CD02K032768ADE

HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 1 of 7 CRYSTAL SPECIFICATION 客户 : 华强聚丰 客户料号 : 泰晶料号 : 产品类别 日期 CD02K032768ADE TF308-32.768-12.5-20 : 2018.12.28 : CUSTOMER’S APPROVAL (PLEASE RETURN A COPY WITH APPOVAL Hubei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 DESIGNER APPROVED 代 伟 伟 何金玲 SALE Department ：TEL ：0722-3309660 FAX ：0722-3309619 QCD Department ： TEL ：0722-3308231 FAX ：0722-3309768 FAE Department ： TEL ：0755-27328651 FAX ：0755-27328001 HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 2 of 7 REV. Description of Revision History A New revision 2018 年 12 月 28 日 Designer Checked By HE JIN LING Dai Wei HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 3 of 7 CRYSTAL SPECIFICATION 1. 2. 3. 4. 5. 6. Description: Tuning Fork Quartz Crystal Nominal Frequency: 32.768KHz Oscillation Mode: Fundamental Cutting Mode: x +2° cut Measurement Instrument: S&A 250B(Calculated FL) Electrical Characteristics: [1]Operation Conditions: Item Symbol MIN. Operating Temperature Range Topt Storage Temperature Range Tstg TYP. MAX. Unit -20 70 ℃ -40 85 ℃ Load Capacitance CL 12.5 pF Drive Level DL 0.1 uW Condition [2]Frequency Stability: Item Symbol MIN. Tolerance dF/Fo -20 Stability Over Temperature dF/F25 Aging dF/F25 TYP. MAX. Unit Condition 20 ppm Refer to Center Frequency@25±3℃ ppm/℃2 -0.034 -5 5 ppm Refer to Operating Temperature Per Year dF/Fo:Frequency Deviation Refer to Center Frequency dF/F25:Frequency Deviation Refer to 25℃ Frequency [3]Electrical Performance: Item Equivalent Series Resistance Symbol MIN. TYP. ESR Shunt Capacitance C0 Insulation Resistance IR 1.8 500 MAX. Unit 30 KΩ 3 pF MΩ Condition @Series @DC 100 Volt 7. Marking:Laser Marking Generally for empty. Refer to with Customer’s requirement. 32.768 HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 4 of 7 8. Outline drawing (unit：mm) 8.1 Attention 8.2 Not recommended reflow furnace welding,If it is to be used, the maximum temperature shall not exceed 230℃. HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 5 of 7 9. Reliability Specification Test Items Test Method and Condition Vibration (1)Vibration Frequency 10 to 55Hz (2)Vibration Amplitude 1.5mm (3) Cycle Time Shock Hermetic seal Solder ability High temperature Low temperature Humidity Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. 1-2min(10-55-10Hz) (4)Direction (5)Duration Requirements X.Y.Z 2h/each direction 3 Times free drop from 75cm height to hard wooden board of thickness more than 30mm Helium leak detector Checked:before the molded crystal uints Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. less than 1 × 10 EXP(–7) mbar.l/sec. Dip the leads of crystal units into the solution (7-10%) of The dipped surface of the leads should be at rosin 3±0.5s,then dip it into the tank 5-10s. least 95% covered with continuous new solder Temperature of solder melted tank is coating 245℃±5℃ 96 hours at +100℃±2℃ After 1-2hours past at room temperature from following Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. 72 hours at -40℃±2℃ Frequency Change:±5ppm Max. After 1-2hours past at room temperature from following test. Resistance Change: 5kohm Max. 96 hours at +40℃±2℃,relative humidity 90-95% After 1-2hours past at room temperature from following Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. After supplying the following temperature cycle Frequency Change:±5ppm Max. (50cycles) Resistance Change: 5kohm Max.x. Temperature cycle salt spray test Lead strength On the basis of GB/T10125-1997 In the lead 2.00 Kg tensile force was applied at the end to keep more than 5 seconds Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 6 of 7 10. Handling Notice for Standard Tuning Fork Crystal (Cylindrical Type) 10.1. Shock resistance It may deteriorate the characteristics or cause of no oscillation if excess physical shock given. Please be careful not to drop. Please use under condition to minimize the shocks as much as possible. Please review the conditions if it is used by auto mounting or after the conditions are changed. 10.2. Heat and humidity resistance in storage Storing the crystal products under higher or lower temperature or high humidity for a long period may deteriorate the characteristics of crystal units. Please store and use the crystal products at the normal temperature and humidity. 10.3. Solder heat resistance Standard type crystal products use Material have a 230℃ melting point. Heating up the package more than 230ºC may deteriorate the characteristics or cause of no oscillation the products. If the crystal products need to be soldered at temperature of more than +230ºC, please study heat-resistance products or SMD products. Please review the condition or consult us about flow solder process. Our soldering condition is under 280ºC within 3sec or 320ºC within 2sec for lead parts use the soldering iron . Please don’t solder the crystal unit (case) directly. It may cause of deteriorate the characteristics. 10.4. Mounting method to PCB When the crystal products need to be lay down please fix to PCB securely. If the crystal is used with mechanical vibration location, please put cushion in between PCB or fix with elasticity glue (Silicon etc) as shown in below figure. Please don’t gluing hermetic seal grass. When the crystal products need to be mounted vertically, gap between crystal units and PCB more than 3mm for 3×8 type , more than 2mm for 2×6 type is recommended. 3×8 ： 3mmmin 2×6 ： 2mmmin 10.5. Lead process When the lead needs to be cut please maintenance the cutter. When the lead needs to be bent or repaired please be careful not to giving excess pressure at the root of the lead to avoid crack of the hermetic seal glass. Also please be careful not to giving excess pressure at sealing to avoid sealing tightness deteriorate. Leave more than 0.5 mm of lead from the case. 10.6 Ultrasonic cleaning and ultrasonic soldering Soldered by ultrasonic cannot be guaranteed, because crystal may be sympathetic vibrated and may damage.Please study at your side about ultrasonic cleaning. 10.7 Drive level Applying excessive drive level to the crystal units may cause deterioration of characteristics or damage. Less then 1.0μW is recommended to this products. More than 2.0μW cannot be guaranteed. HuBei TKD Electronic Technology Co.,LTD 湖北泰晶电子科技股份有限公司 page 7 of 7 11. Packing Desrciption