Technical Data 10007
Effective June 2017
Supersedes September 2012
FP1007R6
High frequency, high current power inductors
Applications
•
•
•
•
•
•
•
SMD Device
Environmental data
•
Product features
•
•
•
•
•
•
•
10.5 x 8.0 x 7.0mm Maximum surface mount
package
Ferrite core material
Controlled DCR tolerance for sensing circuits
Inductance Range from 150nH to 470nH
Current range from 23.5 to 75 Amps
Frequency range up to 2MHz
Halogen free, lead free, RoHS compliant
Multi-phase regulators
Voltage Regulator Modules (VRMs)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
DCR Sensing
•
•
Storage temperature range (component):
-40 °C to +125 °C
Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
Solder reflow temperature:
J-STD-020 (latest revision) compliant
Pb HF
FREE
HALOGEN
Technical Data 10007
Effective June 2017
Product Specifications
Part
Number 7
FP1007R6-R15-R
FP1007R6-R18-R
FP1007R6-R22-R
FP1007R6-R27-R
FP1007R6-R33-R
FP1007R6-R39-R
FP1007R6-R47-R
OCL 1 ±10%
(nH)
150
180
220
270
330
390
470
FLL 2 Min.
(nH)
108
129
158
194
237
280
338
Irms 3
(Amps)
61
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of
other heat generating components will affect the temperature rise. It is recommended that
the temperature of the part not exceed 125°C under worst case operating conditions
verified in the end application.
4. Isat1: Peak current for approximately 20% rolloff at +25°C.
Isat 1 4 @25°C
(Amps)
75.0
60.0
50.0
41.0
33.0
28.0
23.5
Isat 2 5 @100°C
(Amps)
60.0
50.0
40.0
33.0
26.5
22.5
19.0
DCR @20°C
(mΩ)
K-Factor
0.29 ± 5%
348.8
5. Isat2: Peak current for approximately 20% rolloff at +100°C.
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L
* ∆I * 10-3. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in nH),
∆I (peak-to-peak ripple current in Amps).
7. Part Number Definition: FP1007R6-Rxx-R
FP1007R6 = Product code and size
Rxx= Inductance value in uH, R = decimal point
-R suffix = RoHS compliant
Dimensions- mm
The nominal DCR is measured from point "A" to point "B"
Part Marking: 1007R6, Rxx = Inductance value in µH. (R = Decimal point) wwllyy = Date code R = Revision level Tolerance are
±0.15mm unless otherwise specified.
Soldering surfaces to be coplanar within 0.1016mm.
PCB tolerance ±0.1mm unless otherwise specified.
Packaging information - mm
1.5 dia
1.75
11.5
2.0
1.5 dia
4.0
A
1
24.0
±0.30
2
10.60
8.1
Supplied in Tape-and-Reel packaging, 700 parts per 13 inch diameter reel.
12.0
A
7.1
SECTION A-A
2
www.eaton.com/electronics
6
FP1007R6
High frequency, high current power inductor
Technical Data 10007
Effective June 2017
Temperature rise vs total loss
60
Temperature Rise (°C)
50
40
30
20
10
0
0 .0
0 .4
0 .8
1 .2
1 .6
2 .0
Total Loss (W)
Core loss vs Bp-p
1MHz 500kHz
10
300kHz
200kHz
100kHz
Core Loss (W)
1
0 .1
0 .0 1
0 .0 0 1
0 .0 0 0 1
0 .0 0 0 0 1
100
1000
10000
Bp-p (Gauss)
Inductance characteristics
% of OCL vs. Isat1
100%
80%
% of OCL
60%
40%
-40°C
+100°C
+25°C
20%
0%
0%
20%
40%
60%
80%
100%
120%
140%
160%
% of Isat1
www.eaton.com/electronics
3
FP1007R6
High frequency, high current power inductor
Technical Data 10007
Effective June 2017
Solder Reflow Profile
TP
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
Temperature
TL
25°C
Preheat
A
T smax
t
TC -5°C
Table 1 - Standard SnPb Solder (Tc)
Volume
mm3
220°C
220°C
Table 2 - Lead (Pb) Free Solder (T c)
Tsmin
ts
Package
Thickness
2.5mm
Time 25°C to Peak
Volume
mm3
2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020
Profile Feature
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
Lead (Pb) Free Solder
150°C
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. 10007 BU-SB12795
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
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