Technical Data 4337
Effective April 2016
Supersedes December 2008
FP1005R
High frequency, high current power inductors
Applications
•
Multi-phase and Vcore regulators
•
Voltage Regulator Modules (VRMs)
• Server and desktop
•
Central processing unit (CPU)
•
Graphics processing unit (GPU)
•
Application specific integrated circuit (ASIC)
•
High power density
•
Data networking and storage systems
•
Graphics cards and battery power systems
•
Portable electronics
•
Point-of-Load modules
Description
•
High current carrying capacity
•
Low core loss
•
Magnetically shielded
•
Frequency range up to 2 MHz
•
Inductance range 85 nH to 220 nH
•
Current range 33 A to 90 A
•
10.2 mm x 7.0 mm footprint surface mount
package in a 4.95 mm height
•
Ferrite core material
•
Halogen free, lead free, RoHS compliant
Environmental Data
•
Storage temperature range (Component):
-40 °C to +125 °C
•
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•
Solder reflow temperature: J-STD-020D
compliant
HALOGEN
Pb HF
FREE
FP1005R
High frequency, high current power inductors
Technical Data 4337
Effective April 2016
Product Specifications
OCL1
(nH) ±10%
FLL2
(nH) minimum
Irms3
(A)
Isat14
(A)
Isat25
(A)
DCR (mΩ)
@ 20°C
K-factor6
FP1005R1-R08-R
85
61
53
90
64
0.39 ±7.7%
536
FP1005R1-R10-R
100
72
53
73
57
0.39 ±7.7%
536
FP1005R1-R12-R
120
86
53
60
48
0.39 ±7.7%
536
FP1005R1-R15-R
150
108
53
47
37
0.39 ±7.7%
536
FP1005R1-R22-R
220
158
53
33
26
0.39 ±7.7%
536
FP1005R2-R08-R
85
61
50
90
64
0.47 ±6.7%
536
FP1005R2-R10-R
100
72
50
73
57
0.47 ±6.7%
536
FP1005R2-R12-R
120
86
50
60
48
0.47 ±6.7%
536
FP1005R2-R15-R
150
108
50
47
37
0.47 ±6.7%
536
FP1005R2-R22-R
220
158
50
33
26
0.47 ±6.7%
536
FP1005R3-R08-R
85
61
45
90
64
0.55 ±5.4%
536
FP1005R3-R10-R
100
72
45
73
57
0.55 ±5.4%
536
FP1005R3-R12-R
120
86
45
60
48
0.55 ±5.4%
536
FP1005R3-R15-R
150
108
45
47
37
0.55 ±5.4%
536
FP1005R3-R22-R
220
158
45
33
26
0.55 ±5.4%
536
120
86
45
60
48
0.70 ±10%
536
Part Number7
R1 Version
R2 Version
R3 Version
R4 Version
FP1005R4-R12-R
1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C
2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C
3. Irms : DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents.
PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the
temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating
conditions verified in the end application.
4. Isat1 : Peak current for approximately 20% rolloff @ +25 °C
5. Isat2 : Peak current for approximately 20% rolloff @ +125 °C
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *ΔI * 10-3. Bp-p:(Gauss), K: (K-factor from
table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps).
7. Part Number Definition: FP1005Rx-Rxx-R
FP1005R= Product code and size
x= Version indicator
-Rxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: FPT1005Rx = (x=version indicator), Rxx=inductance value in uH, (R=decimal point)
wwllyy=date code, R=revision level.
Tolerances are ±0.25 millimeters unless stated otherwise.
All soldering surfaces must be coplanar within 0.1016 millimeters.
PCB tolerances are ±0.1 millimeters unless stated otherwise.
DCR is measured from point “a” to point “b.”
Do not route traces or vias underneath the inductor.
2
www.eaton.com/elx
FP1005R
High frequency, high current power inductors
Technical Data 4337
Effective April 2016
Packaging information (mm)
Supplied in tape and reel packaging , 950 parts per 13” diameter reel
Temperature rise vs. total loss
Temperature Rise (
)
60
50
40
30
20
10
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Total Loss (W)
www.eaton.com/elx
3
FP1005R
High frequency, high current power inductors
Technical Data 4337
Effective April 2016
Core loss vs. Bp-p
1 MHz
10
500 kHz
300 kHz
200 kHz
1
100 kHz
Core Loss (W)
0.1
0.01
0.001
0.0001
0.00001
100
1000
1000 0
Bp-p (Gauss)
Inductance characteristics
% of OCL vs. % of I sat1
100%
-40 °C
% of OCL
80%
+25 °C
60%
40%
20%
0%
+125 °C
0%
20%
40%
60%
% of Isat1
4
www.eaton.com/elx
80%
100%
120%
FP1005R
High frequency, high current power inductors
Technical Data 4337
Effective April 2016
Solder reflow profile
TP
TC -5°C
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
TL
Preheat
A
T smax
t
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
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