HCM1103-R47-R

High Current, High Frequency Power Inductors HALOGEN HF Pb FREE HCM1103 Series Applications • Voltage Regulator Module (VRM) • Multi-phase regulators • Point-of-load modules • Desktop and server VRMs and EVRDs • Base station equipment • Notebook regulators • Battery power systems • Graphics cards Description • Data networking and storage systems • Halogen free, lead free, RoHS compliant Environmental Data • 125°C maximum total temperature operation • Storage temperature range: -55°C to +125 °C • 11.5 x 10.3 x 3.0mm maximum surface mount package • Powder Iron core material • Operating temperature range: -55°C to +125°C (ambient + self-temperature rise) • Magnetically shielded, low EMI • Solder reflow temperature: J-STD-020D compliant • High current carrying capacity, low core losses Packaging • Inductance range from 0.12µH to 22.0µH • Supplied in tape-and reel packaging, 1000 parts per 13” diameter reel • Current range from 3.0 to 75 amps Product Specifications Part Number6 HCM1103-R12-R HCM1103-R36-R HCM1103-R47-R HCM1103-R68-R HCM1103-1R0-R HCM1103-2R2-R HCM1103-3R3-R HCM1103-4R7-R HCM1103-8R2-R HCM1103-100-R HCM1103-150-R HCM1103-220-R OCL1 ±20% (µH) 0.12 0.36 0.47 0.68 1.0 2.2 3.3 4.7 8.2 10.0 15.0 22.0 FLL min.2 (µH) 0.07 0.26 0.33 0.38 0.56 1.2 1.9 2.6 4.6 5.6 8.4 12.3 Irms3 (Amps) 30 23 20 21 15 13 9.0 7.0 5.0 5.0 4.0 3.0 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.25Vrms, 0.0Adc @ 25°C 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.25Vrms, Isat @ 25°C. 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 0612 BU-SB12434 Page 1 of 9 Isat4 @ 25°C (Amps) 75 28 26 23 21 16 14 13 8.5 7.5 6.0 5.0 DCR (mΩ) @ 20°C DCR (mΩ) @ 20°C Typical Maximum 0.55 0.61 1.10 1.30 1.50 2.00 2.90 3.40 5.50 6.00 8.40 9.00 14.5 16.0 20.5 22.5 35.0 38.5 40.0 44.0 59.0 65.0 90.0 99.0 4. Isat: Peak current for approximately 30% rolloff at +25°C 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps). 6. Part Number Definition: HCM1103-xxx-R HCM1103 = Product code and size xxx= Inductance value in µH, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant Data Sheet: 4449 K-Factor5 1200 711 515 510 377 264 230 205 153 141 114 91 Dimensions - mm Top View HCM1103-R36-R & HCM1103-R47-R Top View HCM1103-R12-R & HCM1103-R68-R to HCM1103-220R Side View Bottom View Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros. wwyy = (Date code), R = Revision Level All soldering surfaces to be coplanar within 0.10 millimeters. Tolerances are ±0.3 millimeters unless stated otherwise. HCM1103-R36-R and HCM1103-R47-R Color: Black HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey Packaging Information - mm 1000 Pieces supplied in tape and reel packaging, on a 13” diameter reel. 0612 BU-SB12434 Page 2 of 9 Data Sheet: 4449 Recommended Pad Layout Schematic Temperature Rise vs. Total Loss 6 0 .0 Temperature Rise (°C) 5 0 .0 4 0 .0 HCM1103-R12-R HCM1103-R36-R HCM1103-R47-R 3 0 .0 HCM1103-R68-R HCM1103-1R0-R HCM1103-2R2-R HCM1103-3R3-R 2 0 .0 HCM1103-4R7-R HCM1103-8R2-R HCM1103-100-R HCM1103-150-R 1 0 .0 