HL-508H256WC-HD_6000K 数据手册
HL-508H256WC-HD-6000K
Specification
规 格 书
Customer Name:
客户名称:
Customer P/N:
客户品号:
Factory P/N:
公司品号:
HL-508H256WC-HD
Sending Date:
送样日期:
Client approval
Goozo approval
Approval
客户审核
Audit
Confirmation
Approval
鸿利国泽审核
Audit
Confirmation
核准
确认
制作
核准
确认
制作
□ Qualified
□ Disqualified
接受
不接受
DATE:
日期:
Address:Dangui Road NO. 1 Dantu Area Zhenjiang City Jiangsu Province
地址:江苏省镇江市丹徒区丹桂路 1 号
Tel/电话:0511-88786599
Fax/传真:0511-88786599
Web/网址:www.goozo.com.cn
1.此规格书以中英文方式书写,若有冲突以中文版本为准文本.
2.此规格书的最终解释权归属江苏鸿利国泽光电科技有限公司
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HL-508H256WC-HD-6000K
ATTENTION 注意
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Features
φ5LAMP LED 直插 φ5LED 灯
Low Power Consumption/低功耗
IDEAL FOR BACKLIGHT AND INDICATOR.
Description/描述
用于背光和指示
This devices are made with GaN/LED
Package Dimensions
0.5
typ
2.54
typ
1.5
max
1
4.9
2
1.0min
1.0
25.0min
5.8
7.7
2.CATHODE
1.ANODE
Dimension Tolerance/尺寸 (Unit:mm)
Tolerance
Grade/公差等级
0.5~3
3~6
6~30
30~120
±0.1
±0.2
±0.3
±0.5
Chip/晶片
Lens Color/胶体颜色
Emitting Color/
Material/材质
GaN
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发光颜色
Water Clear/无色透明
White/白色
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HL-508H256WC-HD-6000K
■Absolute Maximum Rating Ta=25℃
Symbol 符号
Value 数值
Unit 单位
IF
30
mA
Peak Forward Current* 峰值正向电流
IFP
100
mA
Reverse Voltage 反向电压
VR
5
V
Power Dissipation 功耗
PD
110
mW
Electrostatic discharge 抗静电能力
ESD
2000
V
Operation Temperature 操作温度
Topr
-30∽+80
℃
Storage Temperature 储存温度
Tstg
-40∽+100
℃
Lead Soldering Temperature*引脚焊接温度
Tsol
Max. 260℃ for 5sec Max.
Item 项目
Forward Current 正向电流
*IFP Conditions:Pulse Width≤10msec /IFP 正向峰值电流使用条件:脉冲宽度≤10 毫秒
*Tsol Conditions:1.6mm from the base of the epoxy bulb/Tsol 焊接条件:焊接位置离胶体底部 1.6 毫米
■ Typical Optical/ Electrical Characteristics
Item(项目)
Ta=25℃
Symbol
Condition
Rank
Min.
Typ.
Max.
Unit
符号
条件
档次
最小值
典型值
最大值
单位
Z3
14000
--
18200
mcd
Z4
18200
--
23660
mcd
Z5
23660
--
30758
mcd
2.6
3.2
3.6
--
15
--
Luminous Intensity
光强
Forward Voltage 正向电压
Viewing Angle 角度
Iv
VF
IF=20mA
2θ 1/2
V
deg
Chromaticity coordinates
X
--
0.32
--
X:±0.015
色温坐标
Y
--
0.34
--
Y:±0.025
--
--
--
20
mA
VR=5V
--
--
10
RecommendForwardCurrent
推荐使用正向电流
Reverse Current 反向电流
IF(rec)
IR
uA
Notes/注释:
Tolerance :VF±0.1V,λd±2 nm,IV(φV) ±15%,2θ 1/2±15%,X/Y±0.005.
公差:正向电压±0.1V,主波长±2 nm,光强(光通量)±15%,角度±15%,X/Y±0.005.
