NJU77230/NJU77231/NJU77232
Rail-to-Rail Input,Push-Pull Output
Low power CMOS Comparators
+
-
■FEATURES(V =3V, V =0V, Ta=25°C)
●Rail-to-Rail Input
●Push Pull Output
●Supply Current
●Propagation Delay
●Operating Voltage
●Input Offset Voltage
●Operating Temperature
●Integrated EMI filter
●Package
NJU77230
NJU77231
■GENERAL DESCRIPTION
The NJU77230/NJU77231/NJU77232 are Rail-to-Rail
Input CMOS comparators featuring Low-power and
Push-Pull output.
These comparators operate from 1.8V to 5.5V and low
supply current of 6µA/ch.typ. This feature is suitable for
battery powered application.
The NJU77231/NJU77232 are available in small size
Package, DFN6-G1(1616), DFN8-U1(2020), significantly
reducing the required portable application's board area.
6µA/ch typ.
780ns typ.
1.8 to 5.5V
6mV max.
-40 to 125℃
SOT-23-5, SC88A
SOT-23-5, SC88A,
DFN6-G1(ESON6-G1)
NJU77232
MSOP8(TVSP8)*
*meet JEDEC MO-187-DA / thin type,
DFN8-U1(ESON8-U1)
■APPLICATION
■RELATED PRODUCTS
Features
Rail-to-Rail Input
Open-Drain Output
Low power
CMOS Comparators
●Portable and Battery-Powered Applications
●Alarm and Surveillance Circuits
●Industrial Instruments
●Sensor Applications
■PIN CONFIGURATION
Parts
NJU77230F
Number
Package
SOT-23-5
Outline
Pin
Function
NJU77242
NJU77231F
NJU77231F3
SC-88A
SOT-23-5
SC-88A
-INPUT 1
V+
V- 2
5 V+
V- 2
4 OUTPUT
+INPUT 3
4 OUTPUT
NJU77231KG1
NJU77232RB1
NJU77232KU1
DFN6-G1(ESON6-G1)(*)
MSOP8(TVSP8)
DFN8-U1(ESON8-U1) (*)
(Top View)
Pin
Function
NJU77240
NJU77241
(Top View)
5
-INPUT 3
Parts
Number
Package
Outline
Dual
NJU77230F3
(Top View)
+INPUT 1
Single
V+
1
NC
2
OUTPUT 3
Exposed
Pad on
Underside
(Top View)
(Top View)
6
V-
5
-INPUT
4
+INPUT
A OUTPUT
1
8
V+
A OUTPUT
1
A -INPUT
2
7
B OUTPUT
A -INPUT
2
A +INPUT
3
6
B -INPUT
A +INPUT
3
V-
4
5
B +INPUT
V-
4
Exposed
Pad on
Underside
8
V+
7
B OUTPUT
6
B -INPUT
5
B +INPUT
-
(*)Connect to exposed pad to V
Ver.3
http://www.njr.com/
-1-
NJU77230/NJU77231/NJU77232
■BLOCK DIAGRAM
V+
-INPUT
OUTPUT
+INPUT
V-
■PRODUCT NAME INFORMATION
NJU77230 F (TE1)
Part Number
■ORDERING INFORMATION
PART
PACKAGE
OUTLINE
NUMBER
NJU77230F
SOT-23-5
NJU77230F3
SC-88A
NJU77231F
SOT-23-5
NJU77231F3
SC-88A
NJU77231KG1 DFN6-G1
NJU77232RB1 MSOP8(TVSP8)
NJU77232KU1 DFN8-U1
RoHS
yes
yes
yes
yes
yes
yes
yes
Package Taping Form
HALOGENFREE
yes
yes
yes
yes
yes
yes
yes
TERMINAL
FINISH
Sn2Bi
Sn2Bi
Sn2Bi
Sn2Bi
Sn2Bi
Sn2Bi
Sn2Bi
MARKING
1H
F1
1J
F2
77231
77232
77232
WEIGHT
(mg)
15
7.5
15
7.5
3.5
18
5.3
MOQ
(pcs)
3,000
3,000
3,000
3,000
3,000
2,000
3,000
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
Supply Voltage
(1,2)
Input Voltage
(2)
Input Current
(3)
Differential Input Voltage
(1)
Output Terminal Input Voltage
Power Dissipation(Ta=25℃)
(4)
SOT-23-5
(4)
SC-88A
(5)
DFN6-G1
(4)
MSOP8(TVSP8)
(5)
DFN8-U1
Junction Temperature
Storage Temperature Range
SYMBOL
+
V -V
VIN
IIN
VID
Vo
PD
Tjmax
Tstg
RATINGS
7
+
V - 0.3 to V + 0.3
10
±7
+
V - 0.3 to V + 0.3
(2-layer / 4-layer)
480 / 650
360 / 490
330 / 1200
510 / 680
450 / 1200
+150
- 55 to +150
UNIT
V
V
mA
V
V
mW
°C
°C
(1) Voltage values are limited at 7V.
