BRBZT52C22S

BRBZT52CXXXS Rev.C Oct.-2019 描述 / DATA SHEET Descriptions SOD-323 塑封封装 稳压二极管。 Zener Diode in a SOD-323 Plastic Package. 特征 / Features 200mW 功耗，中等电流，自动贴片组装。无卤产品. 200mW Power dissipation, medium current, automated assembly processes. HF Product. 用途 / Applications 适用于 2.4V-39V 的宽范围稳压电路。 2.4V to 39V wide zener voltage range applications. 内部等效电路 引脚排列 / Equivalent Circuit / Pinning 1 2 PIN1:Cathode 型号及印章代码 PIN2:Anode / Type Number & Marking Code 见电性能参数。See Electrical Characteristics. http://www.fsbrec.com 1/7 BRBZT52CXXXS Rev.C Oct.-2019 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Forward Voltage (Note 2) ( IF=10mA) VF 0.9 V Power Dissipation(Note 1) PD 200 mW RθJA 625 ℃/W Tj,Tstg -65～150 ℃ Typical Thermal Resistance Junction to Ambient(Note 1) Junction and Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) Type Number Mark -ing Code Zener Voltage Range (Note 2) Vz @IZT IZT Nom (V) Min (V) Max (V) mA Maximum Zener mpedance (Note 3) Maximum Reverse Current (Note 2) ZZT @IZT IZK IR @VR mA uA V Min Max mA ZZK @IZK Ω Typical Temperature Coefficient @IZTC mV/ºC Test Curre nt IZTC BRBZT52C2V4S HWX 2.4 2.2 2.6 5 100 600 1 50 1 -3.5 0 5 BRBZT52C2V7S HW1 2.7 2.5 2.9 5 100 600 1 20 1 -3.5 0 5 BRBZT52C3V0S HW2 3.0 2.8 3.2 5 95 600 1 10 1 -3.5 0 5 BRBZT52C3V3S HW3 3.3 3.1 3.5 5 95 600 1 5 1 -3.5 0 5 BRBZT52C3V6S HW4 3.6 3.4 3.8 5 90 600 1 5 1 -3.5 0 5 BRBZT52C3V9S HW5 3.9 3.7 4.1 5 90 600 1 3 1 -3.5 0 5 BRBZT52C4V3S HW6 4.3 4 4.6 5 90 600 1 3 1 -3.5 0 5 BRBZT52C4V7S HW7 4.7 4.4 5 5 80 500 1 3 2 -3.5 0.2 5 BRBZT52C5V1S HW8 5.1 4.8 5.4 5 60 480 1 2 2 -2.7 1.2 5 BRBZT52C5V6S HW9 5.6 5.2 6 5 40 400 1 1 2 -2 2.5 5 BRBZT52C6V2S HWA 6.2 5.8 6.6 5 10 150 1 3 4 0.4 3.7 5 BRBZT52C6V8S HWB 6.8 6.4 7.2 5 15 80 1 2 4 1.2 4.5 5 BRBZT52C7V5S HWC 7.5 7 7.9 5 15 80 1 1 5 2.5 5.3 5 BRBZT52C8V2S HWD 8.2 7.7 8.7 5 15 80 1 0.7 5 3.2 6.2 5 BRBZT52C9V1S HWE 9.1 8.5 9.6 5 15 100 1 0.5 6 3.8 7 5 BRBZT52C10S HWF 10 9.4 10.6 5 20 150 1 0.2 7 4.5 8 5 http://www.fsbrec.com 2/7 BRBZT52CXXXS Rev.C Oct.-2019 电性能参数 DATA SHEET / Electrical Characteristics(Ta=25℃) Zener Voltage Range (Note 2) Type Number Marking Code Vz @IZT IZT Nom (V) Min (V) Max (V) mA Maximum Zener mpedance (Note 3) Maximum Reverse Current (Note 2) ZZT @IZT IZK IR @VR mA uA V Min Max mA ZZK @IZK Ω Typical Temperature Coefficient @IZTC mV/ºC Test Curre nt IZTC BRBZT52C11S HWG 11 10.4 11.6 5 20 150 1 0.1 8 5.4 9 5 BRBZT52C12S HWH 12 11.4 12.7 5 25 150 1 0.1 8 6 10 5 BRBZT52C13S HWI 13 12.4 14.1 5 30 170 1 0.1 8 7 11 5 BRBZT52C15S HWJ 15 13.8 15.6 5 30 200 1 0.1 10.5 9.2 13 5 BRBZT52C16S HWK 16 15.3 17.1 5 40 200 1 0.1 11.2 10.4 14 5 BRBZT52C18S HWL 18 16.8 19.1 5 45 225 1 0.1 12.6 12.4 16 5 BRBZT52C20S HWM 20 18.8 21.2 5 55 225 1 0.1 14 14.4 18 5 BRBZT52C22S HWN 22 20.8 23.3 5 55 250 1 0.1 15.4 16.4 20 5 BRBZT52C24S HWO 24 22.8 25.6 5 70 250 1 0.1 16.8 18.4 22 5 BRBZT52C27S HWP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3 2 BRBZT52C30S HWQ 30 28 32 2 80 300 0.5 0.1 21 24.4 29.4 2 BRBZT52C33S HWR 33 31 35 2 80 325 0.5 0.1 23.1 27.4 33.4 2 BRBZT52C36S HWS 36 34 38 2 90 350 0.5 0.1 25.2 30.4 37.4 2 BRBZT52C39S HWT 39 37 41 2 130 350 0.5 0.1 27.3 33.4 41.2 2 Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2. 2. Short duration test pulse used to minimize self-heating effect. 3. f = 1kHz. http://www.fsbrec.com 3/7 BRBZT52CXXXS Rev.C Oct.-2019 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 4/7 BRBZT52CXXXS Rev.C Oct.-2019 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 5/7 BRBZT52CXXXS Rev.C Oct.-2019 印章说明 / DATA SHEET Marking Instructions HWX 说明： H： 为公司代码 WX： 为产品型号代码 Note: H: Company Code. WX: Product Type Code. http://www.fsbrec.com 6/7 BRBZT52CXXXS Rev.C Oct.-2019 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SOD-323 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3,000 10 30,000 6 180,000 7〞×8 180×120×180 390×385×205 / Notices http://www.fsbrec.com 7/7