Material
Housing Material: High temperature thermoplastic
Contact Terminal: High Grade Copper Alloy
Metallic Shell: Stainless Steel
Inner Ground Cover Shell: Stainless Steel
Mid Plate: Stainless Steel
Plating
Data Contact
Underplating: 50µ" Min. Nickel
Contact Plating: 1µ" Gold
Solder Area: 80µ" Matte Tin
Shell
Metallic Shell: 50µ" Min. Nickel
Cover Shell
Metallic Shell: 80µ" Min. Nickel
Inner Ground Cover Shell
Metallic Shell: 50µ" Min. Nickel
Electrical
Voltage Rating: 20V DC
Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A,
B5 pin 1.25A, Other pins 0.25A per pin.
Contact Resistance: 40mΩ Max.
Insulation resistance: 100 MΩ MIN.
Dielectric withstanding voltage: 100V AC/Minute
Mechanical
Durability: 10,000 cycles
Mating Force: 5 to 20N
Unmating Force: 8 to 20N (post test)
8.94 [0.352]
0.60 [0.024]
0.10
3.16 [0.124]
7.90 [0.311]
7.55 [0.297]
1.20 [0.047]
B1
1.50 [0.059]
1.30 [0.051]
2.70 [0.106]
0.50 [0.020]
8.64 [0.340]
4.55 [0.179]
0.60 [0.023]
8.64 [0.340]
1.60 [0.063]
8.10 [0.319]
2.25 [0.089]
0.95 [0.037]
0.30 [0.012]
0.60 [0.024]
0.50 [0.020]
0.60 [0.024]
0.25 [0.010]
1.22 [0.048]
5.50 [0.217]
1.90 [0.075]
6.80 [0.268]
8.64 [0.340]
5.50 [0.217]
RECOMMENDED P.C.B. LAYOUT
TOLERANCE UNSPECIFIED ±0.05mm
6.80 [0.268]
X
X
X
DATE
DESCRIPTION
REVISIONS
www.xk-dg.cn
www.helloxkb.com
REVISED
APPROVED
ANGLAR
L≤4
4
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