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HL-508H256WC-HD-6000K
If(mA)
50
2.5
40
2.0
30
1.5
20
1.0
10
0.5
0
Vf(V)
3.2
3.0
2.8
2.6
3.4
If(mA)
0.0
10
0
3.6
Forward Current vs. Forward Voltage
20
40
30
50
Relative Luminous Intensity vs. Forward Current
1.0
2.0
0.8
1.0
0.6
0.5
0.4
0.2
0.2
450
400
500
550
600
Ta( ℃)
0.1
WL(nm)
0.0
-40
650
-20
-10
0
10
20
30
40
60
80
100
Relative Luminous Intensity vs. Ambient Temperature
Relative Luminous Intensity vs. Wavelength
If(mA)
60
20°
50
10°
0°
10°
20°
30°
30°
40°
40°
40
50°
50°
30
60°
60°
20
70°
70°
80°
80°
10
Ta( ℃)
0
0
20
40
60
80
Maximum Forward Current vs.Ambient Temperature
100
90°
90°
100%
50%
0%
50%
100%
Relative Luminous Intensity vs.Radiation Angle
■ Reliability Performance 可靠性
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HL-508H256WC-HD-6000K
Test Items And Result 测试项目和判定
Test
Classification
Test Item 测试项目
Test Conditions 测试条件
测试类别
Life Test
寿命测试
Room Temperature
DC Operating Life Test
测试持续时间
Sample
Size
样品数量
AC/RE
接受/拒收
1000 hrs
22 pcs
0/1
100 cycles
22 pcs
0/1
100 cycles
22 pcs
0/1
85℃±5℃/85% RH
IF=5mA
1000 hrs
22 pcs
0/1
Ta=100℃±5℃
1000 hrs
22 pcs
0/1
Ta=-40℃±5℃
1000 hrs
22 pcs
0/1
Temp=260℃max
T=5sec max
1times
22 pcs
0/1
Load 2.5N(0.25kgf)
0° ~ 90° ~0°
3times
22 pcs
0/1
室温直流寿命测试
Thermal Shock Test
冷热冲击
Temperature Cycle Test
高低温循环实验
Environment
Test
High Temperature &
环境模拟
High Humidity Test
实验
高温高湿实验
High TemperatureStorage
高温储存
Low TemperatureStorage
低温储存
Resistance to
Mechanica
Test
Soldering Heat
机械测试
Lead Integrity
耐焊接实验
引脚折弯实验
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Ta=25℃±5℃,IF=20mA
Test Duration
100℃±5℃ 5min
↑↓
-40℃±5℃ 5min.
100℃±5℃ 30min
↑↓5min
-40℃±5℃ 30min.
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HL-508H256WC-HD-6000K
■ Dip Soldering/焊接
TEMPERATURE( °C)
300
Max:260℃,5sec.
Suggest:2~3sec.
250
200
150
100
Fluxing
50
30
Preheat
10
20
30
40
50
60
70
80
90
100
110
120
TIME(sec.)
1. Please avoid any external stress applied to the lead-frames and epoxy while the LEDs are at high
temperature,especially during soldering/在高温焊接过程中,不可有任何外力施加在 LED 的引脚、环氧上;
2. DIP soldering and hand soldering should not be done more than one time/浸焊、手工焊接次数不可超过
1 次;
3. After soldering, avoid the epoxy lens from mechanical shock or vibration until the LEDs are back to room
temperature/焊接后,在 LED 温度恢复到室温的过程中,不可受到震动或其它外力的冲击;
4. Avoid rapid cooling during temperature ramp-down process/在 LED 降温过程中,避免急剧的冷却;
5. Although the soldering condition is recommended above, soldering at the lowest possible temperature is
feasible for the LEDs/LED 在焊接过程中,应尽可能的降低焊接温度,以减少高温对 LED 的损伤;
■
IRON
Soldering/手动焊接
300℃ Within 3 sec.,One time only/300℃,3 秒,1 次;
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HL-508H256WC-HD_6000K 价格&库存
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