(2) Input voltages outside the supply voltage will be clamped by ESD protection diodes. If the input voltage exceeds the supply
voltage, the input current must be limited 10mA or less by using a restriction resistance.
(3) Differential voltage is the voltage difference between +INPUT and - INPUT.
For supply voltage less than +7V, the absolute maximum rating is equal to the supply voltage.
(4) Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2Layers FR4)
Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers FR4), internal Cu area: 74.2 x 74.2mm
(5) Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 2Layers FR-4, with Exposed Pad)
Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 4Layers FR-4, with Exposed Pad)
*For 4Layers: Applying 99.5×99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5
Ver.3
http://www.njr.com/
-2-
NJU77230/NJU77231/NJU77232
■THERMAL CHARACTERISTICS
PARAMETER
SYMBOL
Junction-to-ambient thermal resistance
(6)
SOT-23-5
(6)
SC-88A
(7)
DFN6-G1
(6)
MSOP8(TVSP8)
(7)
DFN8-U1
Junction-to-Top of package characterization parameter
(6)
SOT-23-5
(6)
SC-88A
(7)
DFN6-G1
(6)
MSOP8(TVSP8)
(7)
DFN8-U1
VALUE
(2-layer / 4-layer)
259 / 193
352 / 256
381 / 106
244 / 185
278 / 107
(2-layer/ 4-layer)
67 / 58
91 / 73
64 / 26
51 / 45
42 / 25
θja
ψjt
UNIT
°C /W
°C /W
(6) Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 2Layers FR4)
Mounted on glass epoxy board. (76.2×114.3×1.6mm:based on EIA/JDEC standard, 4Layers FR4), internal Cu area: 74.2 x 74.2mm
(7) Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 2Layers FR-4, with Exposed Pad)
Mounted on glass epoxy board. (101.5×114.5×1.6mm: based on EIA/JEDEC standard, 4Layers FR-4, with Exposed Pad)
*For 4Layers: Applying 99.5×99.5mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5)
■POWER DISSIPATION vs. AMBIENT TEMPERATURE
Power Dissipation vs. Temperature
Power Dissipation vs. Temperature
2-Layer
700
4-Layer
1400
Power Dissipation PD [mW]
Power Dissipation PD [mW]
MSOP8(TVSP8)
600
SOT-23-5
500
DFN8-U1(ESON8-U1)
400
SC-88A
300
200
DFN6-G1(ESON6-G1)
100
1200
DFN6-G1(ESON6-G1)
DFN8-U1(ESON8-U1)
1000
MSOP8(TVSP8)
800
SOT-23-5
600
400
SC-88A
200
0
0
0
25
50
75
100
125
Ambient Temperature Ta [ºC]
0
150
25
50
75
100
125
Ambient Temperature Ta [ºC]
150
■RECOMMENDED OPERATING CONDITIONS
PARAMETER
Supply Voltage
Single Supply
Dual Supply
Operating Ambient Temperature
Ver.3
SYMBOL
+
-
V -V
+
V /V
Topr
RATINGS
UNIT
+1.8 to +5.5
±0.9 to ±2.75
- 40 to +125
V
http://www.njr.com/
°C
-3-
NJU77230/NJU77231/NJU77232
■ELECTRICAL CHARACTERISTICS
●DC CHARACTERISTICS
(Unless otherwise specified, V+=3V, V-=0V, RL=OPEN, Ta=25℃)
PARAMETER
Supply Current
(per comparator)
SYMBOL
TEST CONDITION
VID=100mV,Vcom=0V
VID=100mV,Vcom=3V
VCOM=0V
VCOM=3V
ISUPPLY
MIN.
-
-
-
-
-
-
TYP.
6
9
1
1
1
1
MAX.
