33 0.35 0.305 0.28 0.305 0.29 0.305 0.3 0.305 0.31 0.305 0.32 0.305 0.33 0.305 0.34 0.305 0.29 0.305 0.3 0.305 0.31 0.305 0.32 0.305 0.33 0.305 0.34 0.305 0.35 0.33 0.3 0.33 0.31 0.33 0.32 0.33 0.33 0.33 0.34 0.33 0.35 0.33 0.36 Ver.1.1 Page 6 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ● Reliability Test Classification Endurance Test Environmental Test Test Item Reference Standard MIL-STD-750D:1026 Operation Life MIL-STD-883D:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202F:103B High Humidity JIS-C-7021 :B-11 Storage High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-11 Storage MIL-STD-202F:107D Temperature MIL-STD-750D:1051 Cycling MIL-STD-883D:1010 JIS-C-7021 :A-2 MIL-STD-202F:107D(1980) Thermal Shock MIL-STD-750D:1051(1995) MIL-STD-883D:1011(1991) Test Conditions Ta: Under room temperature Test time:1,000hrs IF=Product Recommended IF Ta:85±5℃ RH:90%-95% Test time:240hrs Ta:100±5℃ Test time:1,000hrs Result 0/32 0/32 0/32 Ta: -40±5℃ Test time=1,000hrs 0/32 Ta:-35±5℃~25±5℃~85±5℃~25±5℃ 30min 5min 30min 5min 0/32 Ta:-40±5℃ ~+85±5℃ 10min 10 min Time: 20min/cycle 10cycle 0/32 Wetting balance MIL-STD-883:2003 MIL-STD-202F:208D MIL-STD-883D:2003 Ta:230±5℃ Time:5±0.5s 0/32 Solder Resistance MIL-STD-202F:210A MIL-STD-883D:1011 JIS-C-7021 :A-1 Ta:260±10℃ Time:10±1s 0/32 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) IR(uA) Iv ( mcd ) Measuring conditions IF=2mA VR=5V IF=2mA Judgement criteria for failure Initial Level*1.1 Over U*2 Initial Level*0.7 1.U means the upper limit of specified characteristics. 2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal ambient conditions after completion of each test. Ver.1.0 Page 7 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ●IR-Reflow Soldering 260℃ Max. 10sec.Max. Above255℃ 30sec.Max. 3℃/sec.Max. 6℃/sec.Max. Above 217℃ 60~150sec. Pre-heating 150~200℃ 60~120sec. 1. Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering . 2. Avoid rapid cooling or any excess vibration during temperature ramp-down process 3. Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ● IRON Soldering 350℃ Within 3 sec.,One time only. Ver.1.0 Page 8 of 9 BRIGHT LED ELECTRONICS CORP. BL-HZ336G-L8-TRB ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 5000 pcs (one taping reel) and a label is attached on each bag. (2) Label: B Part No Quantity BIN. Sealing Date x xx xx xx x xx xx Year Month Year Cycle Manufacture Location Ver.1.0 Page 9 of 9