Technical Data 4318
Effective October 2017
Supersedes March 2007
SD38
Low profile metalized shielded drum core power inductors
Applications
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•
•
•
•
•
•
•
SMD Device
Environmental data
•
Product features
•
•
•
•
•
3.8 mm x 3.8 mm shielded drum cores
available 1.2 mm and 1.4 mm heights
Current range from 0.1 A to 4.4 A
Inductance range from 0.47 uH to 680 uH
Ferrite shielded, low EMI
Ferrite core material
Mobile phones
Digital cameras
Media players
Small LCD displays
LED driver and LED flash circuits
Hard disk drives
LCD Backlighting
•
•
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
SD38
Low profile metalized shielded drum core power inductors
Technical Data 4318
Effective October 2017
Product specifications
Part Number
SD3812-R47-R
SD3812-1R0-R
SD3812-1R2-R
SD3812-1R5-R
SD3812-2R2-R
SD3812-3R3-R
SD3812-4R7-R
SD3812-6R8-R
SD3812-8R2-R
SD3812-100-R
SD3812-150-R
SD3812-220-R
SD3812-330-R
SD3812-470-R
SD3812-680-R
SD3812-820-R
SD3812-101-R
SD3812-151-R
SD3812-221-R
SD3814-R47-R
SD3814-R82-R
SD3814-1R2-R
SD3814-1R5-R
SD3814-2R2-R
SD3814-3R3-R
SD3814-4R7-R
SD3814-6R8-R
SD3814-8R2-R
SD3814-100-R
SD3814-150-R
SD3814-220-R
SD3814-330-R
SD3814-470-R
SD3814-680-R
SD3814-820-R
SD3814-101-R
SD3814-151-R
SD3814-221-R
SD3814-331-R
SD3814-471-R
SD3814-681-R
Rated
Inductance
(µH)
0.47
1.0
1.2
1.5
2.2
3.3
4.7
6.8
8.2
10.0
15.0
22.0
33.0
47.0
68.0
82.0
100.0
150.0
220.0
0.47
0.82
1.2
1.5
2.2
3.3
4.7
6.8
8.2
10.0
15.0
22.0
33.0
47.0
68.0
82.0
100.0
150.0
220.0
330.0
470.0
680.0
OCL (1)
+/-15%
(µH)
0.405
0.845
1.125
1.445
2.205
3.125
4.805
6.845
8.405
10.125
15.125
21.125
32.805
47.045
68.445
80.645
99.405
149.645
218.405
0.360
0.752
1.001
1.286
1.962
2.781
4.276
6.768
8.228
9.830
14.458
21.186
32.151
47.210
67.324
81.101
98.794
149.026
217.342
326.812
470.031
680.320
Part
Marking
Designator
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
A
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
Irms (2)
(A)
Isat (3)
(A)
2.53
2.00
1.71
1.58
1.32
1.10
0.87
0.80
0.690
0.662
0.539
0.499
0.399
0.327
0.269
0.259
0.217
0.178
0.160
2.81
2.18
1.85
1.76
1.43
1.31
1.06
0.87
0.753
0.713
0.574
0.519
0.418
0.346
0.285
0.270
0.228
0.191
0.170
0.136
0.111
0.100
3.89
2.69
2.33
2.06
1.67
1.40
1.13
0.95
0.854
0.778
0.636
0.538
0.432
0.361
0.299
0.276
0.248
0.202
0.167
4.44
3.08
2.67
2.35
1.90
1.60
1.29
1.03
0.930
0.851
0.702
0.580
0.471
0.388
0.325
0.296
0.268
0.219
0.181
0.148
0.123
0.102
DCR (4)
(Ω)
Typ.
0.030
0.048
0.066
0.078
0.111
0.159
0.256
0.299
0.406
0.441
0.665
0.776
1.212
1.809
2.666
2.885
4.099
6.130
7.585
0.020
0.033
0.046
0.051
0.077
0.093
0.141
0.207
0.279
0.311
0.481
0.589
0.908
1.322
1.951
2.174
3.048
4.359
5.480
8.59
12.85
15.78
Volt (5)
u-sec
Typ.