10
14
6
7
-
-
UNIT
µA
µA
mV
mV
pA
pA
Input Offset Voltage
VIO
Input Offset Current
Input Bias Current
Common Mode Input Voltage
Range
Open-Loop Voltage Gain
Common Mode Rejection Ratio
IIO
IB
VICM
CMR≥50dB
0
-
3
V
Av
CMR
-
50
100
70
-
-
dB
dB
Supply Voltage Rejection Ratio
SVR
65
85
-
dB
High-level Output Voltage
Low-level Output Voltage
VOH
VOL
RL=5.1kΩ
VICM=0 to 3V
VCOM=0V,
+
V =1.8 to 5.5V
ISOURCE=3mA
ISINK=3mA
2.7
-
2.8
0.2
-
0.3
V
V
●SWITCHING CHARACTERISTICS
+
-
(Unless otherwise specified,V =+3V, V =0V, Ta=25℃, CL=15pF, RL=5.1kΩ)
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX. UNIT
tPLH
Overdrive=100mV
780
ns
-
-
tPHL
Overdrive =100mV
480
ns
-
-
tTLH
Overdrive =100mV
20
ns
-
-
tTHL
Overdrive =100mV
11
ns
-
-
PARAMETER
Propagation Delay Low to High
Propagation Delay High to Low
Output Signal Rising Time
Output Signal Falling Time
■TIMING WAVEFORM
Over Drive
INPUT
Over Drive
V IN
V OH
OUTPUT
V OL
90%
90%
50%
50%
10%
10%
tTHL
tTLH
tPLH
Ver.3
http://www.njr.com/
tPHL
-4-
NJU77230/NJU77231/NJU77232
■TYPICAL CHARACTERISTICS
Supply Current per Comparator
vs. Supply Voltage
V- =0V, VCOM=0V, VID=100mV, RL=OPEN
18
16
14
12
Ta=125ºC
Ta=25ºC
10
8
6
4
2
V- =0V, VCOM=V+, VID=100mV, RL=OPEN
20
Supply Current per Comparator [μA]
20
Supply Current per Comparator [μA]
Supply Current per Comparator
vs. Supply Voltage
Ta=-40ºC
0
18
16
14
Ta=25ºC
12
10
8
6
4
Ta=-40ºC
2
0
0
1
2
3
4
5
Supply Voltage V+[V]
6
7
0
Supply Current per Comparator
vs. Temperature
Supply Current per Comparator [μA]
Supply Current per Comparator [μA]
16
14
V+=1.8V
V+=3V
V+=5.5V
10
8
6
4
2
0
6
7
18
16
V+=1.8V
V+=5.5V
V+=3V
14
12
10
8
6
4
2
0
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
-25
20
V- =0V,
VID=100mV, RL=OPEN
18
16
14
12
Ta=25ºC
Ta=125ºC
10
8
6
4
2
V+=3V, V- =0V, VID=100mV, RL=OPEN
20
Supply Current per Comparator [μA]
V+=3V,
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Supply Current per Comparator
vs. Temperature
Supply Current per Comparator
vs. Common-Mode Input Voltage
Supply Current per Comparator [μA]
2
3
4
5
Supply Voltage V+ [V]
V- =0V, VCOM=V+, VID=100mV, RL=OPEN
20
18
12
1
Supply Current per Comparator
vs. Temperature
V- =0V, VCOM=0V, VID=100mV, RL=OPEN
20
Ta=-40ºC
18
16
14
VCOM=3V
12
10
8
6
4
VCOM=0V
2
VCOM=1.5V
0
0
0
Ver.3
Ta=125ºC
0.5
1
1.5
2
2.5
Common-Mode Input Voltage [V]
3
-50
http://www.njr.com/
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-5-
NJU77230/NJU77231/NJU77232
■TYPICAL CHARACTERISTICS
Input Offset Voltage vs. Temperature
Input Offset Voltage vs. Temperature
V- =0V , VCOM=0V
5
4
3
Input Offset Voltage [mV]
4
Input Offset Voltage [mV]
V- =0V , VCOM=V+,
5
V+=5.5V
2
1
0
-1
V+=1.8V
V+=3V
-2
-3
3
2
V+=1.8V
1
0
-1
-2
-3
-4
-4
-5
-5
-50
-25
-50
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-25
Input offset voltage vs. temperature
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
V+=3V, V-=0V, VCOM=V+
3
1
0
-1
-2
-3
2
1
0
-1
-2
-3
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
V- =0V, VCOM=0V
5
