FP1109-R33-R

Technical Data 4350 Effective June 2017 Supersedes June 2011 FP1109 High frequency, high current power inductors Applications • • • • • • • SMD Device Environmental data • Product features • • • • • • • 11.2 x 11.2 x 9.0mm maximum surface mount package Ferrite core material High current carrying capacity, low core losses Controlled DCR tolerance for sensing circuits Inductance range from 205nH to 950nH Current range from 11.5 to 69 amps Frequency range up to 2MHz Multi-phase regulators Voltage Regulator Module (VRM) Desktop and server VRMs and EVRDs Data networking and storage systems Graphics cards and battery power systems Point-of-load modules DCR sensing • • Storage temperature range (component): -40 °C to +125 °C Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) Solder reflow temperature: J-STD-020 (latest revision) compliant Pb HF FREE HALOGEN  Technical Data 4350 Effective June 2017 Product Specifications Part Number7 OCL1 ± 20% (nH) FLL2 Min. (nH) FP1109-R20-R FP1109-R23-R FP1109-R27-R FP1109-R33-R FP1109-R47-R FP1109-R58-R FP1109-1R0-R 205 247 270 311 463 548 950 122 147 160 185 275 325 565 Irms3 (Amps) Isat14 @ 25°C (Amps) Isat25 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor6 69 52 233 55 41 233 51 38 233 35 44 33 0.42 ±10% 233 27 20 233 22.5 17 233 11.5 8.5 233 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1 4 Isat1: Peak current for approximately 30% rolloff at +25°C. 3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions verified in the end application. 6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3, Bp-p : (Gauss), 5 Isat2: Peak current for approximately 30% rolloff at +125°C. K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps). 7 Part Number Definition: FP1109-xxx-R • FP1109 = Product code and size • xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros • “-R” suffix = RoHS compliant Dimensions- mm F ront V iew T op V iew R ecom m ended P ad Layout S ide V iew S chem atic F P 1 1 0 9 -xxx w w llyy R 2 9.0 m ax 4.10 ref (2X ) 2.03 ref 2.5 nom . (2x) 11.2 m ax 2 1 3.0 (2X ) 11.2 m ax Part Marking: FP1109 1 3.0 (2X ) 11.4 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level Packaging information - mm 4.00 1.5 dia. +0.1/-0.0 Section A-A 2.00 1.75 1.5 dia. min 1 11.50 wwllyy R FP1109-xxx 17.5 11.4 24.0 ±0.3 2 9.3 11.4 16.4 Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel. 2 www.eaton.com/electronics 2.0 20.00 User direction of feed FP1109 High frequency, high current power inductor Technical Data 4350 Effective June 2017 Temperature rise vs total loss 50 Tem perature R ise (°C ) 40 30 20 10 0 0 0 .2 0 .4 0 .6 0 .8 1 1 .2 1 .4 1 .6 T o tal Lo ss (W ) Core loss vs Bp-p 1MHz 100 500kHz 300kHz 200kHz 10 100kHz Core Loss (W) 1 0.1 0.01 0.001 0.0001 0.00001 100 1000 10000 Bp-p (Gauss) Inductance characteristics % o f O C L v s . % o f Is a t 1 120% 100% % of OCL 80% - 4 0 °C 60% 40% +2 5 °C +1 2 5 °C 20% 0% 0% 20% 40% 60% 80% 100% 120% % o f Is a t 1 www.eaton.com/electronics 3 FP1109 High frequency, high current power inductor Technical Data 4350 Effective June 2017 Solder Reflow Profile TP TC -5°C Temperature TL 25°C Preheat A T smax Table 1 - Standard SnPb Solder (Tc) tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s t Volume mm3 220°C 220°C Table 2 - Lead (Pb) Free Solder (T c) Tsmin Package Thickness 2.5mm ts Time 25°C to Peak Volume mm3 2000 260°C 245°C 245°C Time Reference JDEC J-STD-020 Profile Feature Preheat and Soak • Temperature min. (Tsmin) • Temperature max. (Tsmax) • Time (Tsmin to Tsmax) (ts) Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (Tc) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Standard SnPb Solder 100°C Lead (Pb) Free Solder 150°C 150°C 200°C 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 60-150 Seconds 217°C 60-150 Seconds Table 1 Table 2 20 Seconds** 30 Seconds** 6°C/ Second Max. 6°C/ Second Max. 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4350 BU-SB11642 June 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners.