WS3241C-12/TR

WS3241C WS3241C Over-Voltage Protection Load Switch http://www.sh-willsemi.com Descriptions The WS3241C features a low RON internal high voltage switch and an input range of absolute maximum 29V. The WS3241C behaves Over-Voltage Protection (OVP) that shuts off the internal Switch if OVLO pin voltage exceeds the 1.2V reference voltage. External resistors CSP-12L (Bottom View) divider could be used to set the input voltage OVP threshold. The off-state Switch would disconnect the input pin to output pin and protect output from the input high voltage stress. Also, an internal fixed 6.8V-OVP could set by connecting OVLO pin to ground without the external resistors. Integrated Over-Temperature Protection (OTP) also shuts off the Switch to protect the device. The WS3241C is available in CSP-12L package. Standard product is Pb-free and Halogen-free. Pin Configuration (Top View) Features  Surge Protection : 100V  Absolute Maximum Input Voltage : 29V  Low RON Switch (@VIN=5V) : 30mΩ  Adjustable OVP Threshold  Fast OVP Response  Thermal Shutdown Protection  Robust ESD Protection : 70ns Marking 3241 = Device Name VC = Device Code Applications Y = Year Code W = Week Code  Mobile Handsets and Tablets  Portable Media Players  Peripherals Will Semiconductor Ltd. Order Information Device Package Shipping WS3241C-12/TR CSP-12L 3000/Reel&Tape 1 2020/05 - Rev. 1.2 WS3241C Typical Applications Fig1. Typical application Fig2. Typical application with #EN=0 Fig3. Typical application with internal default OVP threshold 6.8V Note1: R1 and R2 are only required for external OVP, otherwise connect OVLO to GND. Note2: VOVP = VOVLOTH X (R1+R2) / R2. Recommended selection: 10K ≤ R2 ≤ 50K. Will Semiconductor Ltd. 2 2020/05 - Rev. 1.2 WS3241C Pin Descriptions Pin Symbol Type Descriptions B3, C2, C3 IN Supply Switch Input Pin and Device Power Supply. A2, A3, B2 OUT Output Switch Output Pin to Load. A4, B4, C4 GND Ground Device Ground Pin. C1 OVLO Input Over-Voltage Lockout Adjustment Pin. A1 #EN Input Active Low. Connect to GND to enable the device. Power B1 #ACOK Output Good Index. Open drain connected to a resistor. If not used, connect to GND or floating. 1 0 UVLO or OVP Supply stable Block Diagram Will Semiconductor Ltd. 3 2020/05 - Rev. 1.2 WS3241C Absolute maximum ratings Parameter Symbol Value Unit VIN -0.3~29 V V_OUT voltage range VOUT VIN+0.3 V V_OVLO voltage range VOVLO -0.3~16 V V_#ACOK voltage range V#ACOK -0.3~6 V V#EN -0.3~6 V Switch I/O Continuous Current IIN 4.5 Junction temperature TJ 150 o TL 260 oC Tstg -55~150 Surge 100 V_IN voltage range V_#EN voltage range Lead temperature(Soldering, 10s) Storage temperature Surge Protection A C C o V These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Recommend Operating Conditions Parameter VIN supply input voltage range Operating ambient temperature Thermal Resistance * 1 Symbol Value Unit Vcc 2.9~25 V TA -40~85 oC RθJA 85 C/W o *1 Surface mounted on FR-4 Board using 2 oz, 1*1 square inch Cu area. PCB board size 1.5*1.5 square inches. Will Semiconductor Ltd. 4 2020/05 - Rev. 1.2 WS3241C Electrical Characteristics (TA = 25oC, VIN = 5V, CIN = 1μF, COUT = 1μF, for 5V application, unless otherwise noted) Parameter Symbol Conditions Min. Typ. Max. Units VIN_CLAMP IIN=10mA 33.8 36.5 40.2 V VIN = 5V, #EN=0V, No Load 100 210 VIN = 5V, #EN=1.8V, No Load 25 VIN=5V, #EN=0V, VOVLO=2V 80 μA VIN=5V, #EN=5V, VOVLO=2V 25 μA VIN Rising 2.2 VIN Falling 0.14 V 20 ms 40 ms 2 ms Basic Operation Input Clamp Voltage Quiescent Supply Current OVLO Supply Current (No Load) UVLO Threshold Voltage UVLO Hysteresis Voltage IQ IOV VUVLO VUVLO_HYS *3 Time from VIN rise above VUVLO 2.8 μA V Debounce Time TDEB Soft-Start Time TSS Switch Turn-On Time TON Main Switch ON-Resistance RON VIN = 5V, IOUT = 1A 30 39 mΩ #ACOK Output Low Voltage VOL ISINK=1mA 0.1 0.4 V 0.1 μA #ACOK Leakage Current I#ACOK_LEAK to VOUT = 0.1 x VIN Time from VIN rise above VUVLO to #ACOK goes Low RL=100Ω, CL=22μF, VOUT from 0.1xVIN to 0.9xVIN V#ACOK = 3V -0.1 1.4 Enable High Voltage VIH_#EN VIN = 5V Enable Low Voltage VIL_#EN VIN = 5V #EN Input Leakage Current I#EN V 0.4 VIN = 5V, V#EN=5V VIN = 5V, V#EN=0V 2 -1 1 V μA Over-Voltage Protection OVLO Set Threshold OVLO Set Hysteresis Adjustable IN OVP threshold range External OVLO Select Threshold OVLO Select Hysteresis Will Semiconductor Ltd. VOVLO_TH VOVLO_Hys *2*3 OVLO Voltage Rising OVLO Voltage Hysteresis 1.2 OVLO Voltage Rising VOVLO_Ehys*3 5 1.23 40 4 VOVLO_range VOVLO_E 1.17 V mV 25 V 0.25 V 20 mV 2020/05 - Rev. 1.2 WS3241C Electrical Characteristics (TA = 25oC, VIN = 5V, CIN = 1μF, COUT = 1μF, for 5V application, unless otherwise noted) Internal OVP Threshold VOVLO_I OVLO Response Time tOVLO *3 VIN Rising 6.5 VIN Hysteresis*3 70 Vovp=6.8V IOVLO VOVLO= 2V Output discharge resistance RDCHG VOVLO = 2V, VOUT = 5V 7.1 0.3 VIN rising at 1V/0.1μs, OVLO Input Current 6.8 -0.1 V ns 0.1 μA 150 Ω Thermal Protection Thermal Shutdown TSD 150 o C OTP Hysteresis THYS 25 o C *2 If connect a resistor-divider to set different OVLO threshold, then VOVLO_HYS = 40 x (1+R1/R2) mV. *3 Guaranteed by design Fig. OVP Response Time Test Will Semiconductor Ltd. 6 2020/05 - Rev. 1.2 WS3241C Typical Characteristics (TA = 25oC, CIN = 1μF/50V, COUT = 1μF/50V, unless otherwise noted) RON vs. Output Current RON vs. Supply Voltage RON vs. Temperature OVLO Threshold Voltage vs. Temperature Internal OVP Threshold Voltage vs. Temperature Will Semiconductor Ltd. External OVP Threshold Voltage vs. Temperature 7 2020/05 - Rev. 1.2 WS3241C UVLO Threshold Voltage vs. Temperature Quiescent Supply Current vs. Temperature EN Threshold Voltage vs. Temperature ACOK Output Low Voltage vs. Temperature ACOK Leakage Current vs. Temperature External OVLO Select Voltage vs. Temperature Will Semiconductor Ltd. 8 2020/05 - Rev. 1.2 WS3241C PACKAGE OUTLINE DIMENSIONS CSP-12L e D e E b TOP VIEW BOTTOM VIEW 21 0. A3 A A2 1.2 0.4 A1 0.4 SIDE VIEW 0.8 RECOMMENDED LAND PATTERN(unit:mm) Symbol Dimensions in Millimeters Min. Typ. Max. A 0.54 0.59 0.63 A1 0.17 0.19 0.21 A2 0.37 0.40 0.42 A3 0.025 Ref. E 1.14 1.17 1.20 D 1.54 1.57 1.60 b 0.21 0.23 0.25 e Will Semiconductor Ltd. 0.40BSC 9 2020/05 - Rev. 1.2 WS3241C TAPE AND REEL INFORMATION Reel Dimensions RD Reel Dimensions Tape Dimensions W P1 Quadrant Assignments For PIN1 Orientation In Tape Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed RD Reel Dimension 7inch 13inch W Overall width of the carrier tape 8mm 12mm P1 Pitch between successive cavity centers 2mm 4mm 8mm Pin1 Pin1 Quadrant Q1 Q2 Q3 Will Semiconductor Ltd. 10 Q4 2020/05 - Rev. 1.2