SLA3304DT6

SLA3304DT6 LOW VOLTAGE TVS DIODE ARRAY FOR LVDS SIGNAL LINES PROTECTION Features ● 150 Watts Peak Pulse Power per Line (tp=8/20µs) ● Protects Four Bidirectional I/O Lines ● Low Clamping Voltage ● Working Voltages : 3.3V ● Low Leakage Current ● IEC61000-4-2 (ESD) ±30kV (air), ±30kV (contact) ● IEC61000-4-4 (EFT) 40A (5/50ηs) ● IEC61000-4-5 (LIGHTING) 30A (8/20μs) Dimensions SOT-26 Pin Configuration Applications ● ● Cellular Handsets and Accessories Cordless Phones ● I2C Bus Protection ● Portable instrumentation ● Personal Digital Assistant (PDA) ● Microcontroller Input Protection Mechanical Characteristics ● JEDEC SOT-26 Package ● Molding Compound Flammability Rating : UL 94V-O ● Weight 16.0 Millgrams (Approximate) ● Quantity Per Reel : 3,000pcs ● Reel Size : 7 inch ● Lead Finish : Lead Free Absolute Maximum Ratings(Tamb=25°C unless otherwise specified) Parameter Peak Pulse Power (8/20µs) ESD per IEC 61000−4−2 (Air) Symbol Ppp Value Unit 150 W ±30 VESD Kv ±30 ESD per IEC 61000−4−2 (Contact) Operating Temperature Range TJ -55 to +125 ℃ Storage Temperature Range TSTJ -55 to +150 ℃ Rev : 01.06.2017 1/6 www.leiditech.com SLA3304DT6 Electrical Characteristics(TA=25°C unless otherwise specified) Vc Part Number Device Marking VRWM (V) VBR (V) IT (mA) VC @1A LA3 3.3 3.8 1 6 SLA3304DT6 Rev : 01.06.2017 2/6 (Max) 11.8 (@A) 13 IR μA (Max) 0.1 C (Pf) (Typ.) 16 www.leiditech.com SLA3304DT6 TYPIC CHARACTERISTICS Power Derating Curve 8 x 20μs Waveform Clamping Voltage vs. Peak Pulse Current (tp=8/20us) Rev : 01.06.2017 3/6 www.leiditech.com SLA3304DT6 Figure 4. Typic Capacitance vs. Reverse Voltage 10/1000 Ethernet Layout Diagram Rev : 01.06.2017 4/6 www.leiditech.com SLA3304DT6 Circuit Board Layout Recommendations Rev : 01.06.2017 5/6 www.leiditech.com SLA3304DT6 SOT-26 Package Outline & Dimensions Inches Symbol Min. A θ Nom. Max. Min. Nom. Max. 0.035 - 0.057 0.90 - 1.45 A1 0.000 - 0.006 0.00 - 0.15 A2 0.035 0.045 0.051 0.90 1.15 1.30 b 0.010 - 0.020 0.25 - 0.50 c 0.003 - 0.009 0.08 - 0.22 D 0.110 0.114 0.122 2.80 2.90 3.10 E1 0.060 0.063 0.069 1.50 1.60 1.75 E 0.110 BSC 2.80 BSC e 0.037 BSC 0.95 BSC e1 0.075 BSC 1.90 BSC L 0.012 0.018 0.024 0.30 0.45 0.60 L1 θ Soldering Footprint Millimeters (0.024) 0° - (0.60) 10° 0° - 10° aaa 0.004 0.10 bbb 0.008 0.20 ccc 0.008 0.20 Symbol Inches Millimeters C (0.098) (2.50) G 0.055 1.40 P 0.037 0.95 X 0.024 0.60 Y 0.043 1.10 Z 0.141 3.60 Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2017 6/6 www.leiditech.com