ULC0544M
4-Line Ultra Low Capacitance TVS Diode Array
Features
●
●
●
●
●
Ultra low leakage: nA level
Operating voltage: 5V
Low clamping voltage
Complies with following standards:
– IEC 61000-4-2 (ESD) immunity test
Air discharge: ±30kV
Contact discharge: ±30kV
– IEC61000-4-4 (EFT) 40A (5/50ns)
– IEC61000-4-5 (Lightning) 5A (8/20μs)
RoHS Compliant
Dimensions MSOP-10
Pin Configuration
Applications
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●
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USB 2.0 power and data line
Set-top box and digital TV
Digital video interface (DVI)
Notebook Computers
SIM Ports
10/100 Ethernet
Mechanical Characteristics
●
Package: MSOP-10
●
Lead Finish: Lead Free
●
UL Flammability Classification Rating 94V-0
●
Quantity Per Reel:3,000pcs
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Reel Size:13 inch
Absolute Maximum Ratings(Tamb=25°C unless otherwise specified)
Parameter
Peak Pulse Power (8/20µs)
ESD per IEC 61000−4−2 (Air)
Symbol
Ppp
Value
100
Unit
W
±30
VESD
Kv
±30
ESD per IEC 61000−4−2 (Contact)
Operating Temperature Range
TJ
-55 to +125
℃
Storage Temperature Range
TSTJ
-55 to +150
℃
Rev : 01.06.2014
1/3
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ULC0544M
Electrical Characteristics(TA=25°C unless otherwise specified)
Vc
Part Number
Device
Marking
VRWM
(V)
VBR
(V)
IT
(mA)
VC
@1A
544M
5
6
1
12
ULC0544M
(Max)
(@A)
20
IR
μA
(Max)
C
(Pf)
(Typ.)
0.5
0.6
5
Characteristic Curves
Fig2. ESD Pulse Waveform (according to IEC 61000-4-2)
Fig1. 8/20µ s Pulse Waveform
120
IPP - Peak Pulse Current - % of IPP
100
100%
TEST
WAVEFORM
PARAMETERS
tr=8 s
td=20 s
Peak Value IPP
80
Percent of Peak Pulse Current %
tr
60
40
td=t IPP/2
20
0
0
5
10
15
20
25
10%
tr = 0.7~1ns
Time (ns)
30ns
30
60ns
t - Time ( s)
Fig3.
90%
Power Derating Curve
% of Rated Power
110
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
Ambient Temperature –TA (ºC)
Rev : 01.06.2014
2/3
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ULC0544M
MSOP-10 Package Outline Drawing
e
A
DIM
D
N
SEE DETAIL
2X
SIDE VIEW
E/2
E
E1
PIN 1
INDICATOR
H
ccc C
1 2
2X N/2 TIPS
c
GAGE
PLANE
B
0.25
L
01
(L1)
D
DETAIL
aaa C
A2
SEATING
PLANE
A
DIMENSIONS
INCHES
MILLIMETERS
NOM
MIN NOM MAX MIN
MAX
A
A1
A2
b
c
D
E1
E
e
L
L1
N
01
aaa
bbb
ccc
.043
.006
.000
.037
.030
.007
.011
.009
.003
.114 .118 .122
.114 .118 .122
.193 BSC
.020 BSC
.016 .024 .032
(.037)
10
8°
0°
.004
.003
.010
1.10
0.15
0.00
0.95
0.75
0.17
0.27
0.23
0.08
2.90 3.00 3.10
2.90 3.00 3.10
4.90 BSC
0.50 BSC
0.40 0.60 0.80
(.95)
10
0° 8°
0.10
0.08
0.25
A
A
A1
C
bxN
bbb
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS
-A-
AND
-B-
TO BE DETERMINED AT DATUM PLANE
-H-
3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
4. REFERENCE JEDEC STD MO-187, VARIATION BA.
Suggested Land Pattern
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
INCHES
MILLIMETERS
(.161)
.098
.020
.011
.063
.224
(4.10)
2.50
0.50
0.30
1.60
5.70
P
NOTES:
1.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
Rev : 01.06.2014
3/3
www.leiditech.com
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