HCM1103-220-R 0 .0 0 .0 0 .2 0 .4 0 .6 0 .8 Total Loss (W) 0612 BU-SB12434 Page 3 of 9 Data Sheet: 4449 1 .0 1 .2 1 .4 1 .6 Core Loss HCM1103-; R36-R and R47-R Core Loss vs Bp-p 10000 300K 1000 200K 100K Core Loss (mW) 50K 100 25K 10 1 0.1 10 100 1000 10000 Bp-p (Gauss) HCM1103-; R12-R, R68-R through 220-R Core Loss vs Bp-p 10000.0 500K 300K 200K 1000.0 100K Core Loss (mW) 50K 25K 100.0 10.0 1.0 0.1 10 100 1000 Bp-p (Gauss) 0612 BU-SB12434 Page 4 of 9 Data Sheet: 4449 10000 Inductance Characteristics HCM1103- R12-R 110% 100% 90% % of OCL 80% 70% 60% 50% 40% 30% 0 10 20 30 40 50 60 70 80 Idc (Amps) HCM1103-; R36-R, R47-R 110% 100% 90% % of OCL 80% 70% 60% 50% HCM1103-R36-R 40% 30% HCM1103-R47-R 0 5 10 15 20 25 Idc (Amps) 0612 BU-SB12434 Page 5 of 9 Data Sheet: 4449 30 35 40 45 Inductance Characteristics HCM1103-; R68-R, 1R0-R 110% 100% 90% % of OCL 80% 70% 60% 50% HCM1103-R68-R 40% HCM1103-1R0-R 30% 0 5 10 15 20 25 30 Idc (Amps) 35 40 HCM1103-; 2R2-R, 3R3-R 110% 100% 90% % of OCL 80% 70% 60% 50% HCM1103-2R2-R 40% HCM1103-3R3-R 30% 0 2 4 6 8 10 12 14 16 Idc (Amps) 0612 BU-SB12434 Page 6 of 9 Data Sheet: 4449 18 20 22 24 26 Inductance Characteristics HCM1103-4R7-R 110% 100% 90% % of OCL 80% 70% 60% 50% 40% 30% 0 2 4 6 8 10 12 14 16 18 Idc (Amps) HCM1103-; 8R2-R, 100-R 110% 100% 90% % of OCL 80% 70% 60% 50% HCM1103-8R2-R 40% 30% HCM1103-100-R 0 2 4 6 8 Idc (Amps) 0612 BU-SB12434 Page 7 of 9 Data Sheet: 4449 10 12 14 Inductance Characteristics HCM1103-;150-R, 220-R 110% 100% 90% % of OCL 80% 70% 60% 50% HCM1103-150-R 40% 30% HCM1103-220-R 0 2 4 6 8 Idc (Amps) 0612 BU-SB12434 Page 8 of 9 Data Sheet: 4449 10 12 Solder Reflow Profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Package Thickness TL Preheat A Temperature T smax Table 1 - Standard SnPb Solder (T c) t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Tsmin 25°C ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020D Profile Feature Preheat and Soak • Temperature min. (Tsmin) Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C • Temperature max. (Tsmax) 150°C 200°C • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. North America Cooper Electronic Technologies 1225 Broken Sound Parkway NW Boca Raton, FL 33487-3533 Tel: 1-561-998-4100 Fax: 1-561-241-6640 Toll Free: 1-888-414-2645 Cooper Bussmann P.O. Box 14460 St. Louis, MO 63178-4460 Tel: 1-636-394-2877 Fax: 1-636-527-1607 Europe Cooper Electronic Technologies Cooper (UK) Limited Burton-on-the-Wolds Leicestershire • LE12 5TH UK Tel: +44 (0) 1509 882 737 Fax: +44 (0) 1509 882 786 Cooper Electronic Technologies Avda. Santa Eulalia, 290 08223 Terrassa, (Barcelona), Spain Tel: +34 937 362 812 +34 937 362 813 Fax: +34 937 362 719 Asia Pacific Cooper Electronic Technologies 1 Jalan Kilang Timor #06-01 Pacific Tech Centre Singapore 159303 Tel: +65 278 6151 Fax: +65 270 4160 The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications. Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. © 2012 Cooper Bussmann w w w. c o o p e r b u s s m a n n . c o m 0612 BU-SB12434 Page 9 of 9 Data Sheet: 4449