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Input Offset Voltage vs. Supply Voltage
Input Offset Voltage vs. Supply Voltage
V- =0V, VCOM=V+
5
4
4
3
Ta=25ºC
2
Input Offset Voltage [mV]
Input Offset Voltage [mV]
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Input offset voltage vs. temperature
V+=3V, V-=0V, VCOM=0V,
3
Ta=125ºC
1
0
-1
-2
Ta=-40ºC
-3
3
2
Ta=125ºC
1
0
-1
-2
Ta=25ºC
-3
Ta=-40ºC
-4
-4
-5
-5
1
Ver.3
V+=5.5V
V+=3V
2
3
4
5
Supply Voltage V+ [V]
6
1
http://www.njr.com/
2
3
4
Supply Voltage V+ [V]
5
6
-6-
NJU77230/NJU77231/NJU77232
■TYPICAL CHARACTERISTICS
Input Offset Voltage
vs. Common-Mode Input Voltage
5
4
4
3
3
2
Ta=125ºC
Ta=25ºC
1
0
-1
-2
Ta=-40ºC
-3
V+=3V, V- =0V
5
Input Offset Voltage [mV]
Input Offset Voltage [mV]
Input Offset Voltage
vs. Common-Mode Input Voltage
V+=1.8V, V- =0V
-4
2
Ta=125ºC
1
Ta=25ºC
0
-1
-2
Ta=-40ºC
-3
-4
-5
-5
0
0.3
0.6
0.9
1.2
1.5
Common-Mode Input Voltage [V]
1.8
0
0.5
1
1.5
2
2.5
Common-Mode Input Voltage [V]
3
Input Offset Voltage
vs. Common-Mode Input Voltage
5
V+=5.5V, V- =0V
Input Offset Voltage [mV]
4
3
2
Ta=125ºC
1
0
-1
-2
Ta=25ºC
Ta=-40ºC
-3
-4
-5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Common-Mode Input Voltage [V]
Ver.3
http://www.njr.com/
-7-
NJU77230/NJU77231/NJU77232
■TYPICAL CHARACTERISTICS
SVR vs. Temperature
140
V+=3V, V- =0V, RL=5.1kΩ
140
120
Open-Loop Voltage Gain [dB]
Supply Voltage Rejection Ratio [dB]
Open-Loop Voltage Gain vs. Temperature
V+=1.8V to 5.5V, V- =0V, VCOM=0V
100
80
60
40
20
0
120
100
80
60
40
20
0
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
CMR vs. Temperature
100
Input Bias Current [nA]
Common-Mode Rejection Ratio [dB]
VCOM=V+/2, V- =0V
100
80
60
40
20
0
10
V+=5.5V
1
V+=3V
V+=1.8V
0.1
0.01
0.001
-50
Ver.3
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Input Bias Current vs. Temperature
V+=3V, V- =0V, VICM=0V to 3V
120
-25
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
25
http://www.njr.com/
50
75
100
125
Ambient Temperature [ºC]
150
-8-
NJU77230/NJU77231/NJU77232
■TYPICAL CHARACTERISTICS
Output Voltage vs. Temperature
Output Voltage vs. Output Current
V+=1.8V, V- =0V, VID=100mV
1.8
ISOURCE
1.6
1.6
Ta=-40ºC
VOH
1.4
Output Voltage [V]
1.4
Output Voltage [V]
V+=1.8V, V- =0V, VID=100mV, Iout=3mA
1.8
1.2
1
Ta=125ºC Ta=25ºC
0.8
0.6
ISINK
0.4
1.2
1
0.8
0.6
0.4
VOL
0.2
0.2
0
0
0
3
6
9
Output Current [mA]
-50
12
-25
Output Voltage vs. Output Current
Output Voltage vs. Temperature
V+=3V, V- =0V, VID=100mV
3
0
25 50 75 100 125 150
Ambient Temperature [ºC]
V+=3V, V-=0V, VID=100mV, Iout=3mA
3
Ta=-40ºC
VOH
2.5
Output Voltage [V]
Output Voltage [V
2.5
2
1.5
Ta=125ºC Ta=25ºC
1
0.5
2
1.5
1
0.5
VOL
0
0
0
3
6
9 12 15 18 21 24 27 30
Output Current [mA]
-50
-25
Output Voltage vs. Output Current
5
4.5
4.5
4
4
Output Voltage [V]
Output Voltage [V]
5
3.5
3
Ta=125ºC
2.5
Ta=25ºC
V+=5.5V, V- =0V, VID=100mV, Iout=3mA
5.5
Ta=-40ºC
2
1.5
VOH
3.5
3
2.5
2
1.5
1
1
0.5
0.5
VOL
0
0
0
Ver.3
Output Voltage vs. Temperature
V+=5.5V, V- =0V, VID=100mV
5.5
0
25 50 75 100 125 150
