X2B012000DC1H-X

SPECIFICATIONS FOR APPROVAL GP Customer Part No.: HELE. Part No: Application For: Products: Accepted Model: Type & Freq.: HSX221SA / 12.000MHz Sample Order No: EOS-C50003-7 X2B012000DC1H-X CRYSTAL Date: 2012/05/24 Approved By : HARMONY ELECTRONICS CORP. HARMONY ELECTRONICS (THAILAND) CO., LTD. HARMONY ELECTRONICS (SHENZHEN) CORP., LTD. TAIPEI OFFICE: 公司:(114) 台北市內湖區堤頂大道 2 段 409 號 2 樓 2F., NO.409, SEC.2, TIDING BLVD., NEIHU DISTRICT, TAIPEI CITY 114, TAIWAN (R.O.C.) TEL:886-2-26588883 FAX:886-2-26588683 TAIWAN FACTORY: 工廠:(831) 高雄市大寮區大發工業區華東路 39 號 No.39, Hua dong Rd., Daliao Dist.,Dafa Industrial Park., Kaohsiung City 831, Taiwan (R.O.C.) TEL: (07)787-1555-6 FAX: (07)787-1557 Tittle HSX221SA Date THAILAND FACTORY: 66MOO 5, KAONGU-BEOKPRAI RD., T.BEOKPRAI, A. BANPONG, RAJCHABUREE PROVINCE 70110, THAILAND TEL: (032)221994-6, 200740-1 FAX: (032)200742 SHENZHEN FACTORY: 深圳市福永鎮塘尾村塘橋路聚源工業區 QIAO TANG RD., TANGWEI VILLAGE FU YONG TOWN SHENZHEN CITY CHINA TEL: 0755-7309272 / 7309262 FAX: 0755-7309755 Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Prepare Check 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 1 HSX221SA SPECIFICATION INDEX ITEM PAGE 1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．． 3 2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．． 4 3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．． 5 4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．． a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．． 6 b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．． 6-7 c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．． 7 d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．． 7 e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．． 7 f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．． 7 g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．． 8 h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．． 8 i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．． 8 j. PACKAGE．．．．．．．．．．．．．．．．．．．．．．．．．．． 9 5. MECHANICAL ENDURANCE．．．．．．．．．．．．．．．．．． 10 6. ENVIRONMENTAL ENDURANCE．．．．．．．．．．．．．．．． 10 7. SUPPLEMENT．．．．．．．．．．．．．．．．．．．．．．．．． 11-12 8. Flow Chart．．．．．．．．．．．．．．．．．．．．．．．．．．． 13 9. Environmental Workload Chemical Substance Components List． 14 Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 2 1. QUARTZ CRYSTAL UNIT SPECIFICATION 1. Frequency: 12.000000MHz 2. Holder type : HSX221SA 3. Frequency tolerance: +/-20 ppm at 25deg.C +/-3deg.C 4. Equivalent resistance: 250 ohms Max. / SERIES 5. Storage temperature range: -40 deg.C To +85 deg.C 6. Operable temperature range: -10 deg.C To +60 deg.C 7. Temperature drift: +/-20ppm 8. Loading capacitance (CL) : 12.0 pF 9. Drive level: 10 μW 10. Shunt Capacitance: 2.0 pF Max 11. Insulation resistance : More than 500M ohms at DC 100V 12. Mode of oscillation: Fundamental 13. Circuit: Measured in HP/E5100A,S&A 250B 14. Shocking : Dropping from 50 cm height 3 times on firm wood Variation : -10 deg.C To +60deg.C (100uW Max) Frequency less than +/-5 ppm Resistance less than +/- 15 ﹪or 2ohms max. 15. Aging: Less than +/- 1 ppm/Year 16. Holder HSX221SA Seam type 17.Dimensions and marking Refer to page.4 18.Emboss carrier tape & reel 19.Note: Refer to page.6 and page.7 Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 3 2. HSX221SA MARKING & DIMENSIONS Chamfer index mark depends on the ceramic base supplier *Marking should be printed as following: Logo, Nominal Frequency, Manufactured year & month *Nominal frequency = integer only ( ex. 14.31818 MHz Æ 14 ) *Manufacturing Lot No. (Y: year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1) (M: month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2). Marking : Laser marking. (Table-1) Year Code 2000 2010 0 2001 2011 1 2002 2012 2 2003 2013 3 2004 2014 4 2005 2015 5 2006 2016 6 2007 2017 7 2008 2018 8 2009 2019 9 (Table-2) Jan. A Feb. B Mar. C Apr. D May. E Jun. F Jul. G Tittle HSX221SA Date Aug. H Sep. J Oct. K Nov. L Dec. M Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 4 3. INSIDE STRUCTURE ※Reference drawing (1) Base: Alumina Ceramic (Al2O3) Metallized Pad: Ni Plating Au Plating (2) Lid : Fe- Ni -Co (3) Crystal Enclosure Seal: Seal Seam (4) Crystal Blank Rectangular At-Cut Quartz Crystal Blank (5) Adhesive Silver Conductive Silicon Resin The use prohibition chemistry substance of Table 1 of DHE-0204-1 (HE-QA-24) is not included in this item. (6) Electrode (7) PAD Alumina Ceramic (Ni. Au) (8) Cover Ring： Fe-Ni-Co Alloy Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 5 4. HSX221SA EMBOSS CARRIER TAPE & REEL a.) Dimensions of Carrier Tape b.) Dimensions of Reel Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 6 (Table-2) (UNIT: mm) MARK DIMENSIONS‧ANGLE Diameter A ψ180+0/-3 Inner Width W1 9.3+/-0.3 Outer Width W2 Out Line diameter B 11.3+/-1.0 ψ60.5+/-0.5 F1 3.0+0.5/-0 F2 4.0+0.5/-0 F3 5.0+0.5/-0 q C 120deg ψ13.2+/-0.5 E 3.0+/-0.2 ITEM FLANCE HUB Width Center Core slit Position Spindle diameter Key Ditch Width c.) Storage condition Temperature: +40deg.C Max. Relative Humidity: 80% Max. d.) Standard packing quantity 3,000PCS / REEL e.) Material of the tape Tape Carrier tape Top tape Material PS Conductive Polyester f.) Label contents Sticks label for every reel. Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 7 g.) Taping dimension Cover-tape Leader Carrier-tape Cover-tape Terminal Carrier-tape Terminal The length of cover-tape in the leader is more than 400 mm including empty embossed area. After all products were packaged, must remain more than twenty pieces or 400 mm empty area, which should be sealed by cover-tape. The tip of cover-tape shall be fixed temporary by paper tape and roll around the core of reel one round. The empty embossed area which are sealed by top cover-tape must remain more the 40 mm. Components Leader Emptv compartments Emptv compartments Top cover-tape Embossed Carrier-tape h.) Joint of tape The carrier-tape and top cover-tape should not be jointed. i.) Release strength of cover tape It has to between 0.1N to 0.7N under following condition. Pulling direction 165° to 180° Speed 300mm/min. Otherwise unless specified. 165°~ 180° Pulling direction Other standards shall be based on JIS C 0806-1990. Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 8 j.) Package Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 9 5. Mechanical Performance Test Methods 1 Natural Drop 2 Vibration 3 Sealing Tightness 4 Solderability Drop 3 times from the height of 50cm onto min. 30mm thickness hard wooden board. Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X, Y and Z 3 axes, Duration of 2 hours to each axis. Leak Rate 1.0x10-8 Pa-m3/sec. Max. Measured by Helium leak detector. – Fine Leakage. After applying ROSIN Flux, dipping in solder bath at 245deg.C+/-5deg.C for 3+/-0.5 sec. 6. 1 2 3 4 A A --B Environment Performance Item Specifications Code Test Methods Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours. Back to room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. +85deg.C +/-2deg.C, Duration of 240 hours. Back to the room temperature first, then in 1~2 hours, the component shall be checked. -40deg.C +/-2deg.C (30min) ↔ +85deg.C +/-2deg.C (30min) 25 cycles. Back to the room temperature first, then in 1~2 hours, the component shall be checked. Humidity Storage in Low Temperature Storage in High Temperature Temperature cycles A A A A Specifications code Specifications A Frequency variation shall be within +/-5ppm and equivalent resistance shall be within the specification after the test More than 90% of lead shall be covered by new solder. B Tittle HSX221SA Date Specifications Code Item Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 10 7. Supplement 7.1.Soldering 7.2.Please stay with our proposed reflow condition and do then soldering 2 times max. Available for Lead Free Soldering Temperature 260 deg.C 220 deg.C (3) 160~180deg.C (2) (1) Time (1) Preheat 160~180 deg.C 120sec. (2) Primary heat 220 deg.C 60sec. (3) Peak 260 deg.C 10sec. Max. 7.3.Land pattern layout(Example) 7.4.Solder iron (Example) Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max. Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 11 7.5.Mounting This component is designed for automatic insertion. However, you are requested to do the trial with your insertion machine in order to be sure of proper operation and no damage of component. Please pay attention to board warp which may damage the component and cause Soldering Process. 7.6.Cleaning Cleaning liquid which corrodes Nickel shall not be used It may cause the problem on the surface, color, marking etc. Ultra-sonic cleaning is possible, however, you are requested to check on your board. Because we only checked as single unit. 7.7.Storage Please keep away from high temperature and high humidity ,which may cause put solderbility. No direct Sunlight, No dew as well. Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 12 8. Flow Chart Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 13 9. Environmental Workload Chemical Substance Components List Environmental Workload Chemical Substance Components List TYPE HSX221S PERCENTAGE 9.6(mg) ppm Si 0.316800 30.412800 Au 0.048000 4.608000 Co & Co Compound 0.784320 75.294720 Mo & Mo Compound 0.017280 1.658880 Ag 1.875840 180.080640 Cu 0.075840 7.280640 Cr & Cr Compound 0.024000 2.304000 Al 2.083200 199.987200 Mn & Mn Compound 0.014400 1.382400 W & W Compound 0.042240 4.055040 Ni & Ni Compound 2.090880 200.724480 Fe 2.220480 213.166080 Chemical Substance Components Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. Page X2B012000DC1H-X ELECTRONICS CORP. 0 14 REV. No. DATE REASON 0 2012/05/24 New CONTENTS Tittle HSX221SA Date Country of origin QUARTZ CRYSTAL SPECIFICATION Confirm Check Prepare 2012/05/24 F. S. TSAI C. L. WANG U. F. CHEN HARMONY Spec. No. TAIWAN FACTORY Rev. 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