SM2511-6R8MHF

SM2511 Series 1. Features of SM2511 series: • 7.30 x 6.80 mm foot Print, 3.00mm Max. height SMD Power Inductor for high frequency application. Operating frequency up to 3MHz. • Inductance range from 0.10uH to 10.00uH. Custom values are welcomed. • High saturation current characteristics by distributed gapped metal dust core. • Ideal for portable device, Pad, E-reader and high density DC to DC Converter. • Operating Temperature Range: -55˚C to 125˚C . • T & R Qtys: 1000 pcs , 13'' Reel and Plastic tape: 16mm wide, 12mm pocket spacing. • RoHS and HF compliant. 2. Electrical Characteristics of SM2511 series: A± 0.30 B± 0.20 C Max. D± 0.30 E± 0.30 7.00 6.60 3.00 3.00 1.60 DCR DCR Isat 2 Irms 3 (uH) (mΩ) Typ. (mΩ) Max. (A) (A) ±20% @25℃ @25℃ @25℃ @25℃ SM2511-R10MHF 0.10 1.50 1.70 60.00 32.50 SM2511-R22MHF 0.22 2.50 2.80 40.00 23.00 SM2511-R33MHF 0.33 3.50 3.90 30.00 20.00 SM2511-R47MHF 0.47 4.00 4.20 26.00 17.50 SM2511-R68MHF 0.68 5.00 5.50 25.00 15.50 SM2511-R82MHF 0.82 6.70 8.00 24.00 13.00 SM2511-1R0MHF 1.00 9.00 10.00 22.00 11.00 SM2511-1R5MHF 1.50 14.00 15.00 18.00 9.00 SM2511-2R2MHF 2.20 18.00 20.00 14.00 8.00 SM2511-3R3MHF 3.30 28.00 30.00 13.50 6.00 SM2511-4R7MHF 4.70 37.00 40.00 10.00 5.50 SM2511-6R8MHF 6.80 54.00 60.00 8.00 4.50 G 3.71 Typ. SM2511-8R2MHF 8.20 64.00 68.0 7.50 4.00 H 3.43 Typ. SM2511-100MHF 10.00 102.00 105.00 7.00 3.00 OCL ITG Part Number 1 3. Mechanical Dimensions (unit: mm): E A B xxx YWWx D Top View Bottom View Part Marking: xxx: Inductance value in uH(R:decimal point). YWWx:Y is Year Code, WW: Week , x is Special Code. C Front View Pad Dimension SM2511 F 7.37 Typ. F H Notes: 1. Test conditions: 100KHz, 1.0V, 25˚C ambient temperature . G Recommend PCB Layout 2. Isat: DC current that causes inductance to drop 20%(Typ.) from OCL (Ta=25℃). 3. Irms: DC current for an approximate temperature rise of 40℃ without core loss. Derating is necessary for AC currents. PCB pad layout,trace thickness and width,air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions as verified in the end application. ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM2511 Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SM2511 Series : 0.040 60 40 0.020 20 0.000 0 0 10 20 30 40 50 60 70 80 TEMP RISE(℃) 0.132 0.088 0.044 20 0.000 0 0 10 TEMP RISE(℃) 0.198 INDUCTANCE(μH) 0.132 100 0.470 20 80 0.376 60 40 0.066 20 0.000 0 0 5 10 15 20 25 30 35 40 45 0.282 TEMP RISE(℃) 0.408 INDUCTANCE(μH) 0.272 0.188 ● 80 60 40 0.000 0 80 0.656 60 40 0.000 0 DC Current (Amp.) 100 20 0.820 20 5 10 15 20 25 30 35 40 70 0.094 100 0.136 0 60 INDUCTANCE(μH) 0 5 10 15 20 25 30 35 40 45 SM2511-R82MHF INDUCTANCE(μH) INDUCTANCE(μH) 0.544 50 DC Current (Amp.) TEMP RISE(℃) SM2511-R68MHF 40 TEMP RISE(℃) DC Current (Amp.) 0.680 30 SM2511-R47MHF INDUCTANCE(μH) INDUCTANCE(μH) 0.264 40 DC Current (Amp.) TEMP RISE(℃) SM2511-R33MHF 60 INDUCTANCE(μH) DC Current (Amp.) 0.330 80 TEMP RISE(℃) INDUCTANCE(μH) 0.176 100 TEMP RISE(℃) 0.060 80 SM2511-R22MHF 100 80 TEMP RISE(℃) TEMP RISE(℃) 0.220 INDUCTANCE(μH) INDUCTANCE(μH) 0.080 100 TEMP RISE(℃) SM2511-R10MHF 0.100 TEMP RISE(℃) 0.492 60 INDUCTANCE(μH) 0.328 40 0.164 20 0.000 0 0 5 10 15 20 25 30 35 DC Current (Amp.) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM2511 Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SM2511 Series : 0.40 60 40 0.20 20 0.00 0 0 3 6 9 12 15 18 21 24 27 30 TEMP RISE(℃) 0.90 0.60 0.30 20 0.00 0 0 3 TEMP RISE(℃) 1.32 INDUCTANCE(μH) 0.88 100 3.30 6 9 12 15 18 21 24 27 80 2.64 60 40 0.44 20 0.00 0 0 2 4 6 8 10 12 14 16 18 20 SM2511-3R3MHF INDUCTANCE(μH) INDUCTANCE(μH) 1.76 1.98 TEMP RISE(℃) 2.82 INDUCTANCE(μH) 1.88 1.32 20 0.00 0 80 5.44 60 40 0.00 0 4 6 8 10 12 14 16 DC Current (Amp.) ● 6.80 20 2 40 0.66 100 0.94 0 60 INDUCTANCE(μH) 0 2 4 6 8 10 12 14 16 18 20 SM2511-6R8MHF INDUCTANCE(μH) INDUCTANCE(μH) 3.76 80 DC Current (Amp.) TEMP RISE(℃) SM2511-4R7MHF 100 TEMP RISE(℃) DC Current (Amp.) 4.70 40 DC Current(Amp.) TEMP RISE(℃) SM2511-2R2MHF 60 INDUCTANCE(μH) DC Current(Amp.) 2.20 80 TEMP RISE(℃) INDUCTANCE(μH) 1.20 100 TEMP RISE(℃) 0.60 80 SM2511-1R5MHF 100 80 TEMP RISE(℃) TEMP RISE(℃) 1.50 INDUCTANCE(μH) INDUCTANCE(μH) 0.80 100 TEMP RISE(℃) SM2511-1R0MHF 1.00 TEMP RISE(℃) 4.08 60 INDUCTANCE(μH) 2.72 40 1.36 20 0.00 0 0 2 4 6 8 10 12 14 DC Current (Amp.) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM2511 Series 4. Inductance vs. Current vs. Temperature Rise Characteristics of SM2511 Series : 40 1.64 20 0.00 0 0 1 2 3 4 5 6 7 DC Current (Amp.) ● 8.00 60 INDUCTANCE(μH) 3.28 80 8 9 SM2511-100MHF 100 80 TEMP RISE(℃) TEMP RISE(℃) 4.92 10.00 INDUCTANCE(μH) INDUCTANCE(μH) 6.56 100 TEMP RISE(℃) SM2511-8R2MHF 8.20 TEMP RISE(℃) 6.00 60 INDUCTANCE(μH) 4.00 40 2.00 20 0.00 0 0 1 2 3 4 5 6 7 8 9 DC Current (Amp.) ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM2511 Series 5.PACKAGE SPECIFICATION.(UNIT:mm): (1).ENCAPSOLATION MODE: P0 P2 P1 E1 D0 D1 F Marking TOP VIEW T W B0 A0 K0 User Direction of Feed BOTTOM VIEW (2).DIMENSION(mm): W A0 B0 K0 P1 P0 16.0±0.30 7.20±0.10 7.50±0.10 3.6±0.15 12.0±0.10 4.0±0.10 (3).REEL SIZE: P2 D0 D1 F 2.0±0.10 1.5±0.10 1.5±0.10 E1 T 7.5±0.10 1.75±0.10 0.31±0.10 (4).PACKAGE MODE: (5).PACKAGING LIST: No. Packing Part Dimension (mm) Material Quantity 1 2 Reel Bag 330 450 X 360 X 0.075 Plastic Plastic 1000PCS / Reel 1Reel / Bag 3 Small Box 340 X 335 X 45 Paper 2Bag / Small Box 4 Middle Box 356 X 350 X 226 Paper 4Small Boxes / Middle Box 5 Outer Box 378 X 362 X 252 Paper 1Middle Box / Outer Box (6).WEIGHT: N.W: 0.76 g/pcs (APPROX), TOTAL 6.16 Kg(APPROX),G.W:TOTAL 9.16Kg (APPROX). (7).Storage conditions: -40℃~85℃ ,75%RH (Max.). ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM2511 Series 6.RELIABILITY TEST: 6.1 Mechanical Reliability Item Specification and Requirement Test Method and Remarks Solderability According to J-STD-002 Method D category 3 The surface of terminal immersed shall be 1. Preheating: 160 ± 10 ℃ minimum of 95% covered with a new coating 2.Solder: Sn96.5Ag3.0Cu0.5/Sn95.5Ag3.8Cu0.7, Flux: Rosin. of solder 3. Retention time: 255 ± 5 ℃ for 5 ± 0.5 seconds Resistance to Soldering Heat Inductance change: Within ±10% Without mechanical damage such as break According to MIL-STD-202 Method 210F condition J 1.Solder: 99.3%Sn/0.7%Cu 2.Reflow Peak 235 ± 5℃(30±5s)/Time above 183℃(90~120s) Inductance change: Within ± 10% Without mechanical damage such as break According to MIL-STD-202 Method 204D 5g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8"X5" PCB, .031" thick, 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10-2000 Hz. Inductance change: Within ±10% Without mechanical damage such as break According to MIL-STD-202 Method 213B 1. Peak value: 100 G 2. Duration of pulse: 11ms 3. 3 times in each positive and negative direction of 3 mutual perpendicular directions. Thermal Shock Inductance change: Within ± 10% Without distinct damage in appearance According to JESD22-A104C or MIL-STD-202 Method 107G 1. Repeat 100 cycles as follow: (-55 ± 2 ℃; 30 ± 3 min) →(Room temp., 5 min) → (+125 ± 2 ℃, 30 ± 3 min) → (Room temp., 1 min) 2. Recovery: 48 + 4 / -0 hours of recovery under the standard condition after the test. High Temperature & Humidity Inductance change: Within ± 10% Without distinct damage in appearance According to MIL-STD-202 Method 103B 240 hours 85°C/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion. Low Temperature Store Inductance change: Within ± 10% Without distinct damage in appearance According to JESD22-A119A or IEC68-2-1 Method A(Ad) Store temperature: -55 ± 2 ℃,1000 + 4 / -0 hours High Temperature Store Inductance change: Within ± 10% Without distinct damage in appearance According to MIL-STD-202 Method 108A Store temperature: +125 ± 2 ℃,1000 + 4 / -0 hours Vibration Shock 6.2 Endurance Reliability ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase. SM2511 Series Soldering Reflow Chart Solder Reflow Profile: Reference JEDEC J-STD-020E: ● ● New York 1 914 347 2474 ● Taipei 886 2 2698 8669 ● Kaohsiung 886 7 350 2275 Japan 81 568 85 2830 ● Shenzhen 86 755 8418 6263 ● Shanghai 86 21 5424 5141 ● Hong Kong 852 9688 9767 ● sales@ITG-Electronics.com ● www.ITG-Electronics.com Revision E.0: August 18 , 2020 *Due to continuous product improvement, all specifications are subject to change without prior notice. Kindly contact an ITG field application engineer or a sales representative prior to purchase.