MB8F

MB1F THRU MB10F 0.8A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER FEATURES: Glass Passivated Chip Juntion 3 Reverse Voltage - 100 to 1000 V 4 2 Forward Current - 0.8A 1 High Surge Current Capability MBF Package Designed for Surface Mount Application PINNING MECHANICAL DATA • Case: MBF • Terminals: Solderable per MIL-STD-750, Method 2026 • A pprox. Weight: 75mg 0.0024oz PIN DESCRIPTION 1 Input Pin（~） 2 Input Pin（~） 3 Output Anode（+） 4 Output Cathode（-） Maximum Ratin g s and Electrical characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase half-wave 60 Hz, resistive or inductive load, f or capacitive load current derate by 20 %. Symbols M B1F MB2F MB4F MB6F MB8F MB10F Units Maximum Repetitive Peak Reverse Voltage V RRM 100 200 400 600 800 1000 V Maximum RMS voltage V RMS 70 140 280 420 560 700 V Maximum DC Blocking Voltage V DC 100 200 400 600 800 1000 V Parameter Average Rectified Output Current at Ta = 40 °C 0.8 A I FSM 25 A VF 1.0 1.1 V IR 5.0 100 500 μA Cj 13 pF RθJA RθJL 60 16 °C/W T j , T stg -55 ~ +150 °C IO Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Maximum Forward Voltage at 1 A @ I F =0.4A Maximum DC Reverse Current at Rated DC Blocking Voltage @ T A =100℃ @ I F =0.8A @ T A =25 °C @ T A =125 °C Typical Junction Capacitance（Note1） Typical Thermal Resistance（Note2） Operating and Storage Temperature Range Note: 1. Measured at 1MHz and applied reverse voltage of 4 V D.C. 2. Mounted on glass epoxy PC board with 1.3mm 2 copper pad. REV.08 1 of 3 MB1F THRU MB10F Fig.2 Typical Reverse Characteristics Instaneous Reverse Current（μ A） Average Rectified Output Current (A) Fig.1 Average Rectified Output Current Derating Curve 1.0 0.8 Al. Substrate PC Board 0.6 0.4 Glass Epoxy PC Board 0.2 Resistive or Inductive Load 0.0 25 50 75 100 125 150 175 100 T J =125°C 10 1.0 T J =25°C 0.1 00 10 T J =25°C 1.0 0.1 pulse with 300μs 1% duty cycle 1.0 1.5 2.0 Peak Forward Surage Current (A) 100 120 140 10 T J =25°C 40 8.3 ms Single Half Sine Wave (JEDEC Method) 20 10 00 10 1.0 10 Reverse Voltage (V) 100 Number of Cycles REV.08 80 100 0.1 Fig.5 Maximum Non-Repetitive Peak Forward Surage Current 1 60 1 0.5 Instaneous Forward Voltage (V) 30 40 Fig.4 Typical Junction Capacitance Junction Capacitance ( pF) Instaneous Forward Current (A) Fig.3 Typical Instaneous Forward Characteristics 0.01 0.0 20 percent of Rated Peak Reverse Voltage (%) Ambient Temperature (°C) 2 of 3 100 MB1F THRU MB10F PACKAGE OUTLINE Plastic surface mounted package; 4 leads MBF ∠ALL ROUND C A a L1 L d HE e D e E MBF mechanical data A C D E HE d e L L1 a max 1.6 0.22 5.0 4.1 7.0 2.7 0.7 1.7 1.1 0.2 min 1.2 0.15 4.5 3.6 6.4 2.3 0.5 1.3 0.5 max 63 8.7 197 161 276 106 28 67 43 min 47 5.9 177 142 252 91 20 51 20 UNIT ∠ mm 7° 8 mil Marking The recommended mounting pad size Type number 3.4 130 1.7 67 0.8 31 2.4 94 Marking code MB1F MB1F MB2F MB2F MB4F MB4F MB6F MB6F MB8F MB8F MB10F MB10F Unit： mm (mil) MBxx F REV.08 3 of 3