Ambient Temperature [ºC]
3
6
9 12 15 18 21 24 27 30
Output Current [mA]
-50
-25
http://www.njr.com/
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-9-
NJU77230/NJU77231/NJU77232
■TYPICAL CHARACTERISTICS
Propagation Delay Low to High
vs. Temperature
V- =0V, overdrive=100mV, RL=5.1kΩ, CL=15pF
V+=5.5V
1.4
1.2
1
V+=3V
0.8
V+=1.8V
0.6
V- =0V, overdrive=100mV, RL=5.1kΩ, CL=15pF
0.7
Propagation Delay High to Low [μs]
1.6
Propagation Delay Low to High [μs]
Propagation Delay High to Low
vs. Temperature
0.4
0.2
0
V+=5.5V
0.6
0.5
0.4
V+=1.8V
0.3
V+=3V
0.2
0.1
0
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
Output Signal Rising Time vs. Temperature
V+=5.5V
50
40
V+=1.8V
30
20
V+=3V
10
V- =0V, overdrive=100mV, RL=5.1kΩ, CL=15pF
25
Output Signal Falling Time [ns]
Output Signal Rising Time [ns]
60
0
20
V+=1.8V
15
V+=5.5V
10
V+=3V
5
0
-50
-25
0
25 50 75 100 125 150
Ambient Temperature [ºC]
-50
-25
V+=3V,V- =0V, RL=5.1kΩ, CL=15pF
5
INPUT:0.2V/div
Overdrive=50mV
Overdrive=20mV
0.6
Overdrive=100mV
0.4
4
0.2
3.5
3
2.5
0
Overdrive=100mV
Overdrive=50mV
5
4.5
4
-0.2
3
-0.4
2.5
0
2
1.5
-1
0
-0.5
0
0.5
1
1.5
500ns/div
2
2.5
3
0.2
3.5
-0.8
OUTPUT:0.5V/div
0.4
Overdrive=100mV
Overdrive=50mV
Overdrive=20mV
-0.6
Overdrive=20mV
0.6
INPUT:0.2V/div
2
0.5
Ver.3
V+=3V,V- =0V, RL=5.1kΩ, CL=15pF
1.5
1
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Response time(Fall)
Response time(Rise)
4.5
0
25 50 75 100 125 150
Ambient Temperature [ºC]
Output Signal Falling Time vs. Temperature
V- =0V, overdrive=100mV, RL=5.1kΩ, CL=15pF
70
-25
-0.2
Overdrive=100mV
Overdrive=50mV
Overdrive=20mV
-0.4
-0.6
-0.8
1
-1.2
0.5
-1.4
0
-1
-1.2
OUTPUT:0.5V/div
-1.4
-0.5
http://www.njr.com/
0
0.5
1
1.5
500ns/div
2
2.5
3
- 10 -
NJU77230/NJU77231/NJU77232
■TYPICAL TEST CIRCUIT
●Supply Current (ISUPPLY)
+
・V =3V,V-=0V,Vcom=0V, VID=100mV
+
・V =3V,V-=0V,Vcom=3V, VID=100mV
V+
A
V ID
V COM
●High-level Output Voltage (VOH)
+
・V =3V,V-=0V,ISOURCE=3mA,VID=100mV
●Low-level Output Voltage (VOL)
+
・V =3V,V-=0V,ISINK=3mA,VID=100mV
V+
V+
ISOURCE
V
V
ISINK
VID
VID
●Propagation Delay (tPLH, tPHL),Output Signal Rising Time (tTLH),Output Signal Falling Time (tTHL)
+
・V =3V,V-=0V,VCOM=0V,RL=5.1kΩ,CL=15pF,Over drive=100mV
Input Wave Form
(Rise Measurement)
V+
Over
Drive
VCOM
100mV
V IN
VCOM
CL
Input Wave Form
(Fall Measurement)
RL
100mV
VCOM
Over
Drive
Ver.3
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NJU77230/NJU77231/NJU77232
■APPLICATION NOTE
・Input Voltage Exceeding the Supply Voltage
Inputs of the NJU77230/ NJU77231/ NJU77232 are protected by ESD diodes (shown in Figure1) that will conduct if the
input voltages exceed the power supplies by more than approximately 300mV. Momentary voltages greater than 300mV
beyond the power supply, inputs can be tolerated if the current is limited to 10mA. Figure2 is easily accomplished with an
input resistor. If the input voltage exceeds the supply voltage, the input current must be limited 10mA or less by using a
restriction resistance (RLIMIT) as shown in figure2.
