ESD1811CDN
LOW VOLTAGE BIDIRECTIONAL TVS DIODE
Features
●
150 Watts Peak Pulse Power per Line (tp=8/20μs)
●
Protects One Bidirectional I/O Lines
●
Low Clamping Voltage
●
RoHS Compliant
●
IEC61000-4-2 (ESD) ±30kV (air), ±30kV (contact)
●
IEC61000-4-4 (EFT) 40A (5/50ηs)
●
IEC61000-4-5 (LIGHTING) 18A (8/20μs)
Dimensions DFN1006
Applications
●
Cellular Handsets & Accessories
●
Keypads, Side Keys, Audio Ports
●
Portable Instrumentation'
●
Notebooks, Desktops, and Servers
●
Digital Lines
●
Tablet PC
Pin Configuration
Mechanical Characteristics
●
DFN1006 Package
●
Molding Compound Flammability Rating : UL 94V-O
●
Weight 0.5 Millgrams (Approximate)
●
Reel Size : 7 inch
●
Lead Finish : Lead Free
Absolute Maximum Ratings(Tamb=25°C unless otherwise specified)
Parameter
Peak Pulse Power (8/20µs)
ESD per IEC 61000−4−2 (Air)
Symbol
Value
Ppp
150
VESD
± 30
Unit
W
Kv
± 30
ESD per IEC 61000−4−2 (Contact)
Operating Temperature Range
TJ
-55 to +150
℃
Storage Temperature Range
TSTJ
-55 to +150
℃
Rev : 01.06.2018
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ESD1811CDN
Electrical Characteristics(TA=25°C unless otherwise specified)
Vc
Part Number
ESD1811CDN
Rev : 01.06.2018
Device
Marking
TD
VRWM
(V)
VBR
(V)
IT
(mA)
1.8
2.3
1
VC
@1A
3.6
2/6
(Max)
8.5
(@A)
18
IR
μA
(Max)
C
(Pf)
(Typ.)
0.1
25
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ESD1811CDN
Typical Performance Characteristics (TA=25°C unless otherwise Specified)
Figure 1.
8 x 20μs Waveform
Figure 2.
Power Derating Curve
Figure 3. Clamping Voltage vs. Peak Pulse Current (tp=8/20μs)
Rev : 01.06.2018
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ESD1811CDN
Typical Performance Characteristics (TA=25°C unless otherwise Specified)
Figure 4. Typic Breakdown Voltage vs. Temperature
Figure 5. Typic Reverse Leakage vs. Temperature
Rev : 01.06.2018
4/6
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ESD1811CDN
Transmission Line Pulse (TLP) is a measurement technique used in the Electrostatic Discharge (ESD) arena to
characterize performance attributes of devices under ESD stresses. TLP is able to obtain current versus voltage (I−V)
curves in which each data point is obtained with a 100 ns long pulse, with currents up to 40 A. TLP was first used
in the ESD field to study human body model (HBM) in integrated circuits, but it is an equally valid tool in the field
of system level ESD. The applicability of TLP to system level ESD is illustrated in Figure 1, which compares an
8 kV IEC 61000−4−2 current waveform with TLP current pulses of 8 and 16 A. The current levels and time
duration for the pulses are similar and the initial rise time for the TLP pulse is comparable to the rise time of the
IEC 61000−4−2’s initial current spike. This application note will give a basic introduction to TLP measurements and
explain the datasheet parameters extracted from TLP for SDI Technology’s protection products.
Rev : 01.06.2018
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ESD1811CDN
DFN1006
PACKAGE OUTLINE & DIMENSIONS
e
D
h
A
DIMENSIONS
MILLIMETERS
INCHES
MIN
NOM
MAX
MIN
NOM
MAX
0.45
0.50
0.55
0.018
0.020
0.022
A1
0.00
0.02
0.05
0.000
0.001
0.002
b
0.45
0.50
0.55
0.018
0.020
0.022
c
0.12
0.15
0.18
0.005
0.006
0.007
D
0.95
1.00
1.05
0.037
0.039
0.041
SYM
h
-
b
E
-
L
c
A
Bottom View
A1
e
0.65 BSC
0.026 BSC
E
0.55
0.60
0.65
0.022
0.024
0.026
L
0.20
0.25
0.30
0.008
0.010
0.012
h
0.07
0.12
0.17
0.003
0.005
0.007
Suggested Land Pattern
SYM
╋
Y3
MILLIMETERS
INCHES
X
0.60
0.024
Y1
0.50
0.020
Y2
0.30
0.012
Y3
0.80
0.032
Z
1.30
0.052
Y1
Z
Y2
╋
DIMENSIONS
X
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
Rev : 01.06.2018
6/6
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