B5817WL THRU B5819WL
SCHOTTKY BARRIER RECTIFIERS
PINNING
Features
PIN
• Metal silicon junction, majority carrier conduction
• Guarding for overvoltage protection
DESCRIPTION
1
Cathode
2
Anode
1
2
• Low power loss, high efficiency
• High current capability
• low forward voltage drop
• High surge capability
• For use in low voltage, high frequency inverters,
Weight:17mg,0.0006 oz
Simplified outline SOD-123FL and symbol
free wheeling, and polarity protection applications
Maximum Ratings and Electrical characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.
Symbols
B5817WL
B5818WL
B5819WL
Units
Maximum Repetitive Peak Reverse Voltage
V RRM
20
30
40
V
Maximum RMS voltage
V RMS
14
21
28
V
Maximum DC Blocking Voltage
V DC
20
30
40
V
Parameter
Maximum Average Forward Rectified Current
I F(AV)
1
A
Peak Forward Surge Current, 8.3ms Single Half Sine-wave
Superimposed On Rated Load (JEDEC method) at TL = 70°C
I FSM
25
A
Maximum Instantaneous Forward Voltage at 1 A
Maximum Instantaneous Forward Voltage at 3.1 A
VF
Maximum Instantaneous Reverse Current at TA = 25°C
Rated DC Reverse Voltage
TA = 100°C
IR
1
10
mA
RθJA
RθJL
50
15
°C/W
Cj
110
pF
T j , T stg
-55 ~ +125
°C
0.375" (9.5 mm) Lead Length at T L = 90°C
Typical Thermal Resistance
Typical Junction Capacitance
Storage and Operating Junction Temperature Range
REV.08
1 of 4
0.45
0.75
0.55
0.875
0.6
0.9
V
B5817WL THRU B5819WL
Fig.2 Typical Reverse Characteristics
Instaneous Reverse Current ( μA)
Fig.1 Forward Current Derating Curve
Average Forward Current (A)
1.2
1.0
0.8
0.6
0.4
Single phase half-wave 60 Hz
resistive or inductive load
0.2
0.0
20
60
40
80
100
120
140
10 4
10 3
T J =125°C
10 2
T J =75°C
10 1
T J =25°C
10 0
0
Lead Temperature (°C)
80
100
500
5°
C
=2
TJ
12
5°C
0.5
Junction Capacitance ( pF)
1.0
TJ =
0.2
0.1
0
30
0.1
0.2
0.3
0.4
0.5
0.6
100
50
20
10
0.1
10
1
100
Instaneous Forward Voltage (V)
Reverse Voltage (V)
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
Fig.6- Typical Transient Thermal Impedance
8.3 ms Single Half Sine Wave
(JEDEC Method)
25
20
15
10
05
00
1
200
0.7
Transient Thermal Impedance( °C /W)
Instaneous Forward Current (A)
Peak Forward Surage Current (A)
60
Fig.4 Typical Junction Capacitance
Fig.3 Typical Forward Characteristic
10
100
Number of Cycles at 50Hz
REV.08
40
20
Percent of Rated Peak Reverse Voltage(%)
100
10
1
0.1
0.01
0.1
1
10
t, Pulse Duration(sec)
2 of 4
100
B5817WL THRU B5819WL
PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
SOD123FL
∠ALL ROUND
C
A
∠ALL ROUND
VM
D
E
A
g
Top View
mil
Bottom View
A
C
D
E
e
g
HE
max
1.1
0.20
2.9
1.9
1.1
0.9
3.8
min
0.9
0.12
2.6
1.7
0.8
0.7
3.5
max
43
7.9
114
75
43
35
150
min
35
4.7
102
67
31
28
138
UNIT
mm
g
pad
e
E
A
pad
HE
∠
7°
The recommended mounting pad size
Marking
2.0
(79)
1.2
(47)
Type number
1.2
(47)
1.2
(47)
Unit: mm
(mil)
REV.08
3 of 4
Marking code
B 5817WL
SJ
B 5818WL
SK
B 5819WL
SL
B5817WL THRU B5819WL
Recommended condition of flow soldering
300
Preliminary Heating
Soldering
Cooling (in air)
Temperature of Soldering (°C)
265°C
250
245°C
200
150
120°C
100
100°C
50
0
2 to 5 min
more than 1 min
less than 10s
R ecommended condition of reflow soldering
Temperature of Soldering (°C)
300
Peak Temperature
245 to 260°C, 10s max.
250
Reflow Heating Rate
1 to 5°C / s
200
150
100
50
Pre Heating Rate
1 to 5°C / s
Preliminary Heating
130 to 170°C,
50 to 120s
Soldering
230°C
20 to 30s
Cooling
more than 60s
0
2 times max.
Recommended peak temperature is over 245 °C. If peak temperature is below 245 °C, you may adjust
the following parameters; time length of peak temperature (longer), time length of soldering (longer),
thickness of solder paste (thicker)
• Condition of hand soldering
Temperature: 320°C
Time: 3s max.
Times: one time
• Remark:
Lead free solder paste (96.5Sn/3.0Ag/0.5Cu)
REV.08
4 of 4
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