V+
+INPUT
OUTPUT
-INPUT
V-
Figure1. Simplified Schematic
Current Limit
10mA
V+
Vin
Vout
RLIMIT
VFigure2. Input Current Protection for Voltages
exceeding the Supply Voltage.
・Bypass Capacitor
It is advised to add a bypass capacitor between the supply voltage and ground as close as possible to device.
Ver.3
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- 12 -
NJU77230/NJU77231/NJU77232
・ EMIRR(EMI Rejection Ratio) Definition
EMIRR is a parameter indicating the EMI robustness of an OP-Amp. The definition of EMIRR is given by the following a
formula (1). We can grasp the tolerance of the RF signal by measuring an RF signal and offset voltage shift quantity.
EMIRR=20∙log(
VRF_PEAK
)
|∆VIO |
・・・(1)
VRF_PEAK :RF Signal Amplitude [ VP ]
ΔVIO :Input offset voltage shift quantity [ V ]
Offset voltage shift is small so that a value of EMIRR is big. And it understands that the tolerance for the RF signal is high. In
addition, about the input offset voltage shift with the RF signal,there is the thinking that influence applied to the input terminal is
dominant. Therefore, generally the EMIRR becomes value that applied an RF signal to +INPUT terminal.
EMIRR vs. Frequency
V+=3V, V-=0V, VREF=1.5V, VRF_PEAK=100mVPP,
120
EMIRR [dB]
100
80
60
40
20
0
100M
1G
Frequency [Hz]
10G
Figure3. EMIRR vs. Frequency
*For details, refer to " Application Note for EMI Immunity" in our
HP: http://www.njr.com/
Ver.3
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NJU77230/NJU77231/NJU77232
SOT-23-5
Unit: mm
■PACKAGE DIMENSIONS
2.9 ±0.2
0 ~15 °
1.9 ±0.2
4
0.6
2.8 ±0.2
1.6
+0.2
-0.1
0.2
5
2
1
3
0.1
0.95 ±0.1
+0.1
-0.03
0.4 ±0.1
0.1
0.1max
1.1 ±0.1
0.6max
■EXAMPLE OF SOLDER PADS DIMENSIONS
2.4
1.0
0.7
0.95
Ver.3
0.95
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NJU77230/NJU77231/NJU77232
SC-88A
Unit: mm
0.425 ±0.2
■PACKAGE DIMENSIONS
2.0 ± 0.2
1.3 ± 0.2
5
2
(0.245)
2.1 ±0.2
1.25 ±0.1
0.23
+0.1
-0.03
4
3
0.425 ±0.2
1
0.13
+0.1
-0.05
0 ~ 10 °
+0.05
-0.15
0.95
0.05 ±0.05
0.9 ±0.1
+0.2
0.2 -0.1
0.65 ± 0.07
0.1
■ EXAMPLE OF SOLDER PADS DIMENSIONS
1.9
0.8
0.3
0.65
Ver.3
0.65
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NJU77230/NJU77231/NJU77232
DFN6-G1(ESON6-G1)
Unit: mm
■EXAMPLE OF SOLDER PADS DIMENSIONS
■PACKAGE DIMENSIONS
0.10
M
1.28
A
S
0.28
0.397 ± 0.030
1.8
0.62
0.10
1.14
S
0.075
+0.01
0.01 -0.008
S
M
1.60 ± 0.05
S
B
0.31
1.60 ± 0.05
0.05
S
A
1.20 +0.06
-0.04
C0
.2
0.5
0.5
0.26 +0.06
-0.04
Ver.3
+0.06
0.21-0.04
3-
R0
.2
+0.06
0.68 -0.04
B
φ0.05
M
S
AB
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NJU77230/NJU77231/NJU77232
MSOP8(TVSP8)MEET JEDEC MO-187-DA/ thin type
Unit: mm
■PACKAGE DIMENSIONS
2.9 ±0.1
1
0.55 ±0.1
4.0 ±0.2
5
2.8 ±0.1
8
0 ~10゚
4
0.127 +0.05
-0.03
0.65
0.08
0.2 ±0.05
0.05 M
0.1 ±0.05
1.0max
0.475 ±0.1
■EXAMPLE OF SOLDER PADS DIMENSIONS
0.65
3.5
1.0
0.23
1.95
Ver.3
http://www.njr.com/
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NJU77230/NJU77231/NJU77232
DFN8-U1(ESON8-U1)
Unit: mm
■PACKAGE DIMENSIONS
■EXAMPLE OF SOLDER PADS DIMENSIONS
0.28
0.5
2.20
1.02
2.0 ±0.05
0.31
2.0 ±0.05
0.075
0.01 +0.010
-0.008
S
0.397 ±0.03
1.54
1.78
S
S
0.05
A
0.21 -0.04
+0.06
1.6 +0.06
-0.04
0.25
C0
.3
3-
R0
.3
1.08 -0.04
+0.06
B
0.5
0.26 +0.06
-0.04
Ver.3
φ 0.05
M
S
AB
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- 18 -
NJU77230/NJU77231/NJU77232
SOT-23-5
■ PACKING SPEC
Unit: mm
TAPING DIMENSIONS
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
K0
W
W1
Feed direction
P0
φD0
T
B
W1
W
F
E
P2
A
P1
K0
φD1
T2
DIMENSION
3.3±0.1
3.2±0.1
1.55
1.05
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
1.82
1.5±0.1
8.0±0.3
