DR1030-100-R

Technical Data 4132 Effective April 2016 Supersedes March 2007 DR1030 Shielded power inductors Applications • LED/LCD backlighting • High definition televisions (HDTV) • Server and desktop power supplies • Portable electronics • Notebook and laptop regulators • Graphics cards and battery powered systems • Point-of-load (POL) modules • Printers and peripherals Environmental Data Description • Shielded drum core • Inductance range from 1.1 μH to 155 μH • Current range from 0.68 A to 9.5 A • 10.5 mm x 10.3 mm footprint surface mount package in a 3.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant • Storage temperature range (Component): -40 °C to +125 °C • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020D compliant HALOGEN Pb HF FREE DR1030 Shielded power inductors  Technical Data 4132 Effective April 2016 Product Specifications OCL1 (μH) ±30% Irms2 (A) Isat3 (A) DCR (mΩ) typical @ 20°C DCR (mΩ) maximum @ 20°C K-factor4 DR1030-1R1-R 1.1 7.0 9.5 6.5 7.9 22 DR1030-1R8-R 1.9 5.9 7.4 9.1 11.0 17 DR1030-2R8-R 2.8 5.1 6.08 12.1 14.5 14 DR1030-3R9-R 4.0 4.3 5.1 16.4 20.0 12 DR1030-5R2-R 5.2 3.7 4.75 22.9 27.5 10 DR1030-6R8-R 6.8 3.5 3.9 24.9 30.0 9 DR1030-8R2-R 8.4 3.3 3.54 28.4 34.1 8 DR1030-100-R 10.4 2.8 3.18 40.2 48.0 7 DR1030-150-R 14.8 2.3 2.66 57.3 68.8 6 DR1030-220-R 22.8 1.8 2.19 95.5 115 5 DR1030-330-R 32.4 1.6 1.81 114 136 4 DR1030-470-R 47.9 1.3 1.52 167 200 3.4 DR1030-680-R 67 1.1 1.24 253 304 2.9 DR1030-820-R 82 1.0 1.14 332 382 2.6 DR1030-101-R 100 0.86 1.05 375 450 2.4 DR1030-121-R 119 0.80 0.95 523 602 1.9 DR1030-151-R 155 0.68 0.86 590 700 1.4 Part Number 5 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 2. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 35% rolloff @ +25 °C 4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mT), K: (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps).. 5. Part Number Definition: DR1030-xxx-R DR1030 = Product code and size -xxx= inductance value in μH, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimensions (mm) Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes. wwlly = date code, R = revision level Do not route traces or vias underneath the inductor 2 www.eaton.com/elx DR1030 Shielded power inductors Technical Data 4132 Effective April 2016  Packaging information (mm) Supplied in tape and reel packaging , 1000 parts per 13” diameter reel Temperature rise vs. total loss 160 140 Temperature Rise (°C) 120 100 80 60 40 20 0 0.00 0.20 0.40 0.60 0.80 1.00 1.20 Total Loss (W) www.eaton.com/elx 3 DR1030 Shielded power inductors  Technical Data 4132 Effective April 2016 Core loss vs. Bp-p  N+] 0+]  N+] N+] N+] Core Loss (W)         Bp-p (mT) Inductance characteristics % of OCL vs. % of Isat 120% 100% % of OCL 80% 60% -40 °C +25 °C +85 °C 40% 20% 0% 0% 20% 40% 60% % of Isat 4 www.eaton.com/elx 80% 100% 120% DR1030 Shielded power inductors Technical Data 4132 Effective April 2016  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3