FP1007R6-R47-R

Technical Data 10007 Effective June 2017 Supersedes September 2012 FP1007R6 High frequency, high current power inductors Applications • • • • • • • SMD Device Environmental data • Product features • • • • • • • 10.5 x 8.0 x 7.0mm Maximum surface mount package Ferrite core material Controlled DCR tolerance for sensing circuits Inductance Range from 150nH to 470nH Current range from 23.5 to 75 Amps Frequency range up to 2MHz Halogen free, lead free, RoHS compliant Multi-phase regulators Voltage Regulator Modules (VRMs) Desktop and server VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point-of-Load modules DCR Sensing • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 10007 Effective June 2017 Product Specifications Part Number 7 FP1007R6-R15-R FP1007R6-R18-R FP1007R6-R22-R FP1007R6-R27-R FP1007R6-R33-R FP1007R6-R39-R FP1007R6-R47-R OCL 1 ±10% (nH) 150 180 220 270 330 390 470 FLL 2 Min. (nH) 108 129 158 194 237 280 338 Irms 3 (Amps) 61 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 4. Isat1: Peak current for approximately 20% rolloff at +25°C. Isat 1 4 @25°C (Amps) 75.0 60.0 50.0 41.0 33.0 28.0 23.5 Isat 2 5 @100°C (Amps) 60.0 50.0 40.0 33.0 26.5 22.5 19.0 DCR @20°C (mΩ) K-Factor 0.29 ± 5% 348.8 5. Isat2: Peak current for approximately 20% rolloff at +100°C. 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH), ∆I (peak-to-peak ripple current in Amps). 7. Part Number Definition: FP1007R6-Rxx-R FP1007R6 = Product code and size Rxx= Inductance value in uH, R = decimal point -R suffix = RoHS compliant Dimensions- mm The nominal DCR is measured from point "A" to point "B" Part Marking: 1007R6, Rxx = Inductance value in µH. (R = Decimal point) wwllyy = Date code R = Revision level Tolerance are ±0.15mm unless otherwise specified. Soldering surfaces to be coplanar within 0.1016mm. PCB tolerance ±0.1mm unless otherwise specified. Packaging information - mm 1.5 dia 1.75 11.5 2.0 1.5 dia 4.0 A 1 24.0 ±0.30 2 10.60 8.1 Supplied in Tape-and-Reel packaging, 700 parts per 13 inch diameter reel. 12.0 A 7.1 SECTION A-A 2 www.eaton.com/electronics 6 FP1007R6 High frequency, high current power inductor Technical Data 10007 Effective June 2017 Temperature rise vs total loss 60 Temperature Rise (°C) 50 40 30 20 10 0 0 .0 0 .4 0 .8 1 .2 1 .6 2 .0 Total Loss (W) Core loss vs Bp-p 1MHz 500kHz 10 300kHz 200kHz 100kHz Core Loss (W) 1 0 .1 0 .0 1 0 .0 0 1 0 .0 0 0 1 0 .0 0 0 0 1 100 1000 10000 Bp-p (Gauss) Inductance characteristics % of OCL vs. Isat1 100% 80% % of OCL 60% 40% -40°C +100°C +25°C 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% % of Isat1 www.eaton.com/electronics 3 FP1007R6 High frequency, high current power inductor Technical Data 10007 Effective June 2017 Solder Reflow Profile TP tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL 25°C Preheat A T smax t TC -5°C Table 1 - Standard SnPb Solder (Tc) Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin ts Package Thickness 2.5mm Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 10007 BU-SB12795 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.