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1MAX
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
A
D
B
C
DIMENSION
φ180±1
φ 60±1
φ 13±0.2
φ 21±0.8
2±0.5
9±0.5
1.2±0.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE1)
Drawing direction
Empty tape
Device attaching tape
more than 20pitch
3000pcs/reel
Empty tape
Covering tape
more than 20pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.3
http://www.njr.com/
- 19 -
NJU77230/NJU77231/NJU77232
SC-88A
Unit: mm
■ PACKING SPEC
TAPING DIMENSIONS
Feed direction
P0
φD0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
W
W1
T
B
W1
W
F
E
P2
A
P1
T2
φD1
DIMENSION
2.3±0.1
2.5±0.1
1.55±0.05
1.05±0.05
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
1.3±0.1
8.0±0.2
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
B
A
D
C
DIMENSION
φ180±1
φ 60±1
φ 13±0.2
φ 21±0.8
2±0.5
9±0.5
1.2±0.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE1)
Drawing direction
Empty tape
Device attaching tape
more than 20pitch
3000pcs/reel
Empty tape
Covering tape
more than 20pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.3
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- 20 -
NJU77230/NJU77231/NJU77232
DFN6-G1(ESON6-G1)
■ PACKING SPEC
Unit: mm
TAPING DIMENSIONS
Feed direction
φD0
P0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
W
W1
T
B
W1
W
F
E
P2
A
φD1
P1
T2
DIMENSION
1.85±0.05
1.85±0.05
1.5 +0.1
0
0.5±0.1
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
0.65±0.05
8.0±0.2
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
B
A
D
C
DIMENSION
0
φ180 -1.5
φ 60 +10
φ 13±0.2
φ 21±0.8
2±0.5
9 +0.3
0
1.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE3)
Feed direction
Empty tape
Devices
more than 40 pitch
3000pcs/reel
Empty tape
Covering tape
more than 25 pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.3
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- 21 -
NJU77230/NJU77231/NJU77232
MSOP8(TVSP8)MEET JEDEC MO-187-DA/thin type
Unit: mm
■PACKING SPEC
TAPING DIMENSIONS
Feed direction
P2
P0
φD0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
W
W1
B
W1
W
F
E
T
A
φD1
P1
T2
DIMENSION
4.4
3.2
1.5 +0.1
0
1.5 +0.1
0
1.75±0.1
5.5±0.05
4.0±0.1
8.0±0.1
2.0±0.05
0.30±0.05
1.75 (MAX.)
12.0±0.3
9.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
C
SYMBOL
A
B
C
D
E
W
W1
A
B
D
E
DIMENSION
φ254±2
φ100±1
φ 13±0.2
φ 21±0.8
2±0.5
13.5±0.5
2.0±0.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE1)
Empty tape
Feed direction
more than 20pitch
Devices
2000pcs/reel
Empty tape
Covering tape
more than 20pitch reel more than 1round
PACKING STATE
Label
Label
Put a reel into a box
Ver.3
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- 22 -
NJU77230/NJU77231/NJU77232
DFN8-U1(ESON8-U1)
Unit: mm
■PACKING SPEC
TAPING DIMENSIONS
Feed direct ion
P0
φD0
SYMBOL
A
B
D0
D1
E
F
P0
P1
P2
T
T2
K0
W
W1
T
B
W1
W
F
E
P2
K0
A
T2
φ D1
P1
DIMENSION
2.25±0.05
2.25±0.05
1.5 +0.1
0
0.5±0.1
1.75±0.1
3.5±0.05
4.0±0.1
4.0±0.1
2.0±0.05
0.25±0.05
1.00±0.07
0.65±0.05
8.0±0.2
5.5
REMARKS
BOTTOM DIMENSION
BOTTOM DIMENSION
THICKNESS 0.1max
REEL DIMENSIONS
W1
SYMBOL
A
B
C
D
E
W
W1
E
B
A
D
C
DIMENSION
0
φ180 -1.5
φ 60 +10
φ 13±0.2
φ 21±0.8
2±0.5
9 +0.3
0
1.2
W
TAPING STATE
Insert direction
Sealing with covering tape
(TE3)
Feed direction
Empty tape
Devices
more than 40 pitch
3000pcs/reel
Empty tape
Covering tape
more than 25 pitch reel more than 1 round
PACKING STATE
Label
Label
Put a reel into a box
Ver.3
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- 23 -
NJU77230/NJU77231/NJU77232
■RECOMMENDED MOUNTING METHOD
*Recommended reflow soldering procedure
f
260℃
e
230℃
220℃
d
180℃
150℃
Room Temp.
