SMS24C

SMS24C TVS/ESD DIODE ARRAY AND LATCH-UP PROTECTION Features ● ● ● ● ● Ultra low leakage: nA level Operating voltage: 24V Low clamping voltage Complies with following standards: – IEC 61000-4-2 (ESD) immunity test Air discharge: ±15kV Contact discharge: ±8kV – IEC61000-4-4 (EFT) 40A (5/50ns) – IEC61000-4-5 (Lightning) 8A (8/20 μs) RoHS Compliant Dimensions SOT-26 Pin Configuration Applications ● ● ● ● ● ● USB 2.0 power and data line Set-top box and digital TV Digital video interface (DVI) Notebook Computers SIM Ports 10/100 Ethernet Mechanical Characteristics ● Package: SOT-26 ● Lead Finish: Lead Free ● UL Flammability Classification Rating 94V-0 ● Quantity Per Reel:3,000pcs ● Reel Size:7inch ● Device Marking: TCK Absolute Maximum Ratings(Tamb=25°C unless otherwise specified) Parameter Peak Pulse Power (8/20µs) ESD per IEC 61000−4−2 (Air) Symbol Ppp Value Unit 350 W ±15 VESD Kv ±8 ESD per IEC 61000−4−2 (Contact) Operating Temperature Range TJ -55 to +125 ℃ Storage Temperature Range TSTJ -55 to +150 ℃ Rev : 01.06.2014 1/3 www.leiditech.com SMS24C Electrical Characteristics(TA=25°C unless otherwise specified) Parameter Symbol Test Condition Min Typ VRWM Reverse Working Voltage Breakdown Voltage VBR Max Unit 24 V 26.7 IT = 1mA V Reverse Leakage Current IR VRWM = 24V 1 µA Clamping Voltage VC IPP = 1A (8 x 20 μs pulse) 38 V Clamping Voltage VC IPP = 8A (8 x 20 μs pulse) 46 V Junction Capacitance CJ VR = 0V, f = 1MHz 50 pF Characteristic Curves Fig2. ESD Pulse Waveform (according to IEC 61000-4-2) Fig1. 8/20µ s Pulse Waveform 120 IPP - Peak Pulse Current - % of IPP 100 100% TEST WAVEFORM PARAMETERS tr=8 s td=20 s Peak Value IPP 80 Percent of Peak Pulse Current % tr 60 40 td=t IPP/2 20 0 0 5 10 15 20 25 10% tr = 0.7~1ns Time (ns) 30ns 30 60ns t - Time ( s) Fig3. 90% Power Derating Curve % of Rated Power 110 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 Ambient Temperature –TA (ºC) Rev : 01.06.2014 2/3 www.leiditech.com SMS24C SOT-26 Package Outline & Dimensions Inches Symbol Min. A θ Nom. Max. Min. Nom. Max. 0.035 - 0.057 0.90 - 1.45 A1 0.000 - 0.006 0.00 - 0.15 A2 0.035 0.045 0.051 0.90 1.15 1.30 b 0.010 - 0.020 0.25 - 0.50 c 0.003 - 0.009 0.08 - 0.22 D 0.110 0.114 0.122 2.80 2.90 3.10 E1 0.060 0.063 0.069 1.50 1.60 1.75 E 0.110 BSC 2.80 BSC e 0.037 BSC 0.95 BSC e1 0.075 BSC 1.90 BSC L 0.012 0.018 0.024 0.30 0.45 0.60 L1 θ Soldering Footprint Millimeters (0.024) 0° - (0.60) 10° 0° - 10° aaa 0.004 0.10 bbb 0.008 0.20 ccc 0.008 0.20 Symbol Inches Millimeters C (0.098) (2.50) G 0.055 1.40 P 0.037 0.95 X 0.024 0.60 Y 0.043 1.10 Z 0.141 3.60 Shanghai Leiditech Electronic Co.,Ltd Email: sale1@leiditech.com Tel : +86- 021 50828806 Fax : +86- 021 50477059 Rev : 01.06.2014 3/3 www.leiditech.com