2.52
3.64
4.20
4.76
5.88
7.0
8.7
10.4
11.5
12.6
15.4
18.2
22.7
27.2
32.8
36
39
48
59
2.16
3.12
3.60
4.08
5.04
6.0
7.4
9.4
10.3
11.3
13.7
16.6
20.4
24.7
29.5
32
36
44
53
65
78
94
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(1) Test Parameters: 100 kHz, 0.100 Vrms, 0.0 Adc.
(2) RMS current for an approximate ∆T of 40 °C without core loss. It is
recommended that the temperature of the part not exceed +125 °C.
De-rating is necessary for AC currents.
(3) Peak current for approximately 30% rolloff at +20 °C.
2
www.eaton.com/electronics
(4) DCR limits @ +20 °C.
(5) Applied Volt-Time product (V-us) across the inductor at 100 kHz necessary to
generate a core loss equal to 10% of the total losses for 40 °C temperature
rise. De-rating of the Irms is required to prevent excessive temperature rise.
SD38
Low profile metalized shielded drum core power inductors
Technical Data 4318
Effective October 2017
Dimensions- mm
SD3812
BOTTOM VIEW
TOP VIEW
SIDE VIEW
4.8
MA X
3.65
typ
Pin #1 indicator
Marking
(see note A)
1.2
max
0.09 max
no plating
1.25
±0.12
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2.03
±.02
4.0
max
4.0
max
0.415 min
RECOMMENDED PCB LAYOUT
SCHEMATIC
1.0
2 plcs
2.5
2plcs
4.0 typ
5.0
Note A: 3 digit marking. First digit indicates inductance value per chart above.
Second digit indicates bi-weekly date code.
Third digit of year produced. Box indicates SD3814 part.
Do not route traces or vias underneath the inductor
SD3814
TOP VIEW
SIDE VIEW
Pin #1 indicator
Marking
(see note A)
BOTTOM VIEW
4.8
MA X
3.65
typ
0.09 max
no plating
1.4
max
1.25
±0.12
2.03
±.02
4.0
max
4.0
max
0.415 min
RECOMMENDED PCB LAYOUT
1.0
2 plcs
SCHEMATIC
2.5
2 plcs
4.0 typ
5.0
Note A: 3 digit marking. First digit indicates inductance value per chart above.
Second digit indicates bi-weekly date code.
Third digit of year produced. Box indicates SD3814 part.
Do not route traces or vias underneath the inductor
www.eaton.com/electronics
3
SD38
Low profile metalized shielded drum core power inductors
Technical Data 4318
Effective October 2017
Packaging information- mm
4.00
2.00 ± 0.05
1.5 Dia
min.
1.5 Dia.
+0.1/-0.0
1.75
Ao=5.1mm
Bo=4.6mm
Ko=1.6mm
12.0
+/-0.3
Bo
5.50
4.5
4.5
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Ao
Ko
Parts packaged on 13" Diameter reel,
4,150 parts per reel.
8.0
SECTION A-A
Direction of feed
Core loss
% of Losses from Irms (maximum)
Irms DERATING WITH CORE LOSS
% of Applied Volt-µsecond
Inductance characteristics
OCL vs Isat
SD3814
OCL vs Isat
SD3812
100
90
OCL (%)
80
OCL (%)
70
60
50
40
30
20
10
0
20
10
0
0
0
10
20
30
40
50
60
70
% of Isat
4
100
90
80
70
60
50
40
30
www.eaton.com/electronics
80
90
100
110
120
130
10 20 30 40 50 60 70 80 90 10 11 12 13 14 15 16
0 0 0 0 0 0 0
% of Isat
SD38
Low profile metalized shielded drum core power inductors
Technical Data 4318
Effective October 2017
Solder Reflow Profile
TP
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
TC -5°C
Table 1 - Standard SnPb Solder (Tc)
Volume
mm3
220°C
220°C
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Temperature
TL
25°C
Preheat
A
T smax
t
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
ts
Package
Thickness
2.5mm
Time 25°C to Peak
Volume
mm3
2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 4318
October 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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