a
b
a:Temperature ramping rate
b:Pre-heating temperature
time
c:Temperature ramp rate
d:220℃ or higher time
e:230℃ or higher time
f:Peak temperature
g:Temperature ramping rate
c
g
: 1 to 4℃/s
: 150 to 180℃
: 60 to 120s
: 1 to 4℃/s
: Shorter than 60s
: Shorter than 40s
: Lower than 260℃
: 1 to 6℃/s
*The temperature indicates at the surface of mold package.
■REVISION HISTORY
Ver.3
Date
Revision
Changes
2016/11/30
Ver.0
First edition
2017/5/24
Ver.1
Added information of NJU77232.
2017/10/12
Ver.2
Changed GENERAL DESCRIPTION and APPLICATION
2017/11/10
Ver.3
Corrected ELECTRICAL CHARACTERISTICS
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- 24 -
NJU77230/NJU77231/NJU77232
[ CAUTION ]
1.
New JRC strives to produce reliable and high quality semiconductors. New JRC's semiconductors are intended for
specific applications and require proper maintenance and handling. To enhance the performance and service of New JRC's
semiconductors, the devices, machinery or equipment into which they are integrated should undergo preventative
maintenance and inspection at regularly scheduled intervals. Failure to properly maintain equipment and machinery
incorporating these products can result in catastrophic system failures
2.
The specifications on this datasheet are only given for information without any guarantee as regards either mistakes or
omissions. The application circuits in this datasheet are described only to show representative usages of the product and
not intended for the guarantee or permission of any right including the industrial rights.
All other trademarks mentioned herein are property of their respective companies.
3.
To ensure the highest levels of reliability, New JRC products must always be properly handled.
The introduction of external contaminants (e.g. dust, oil or cosmetics) can result in failures of semiconductor products.
4.
New JRC offers a variety of semiconductor products intended for particular applications. It is important that you select
the proper component for your intended application. You may contact New JRC's Sale's Office if you are uncertain about
the products listed in this catalog.
5.
Special care is required in designing devices, machinery or equipment which demand high levels of reliability. This is
particularly important when designing critical components or systems whose failure can foreseeably result in situations that
could adversely affect health or safety. In designing such critical devices, equipment or machinery, careful consideration
should be given to amongst other things, their safety design, fail-safe design, back-up and redundancy systems, and
diffusion design.
6.
The products listed in the catalog may not be appropriate for use in certain equipment where reliability is critical or where
the products may be subjected to extreme conditions. You should consult our sales office before using the products in any
of the following types of equipment.
Aerospace Equipment
Equipment Used in the Deep sea
Power Generator Control Equipment (Nuclear, Steam, Hydraulic)
Life Maintenance Medical Equipment
Fire Alarm/Intruder Detector
Vehicle Control Equipment (airplane, railroad, ship, etc.)
Various Safety devices
7.
New JRC's products have been designed and tested to function within controlled environmental conditions. Do not use
products under conditions that deviate from methods or applications specified in this catalog. Failure to employ New JRC
products in the proper applications can lead to deterioration, destruction or failure of the products. New JRC shall not be
responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or
misapplication of its products. Products are sold without warranty of any kind, either express or implied, including but not
limited to any implied warranty of merchantability or fitness for a particular purpose.
8.
Warning for handling Gallium and Arsenic(GaAs) Products (Applying to GaAs MMIC, Photo Reflector). This Products
uses Gallium(Ga) and Arsenic(As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do
not burn, destroy, or process chemically to make them as gas or power. When the product is disposed, please follow the
related regulation and do not mix this with general
industrial waste or household waste.
9. The product specifications and descriptions listed in this catalog are subject to change at any time, without notice.
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